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ADBF533WYBCZ4XX

Analog Devices

ADBF533WYBCZ4XX by Analog Devices

Analog Devices ADBF533WYBCZ4XX is a 160-terminal DSP with 16-bit external data bus, 40 MHz clock frequency, and low power mode. Ideal for industrial applications requiring fixed-point format processing in a compact square package with bottom terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,734 parts In-Stock

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Digiode

USA . 172 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 361 parts In-Stock

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$10.728

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361

$10.728

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One Stop Electronics

USA . 1,074 parts In-Stock

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$14.000

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Semicontronic

India . 1,634 parts In-Stock

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$22.000

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$21.450

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$21.340

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$22.000

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Parana Technologies

USA . 127 parts In-Stock

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$50.433

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$46.903

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127

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$46.903

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IDEA Electronic Components Group

UK . 1,810 parts In-Stock

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$54.229

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$51.518

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Corohmni

South Africa . 57 parts In-Stock

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$76.208

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DigiPath Technology Company

USA . 438 parts In-Stock

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$84.597

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$81.213

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$81.213

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$81.213

Northwest PG Solutions

USA . 1,151 parts In-Stock

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Native Components

USA . 370 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the ADBF533WYBCZ4XX by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers top-notch quality and reliability. This DSP is perfect for a wide range of applications, offering unparalleled performance and versatility. Whether you're in the automotive, aerospace, or consumer electronics industry, this product provides value, efficiency, and innovation. Elevate your projects to new heights with the ADBF533WYBCZ4XX and experience the difference that Analog Devices brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and protection for the DSP, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.45 V

Higher maximum supply voltage allows for flexibility in power requirements and compatibility with different systems.

Address Bus Width: 19

Wider address bus width enables the DSP to handle larger amounts of data efficiently, enhancing processing capabilities.

Package Shape: SQUARE

Square package shape provides a compact design, saving space in electronic devices and allowing for more efficient layout.

No. of Terminals: 160

Higher number of terminals allow for more connections and interfaces, expanding the DSP's versatility and range of applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design enhances thermal performance, signal integrity, and overall reliability.

Minimum Supply Voltage: 0.95 V

Lower minimum supply voltage enables energy efficiency and lower power consumption, making the DSP more cost-effective and environmentally friendly.

Maximum Operating Temperature: 105 °C

High maximum operating temperature tolerance ensures reliable performance in harsh environments and industrial applications.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold conditions without compromising functionality.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier and more secure soldering during assembly, ensuring stable connections.

Maximum Seated Height: 1.7 mm

Low maximum seated height contributes to a slim profile and space-saving design for the DSP in compact electronic devices.

Width: 12 mm

Moderate width dimension provides a balance between compactness and space for efficient placement on circuit boards.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during the manufacturing and maintenance processes.

External Data Bus Width: 16

External data bus width of 16 enhances data transfer speed and efficiency for improved processing performance.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency allows for fast and responsive signal processing, suitable for demanding real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capabilities, optimizing performance for complex tasks.

Length: 12 mm

Moderate length dimension provides a balance between compactness and space for efficient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in challenging industrial environments with fluctuating temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Diverse peripheral IC type options expand the DSP's compatibility and connectivity with various input/output devices for versatile applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing energy efficiency and performance of the DSP.

Terminal Form: BALL

Ball terminal form provides secure connections and facilitates efficient soldering, ensuring reliability and longevity of the DSP.

Nominal Supply Voltage: 1.2 V

Moderate nominal supply voltage provides a balance between power efficiency and performance for optimal operation of the DSP.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting and compact layout on circuit boards, maximizing space utilization.

Format: FIXED POINT

Fixed-point format offers simplicity and efficiency in arithmetic operations, suitable for many digital signal processing applications.

Low Power Mode: YES

Low power mode feature enhances energy efficiency and prolongs battery life, making the DSP suitable for portable and battery-powered devices.

Barrel Shifter: YES

Inclusion of barrel shifter allows for efficient shifting and rotation operations, improving computational efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) ADBF533WYBCZ4XX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

19

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B160

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

160

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

1.45 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADBF533WYBCZ4XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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