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ADBF532WYBCZ4XX

Analog Devices

ADBF532WYBCZ4XX by Analog Devices

Analog Devices' ADBF532WYBCZ4XX is a DSP with 16-bit external data bus, 40 MHz clock frequency, and 19-bit address bus width. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 7,442 parts In-Stock

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Digiode

USA . 411 parts In-Stock

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411

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AZTECH Wire

Italy . 880 parts In-Stock

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$19.735

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$19.735

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One Stop Electronics

USA . 869 parts In-Stock

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$28.000

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$28.000

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Semicontronic

India . 1,401 parts In-Stock

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$30.000

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$29.250

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$29.100

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Corohmni

South Africa . 605 parts In-Stock

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$38.438

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Parana Technologies

USA . 3,436 parts In-Stock

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$79.381

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$73.824

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IDEA Electronic Components Group

UK . 2,282 parts In-Stock

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$85.356

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$81.088

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DigiPath Technology Company

USA . 3,436 parts In-Stock

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$133.155

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$127.829

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Northwest PG Solutions

USA . 1,790 parts In-Stock

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$4.263

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Native Components

USA . 509 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge digital signal processing with the ADBF532WYBCZ4XX by Analog Devices. As a trusted manufacturer in the industry, Analog Devices delivers top-of-the-line quality and reliability. This DSP offers a wide range of applications, providing unparalleled performance and efficiency. With a compact design and advanced features, this product is perfect for industrial-grade projects that demand precision and speed. Elevate your project to the next level with the ADBF532WYBCZ4XX and experience the value and benefits it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and reliability for the product, making it ideal for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the product onto circuit boards, saving time and cost.

Maximum Supply Voltage: 1.45 V

Higher maximum supply voltage provides flexibility in power requirements and can support a wider range of applications.

Address Bus Width: 19

A large address bus width allows for efficient data addressing and processing capabilities, enhancing the performance of the DSP.

Package Shape: SQUARE

Square package shape is space-efficient and can easily fit into compact electronic devices.

No. of Terminals: 160

Higher number of terminals enable more connectivity options and integration with other electronic components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style offers high density and reliability, making it suitable for applications requiring compact design and high performance.

Minimum Supply Voltage: 0.95 V

Lower minimum supply voltage allows for energy efficiency and supports low power consumption.

Maximum Operating Temperature: 105 °C

Wide maximum operating temperature range ensures the DSP can perform reliably in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures the DSP can operate in extreme cold conditions without performance degradation.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting onto circuit boards, ensuring proper connectivity.

Maximum Seated Height: 1.7 mm

Low maximum seated height enables the DSP to be used in slim and compact electronic devices without compromising on performance.

Width: 12 mm

Compact width size allows for easy integration into electronic circuits and devices with limited space.

Boundary Scan: YES

Boundary scan feature allows for easier testing and debugging of the DSP during manufacturing and maintenance.

External Data Bus Width: 16

A wide external data bus width enables fast data transfer and processing capabilities, enhancing the overall performance of the DSP.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency enables fast data processing and execution of operations, making the DSP suitable for high-speed applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data routing and processing efficiency, improving overall performance of the DSP.

Length: 12 mm

Compact length size allows for easy integration into electronic circuits and devices with limited space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures the DSP can operate reliably in harsh industrial environments without overheating or performance issues.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed as a digital signal processor, this peripheral IC type provides optimized processing capabilities for digital signal applications.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making the DSP energy efficient and suitable for portable or battery-powered devices.

Terminal Form: BALL

Ball terminal form ensures secure and reliable connectivity with other electronic components, enhancing overall product reliability and performance.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent power delivery to the DSP, enhancing its performance and reliability.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting of the DSP onto circuit boards, saving space and enabling compact design.

Format: FIXED POINT

Fixed-point format provides precise processing capabilities for numerical calculations and data manipulation, making the DSP suitable for various applications.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation, prolonging battery life and reducing overall power consumption.

Barrel Shifter: YES

Presence of a barrel shifter allows for efficient data manipulation and processing, enhancing the overall performance of the DSP in handling complex operations.

Technical Specifications

Digital Signal Processors (DSPs) ADBF532WYBCZ4XX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

19

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B160

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

160

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

1.45 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADBF532WYBCZ4XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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