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ADBF512WBBCZ4XX

Analog Devices

ADBF512WBBCZ4XX by Analog Devices

Analog Devices ADBF512WBBCZ4XX is a 168-terminal DSP with 16-bit external data bus, clocking at 400 MHz. Ideal for industrial applications, it operates b/w -40 to 85 °C and features low power mode with barrel shifter for efficient processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,809 parts In-Stock

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7,809

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Digiode

USA . 222 parts In-Stock

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222

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Distributors (Availability)

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Semicontronic

India . 1,062 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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1,062

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 312 parts In-Stock

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$11.901

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312

$11.901

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One Stop Electronics

USA . 976 parts In-Stock

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$34.000

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976

$34.000

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Parana Technologies

USA . 4,496 parts In-Stock

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$44.263

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$41.165

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4,496

$44.263

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$41.165

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IDEA Electronic Components Group

UK . 1,618 parts In-Stock

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$47.595

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$45.215

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1,618

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Corohmni

South Africa . 1,167 parts In-Stock

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$62.125

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$62.125

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DigiPath Technology Company

USA . 4,496 parts In-Stock

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$74.248

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$71.278

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$71.278

4,496

$74.248

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$71.278

Northwest PG Solutions

USA . 972 parts In-Stock

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$3.895

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$3.895

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Native Components

USA . 821 parts In-Stock

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$3.856

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821

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Corphita

USA . 197 parts In-Stock

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Overview

Unlock the power of advanced digital signal processing with the ADBF512WBBCZ4XX by Analog Devices. This cutting-edge DSP offers unparalleled performance and reliability, making it the top choice for a variety of applications. With a maximum clock frequency of 400 MHz and low power mode, this product delivers exceptional speed and efficiency. Whether you're in the automotive, telecommunications, or industrial sector, this DSP is sure to elevate your projects to new heights. Trust Analog Devices, a manufacturer known for their superior quality and innovative technology, to provide you with the tools you need to succeed. Choose the ADBF512WBBCZ4XX and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and protection for the DSP, making it suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space in electronic equipment.

Maximum Supply Voltage: 1.47 V

Higher maximum supply voltage allows for greater flexibility in power supply options and compatibility with different systems.

Address Bus Width: 19

Wider address bus width enables efficient memory access and supports larger data processing capabilities.

Package Shape: SQUARE

Square package shape is space-efficient and helps in PCB layout optimization for compact electronic designs.

No. of Terminals: 168

Higher number of terminals facilitate connectivity and integration with other components in the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers high performance in a compact form factor, suitable for modern electronic devices.

Minimum Supply Voltage: 1.164 V

Lower minimum supply voltage supports energy efficiency and extends battery life in portable electronics.

Maximum Operating Temperature: 85 °C

High maximum operating temperature range ensures reliable performance in various environments, including industrial settings.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range allows for use in extreme cold conditions without compromising functionality.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and enhances thermal management for efficient heat dissipation.

Maximum Seated Height: 1.7 mm

Low maximum seated height minimizes the overall profile of the package, enabling slim and sleek device designs.

Width: 12 mm

Moderate width makes the DSP suitable for a range of PCB sizes and applications, offering versatility in design integration.

Boundary Scan: YES

Boundary scan feature allows for comprehensive testing and debugging capabilities, enhancing the reliability and maintainability of the product.

External Data Bus Width: 16

Optimal external data bus width supports high-speed data transfer and efficient communication with external peripherals.

Maximum Clock Frequency: 400 MHz

High maximum clock frequency ensures fast and responsive signal processing, suitable for demanding real-time applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency, enabling multitasking and complex operations.

Length: 12 mm

Compact length contributes to a space-saving design, ideal for compact electronic devices with limited board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type focuses on digital signal processing tasks and can potentially support a variety of other functions.

Technology: CMOS

CMOS technology offers low-power consumption and fast switching speeds, making the DSP energy-efficient and high-performing.

Terminal Form: BALL

Ball terminal form simplifies soldering and assembly processes, ensuring reliable connections and ease of integration.

Nominal Supply Voltage: 1.4 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the DSP within specified voltage limits.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting and compact layout designs, optimizing space usage on PCBs.

Format: FIXED POINT

Fixed-point format provides efficient arithmetic operations and precise numerical calculations, essential for accurate signal processing tasks.

Low Power Mode: YES

Low power mode enhances energy efficiency and extends battery life, making the DSP suitable for portable and battery-powered devices.

Barrel Shifter: YES

Inclusion of a barrel shifter allows for efficient shifting of bits in arithmetic and logic operations, improving computational performance.

Technical Specifications

Digital Signal Processors (DSPs) ADBF512WBBCZ4XX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

19

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

400 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B168

Length:

12 mm

Low Power Mode:

YES

No. of Terminals:

168

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.164 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

12 mm

Peripheral IC Type:

Trade Compliance

ADBF512WBBCZ4XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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