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ADBF539WBBCZ4F8XX

Analog Devices

ADBF539WBBCZ4F8XX by Analog Devices

Analog Devices' ADBF539WBBCZ4F8XX is a 316-terminal DSP with 16-bit external data bus, 50 MHz clock frequency, and operates at -40 to 85°C. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 3,658 parts In-Stock

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Digiode

USA . 198 parts In-Stock

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AZTECH Wire

Italy . 598 parts In-Stock

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$7.371

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$7.371

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Semicontronic

India . 281 parts In-Stock

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$12.000

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$11.700

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$11.640

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Corohmni

South Africa . 45 parts In-Stock

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$18.499

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One Stop Electronics

USA . 1,199 parts In-Stock

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$33.000

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Parana Technologies

USA . 1,753 parts In-Stock

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$77.232

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$71.826

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IDEA Electronic Components Group

UK . 216 parts In-Stock

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$83.045

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$78.893

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DigiPath Technology Company

USA . 83 parts In-Stock

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$129.550

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$124.368

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Northwest PG Solutions

USA . 1,700 parts In-Stock

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$3.469

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Native Components

USA . 595 parts In-Stock

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Corphita

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Overview

Elevate your digital signal processing capabilities with the ADBF539WBBCZ4F8XX from Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability in their products. This DSP is perfect for a wide range of applications, offering unparalleled performance and efficiency. Experience the value and benefits of this advanced technology, providing you with the competitive edge you need. Upgrade to the ADBF539WBBCZ4F8XX today and unlock a world of possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options.

Address Bus Width: 19

Enables efficient data processing and memory addressing capabilities.

Package Shape: SQUARE

Optimizes space utilization on circuit boards.

No. of Terminals: 316

Provides ample connectivity options for various external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the overall performance and reliability of the DSP.

Minimum Supply Voltage: 2.7 V

Allows for operation at lower power levels while maintaining functionality.

Maximum Operating Temperature: 85 °C

Ensures reliable operation even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Ideal for use in a wide range of temperature conditions.

Terminal Position: BOTTOM

Facilitates easy and secure connections to the circuit board.

Maximum Seated Height: 1.7 mm

Promotes a compact design and space-saving installation.

Width: 17 mm

Allows for efficient integration into various electronic devices.

Boundary Scan: YES

Facilitates the testing and debugging of the DSP during production.

External Data Bus Width: 16

Provides ample bandwidth for data transfer between the DSP and external devices.

Maximum Clock Frequency: 50 MHz

Enables fast data processing and real-time signal handling.

Internal Bus Architecture: MULTIPLE

Enhances data transfer efficiency and overall performance of the DSP.

Length: 17 mm

Contributes to the compact design of the DSP.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial settings with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Offers versatile functionality for various digital signal processing applications.

Technology: CMOS

Provides low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Facilitates reliable electrical connections and soldering to the circuit board.

Nominal Supply Voltage: 3.3 V

Standard voltage level for compatibility with common power sources.

Terminal Pitch: 0.8 mm

Enables high-density mounting on the circuit board for space efficiency.

Format: FIXED POINT

Provides precise and consistent data processing capabilities for accurate results.

Low Power Mode: YES

Allows for energy-efficient operation to prolong battery life in portable devices.

Barrel Shifter: YES

Enhances data manipulation capabilities for complex signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) ADBF539WBBCZ4F8XX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

19

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B316

Length:

17 mm

Low Power Mode:

YES

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

ADBF539WBBCZ4F8XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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