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ADBF539WBBCZ4XX

Analog Devices

ADBF539WBBCZ4XX by Analog Devices

Analog Devices' ADBF539WBBCZ4XX is a 316-terminal DSP with 16-bit external data bus, operating at up to 50 MHz. Ideal for industrial applications, it features low power mode and barrel shifter for efficient signal processing tasks. With a temperature range of -40 to 85 °C, this CMOS technology-based DSP offers high performance in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,819 parts In-Stock

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Digiode

USA . 788 parts In-Stock

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788

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Distributors (Availability)

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Native Components

USA . 207 parts In-Stock

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$7.117

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207

$7.117

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Semicontronic

India . 1,390 parts In-Stock

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$12.000

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$11.700

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$11.640

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$12.000

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AZTECH Wire

Italy . 646 parts In-Stock

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$18.864

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One Stop Electronics

USA . 1,230 parts In-Stock

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$26.000

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Parana Technologies

USA . 165 parts In-Stock

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$43.663

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$40.606

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$43.663

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IDEA Electronic Components Group

UK . 575 parts In-Stock

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$46.949

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$44.602

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Corohmni

South Africa . 916 parts In-Stock

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$67.500

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DigiPath Technology Company

USA . 15 parts In-Stock

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$73.240

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$70.311

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$70.311

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$70.311

Northwest PG Solutions

USA . 1,552 parts In-Stock

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Corphita

USA . 867 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the ADBF539WBBCZ4XX by Analog Devices. As a leading manufacturer of Digital Signal Processors (DSPs), Analog Devices ensures top-notch quality and cutting-edge technology in every product. This versatile DSP is perfect for a wide range of applications, offering customers exceptional value and benefits. Whether you're looking to enhance audio processing, improve image recognition, or optimize signal filtering, this product delivers the power and efficiency you need. Trust Analog Devices to provide the solutions you've been searching for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and costs during production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Address Bus Width: 19

The wide address bus width of 19 enables the processor to access a large memory space, increasing processing capabilities.

Package Shape: SQUARE

The square package shape provides efficient use of space on the PCB, allowing for dense and compact designs.

No. of Terminals: 316

The high number of terminals provides connectivity for various interfaces and peripherals, expanding the functionality of the processor.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage helps in reducing power consumption and extending battery life in portable applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without impacting the processor's performance.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and assembly, making it easier for manufacturers to integrate the processor into their designs.

Maximum Seated Height: 1.7 mm

The low seated height helps in achieving a slim profile for the overall system design, particularly in space-constrained applications.

Width: 17 mm

The compact width of 17 mm enables the processor to be used in small form factor devices without compromising on performance.

Boundary Scan: YES

Boundary scan feature aids in testing and debugging the processor during production, ensuring high-quality and reliable manufacturing.

External Data Bus Width: 16

The wide external data bus width of 16 allows for fast data transfer and efficient processing of external data inputs.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz enables fast and responsive processing of data, suitable for real-time signal processing applications.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances the processor's parallel processing capabilities, improving overall performance and speed.

Length: 17 mm

The compact length of 17 mm complements the width and seated height specifications, allowing for a space-efficient design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation across a wide range of temperature conditions, making it suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor, along with other additional peripherals, enhances the processor's capabilities for signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making it a suitable choice for energy-efficient and high-performance applications.

Terminal Form: BALL

The ball terminal form simplifies soldering and connection of the processor to the PCB, ensuring reliable electrical and mechanical connections.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides a standard power supply option for the processor, ensuring compatibility with common power sources.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm allows for high-density mounting and efficient use of space on the PCB, facilitating compact designs.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and reduces processing complexity, making the processor efficient for specific signal processing tasks.

Low Power Mode: YES

The low power mode helps in reducing power consumption during idle or low activity periods, prolonging the battery life and energy efficiency of the processor.

Barrel Shifter: YES

The presence of a barrel shifter allows for efficient shifting and manipulation of data within the processor, enhancing the overall computational capabilities.

Technical Specifications

Digital Signal Processors (DSPs) ADBF539WBBCZ4XX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Address Bus Width:

19

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B316

Length:

17 mm

Low Power Mode:

YES

No. of Terminals:

316

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.7 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

ADBF539WBBCZ4XX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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