Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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DMTH10H009LFG-13
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 39 W; Case Connection: DRAIN; Terminal Form: NO LEAD;
144.5 mJ
DRAIN
SINGLE WITH BUILT-IN DIODE
100 V
14 A
.0085 ohm
METAL-OXIDE SEMICONDUCTOR
16 pF
S-PDSO-N8
e3
1
8
ENHANCEMENT MODE
175 Cel
-55 Cel
PLASTIC/EPOXY
SQUARE
SMALL OUTLINE
260
N-CHANNEL
39 W
220 A
MIL-STD-202
YES
MATTE TIN
NO LEAD
DUAL
SWITCHING
SILICON
DMN6069SFVWQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 32 W; JESD-609 Code: e3; Avalanche Energy Rating (EAS): 7.2 mJ;
7.2 mJ
60 V
4 A
.069 ohm
28 pF
S-PDSO-F8
150 Cel
32 W
56 A
AEC-Q101; IATF 16949; MIL-STD-202
FLAT
DMN6069SFVWQ-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 32 W; Minimum DS Breakdown Voltage: 60 V; Maximum Feedback Capacitance (Crss): 28 pF;
DMT32M4LFG-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.6 W; No. of Terminals: 8; Transistor Application: SWITCHING;
172 mJ
30 V
30 A
.0017 ohm
262 pF
2.6 W
440 A
DMT69M5LFVWQ-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 20.5 W; Minimum DS Breakdown Voltage: 60 V; JESD-30 Code: S-PDSO-F8;
37.5 mJ
14.8 A
.0083 ohm
52 pF
20.5 W
160 A
DMT69M5LFVWQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 20.5 W; Peak Reflow Temperature (C): 260; Avalanche Energy Rating (EAS): 37.5 mJ;
DMT69M5LFVW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 20.5 W; No. of Elements: 1; Transistor Element Material: SILICON;
DMPH4013SPS-13
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3.3 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 403 pF;
260 mJ
40 V
69 A
.013 ohm
403 pF
R-PDSO-F8
RECTANGULAR
P-CHANNEL
3.3 W
277 A
DMTH8008LFG-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 50 W; Maximum Pulsed Drain Current (IDM): 280 A; Maximum Drain-Source On Resistance: .0069 ohm;
162 mJ
80 V
17 A
.0069 ohm
31 pF
50 W
280 A
DMTH8008LFG-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 50 W; Maximum Drain-Source On Resistance: .0069 ohm; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
DMTH48M3SFVWQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 36.6 W; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 40 V;
30.5 mJ
52.4 A
.0089 ohm
12.4 pF
36.6 W
209 A
AEC-Q101; MIL-STD-202
DMT10H009SCG-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.7 W; Reference Standard: MIL-STD-202; Operating Mode: ENHANCEMENT MODE;
109.4 mJ
48 A
.0095 ohm
13 pF
e4
2.7 W
198.5 A
NICKEL PALLADIUM GOLD
30
DMP3028LFDEQ-13
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.03 W; Reference Standard: AEC-Q101; IATF 16949; MIL-STD-202; Maximum Feedback Capacitance (Crss): 165 pF;
6.8 A
.025 ohm
165 pF
S-PDSO-N6
6
2.03 W
40 A
152 ns
41 ns
DMP3028LFDEQ-7
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.03 W; Transistor Application: SWITCHING; Minimum DS Breakdown Voltage: 30 V;
DMT3006LFDFQ-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.1 W; Transistor Element Material: SILICON; Minimum Operating Temperature: -55 Cel;
31 mJ
14.1 A
.007 ohm
72 pF
2.1 W
80 A
DMTH8004LPS-13
DMTH8004LPS-13 by Diodes Inc. is a N-CHANNEL FET for SWITCHING applications. It has 80V DS Breakdown Voltage, 400A IDM, and 0.0053 ohm Drain-Source On Resistance. With METAL-OXIDE SEMICONDUCTOR tech, it operates b/w -55 to 175 °C and meets MIL-STD-202 standards.
183.7 mJ
100 A
.0053 ohm
71 pF
125 W
400 A
DMTH48M3SFVW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 36.6 W; Maximum Drain Current (ID): 52.4 A; Package Shape: SQUARE;
DMT6011LSS-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.1 W; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -55 Cel;
39.4 mJ
10.6 A
.011 ohm
38 pF
R-PDSO-G8
85 A
GULL WING
DMT6012LPSW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 17.9 W; Maximum Drain Current (ID): 31.5 A; Peak Reflow Temperature (C): 260;
39.5 mJ
31.5 A
.012 ohm
27.5 pF
17.9 W
120 A
DMN10H220LDV-13
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 40 W; JESD-609 Code: e3; Maximum Pulsed Drain Current (IDM): 42 A;
1.1 mJ
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
10.5 A
.222 ohm
12 pF
2
40 W
42 A
DMN6069SFVW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 32 W; No. of Terminals: 8; Maximum Drain-Source On Resistance: .069 ohm;
DMN6069SFVW-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 32 W; Package Style (Meter): SMALL OUTLINE; Operating Mode: ENHANCEMENT MODE;
DMT10H009SSS-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.1 W; Minimum Operating Temperature: -55 Cel; Terminal Finish: MATTE TIN;
12 A
.0092 ohm
DMTH4002SCTBQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 166.7 W; Maximum Operating Temperature: 175 Cel; Avalanche Energy Rating (EAS): 551.8 mJ;
551.8 mJ
192 A
.003 ohm
17 pF
TO-263AB
R-PSSO-G2
166.7 W
760 A
AEC-Q101; IATF 16949
SINGLE
DMN10H220LFVW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 41 W; Maximum Drain-Source On Resistance: .222 ohm; No. of Terminals: 8;
11 A
41 W
44 A
DMN10H220LFVW-7
DMN10H220LFVW-7 by Diodes Inc. is a N-CHANNEL FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 44A IDM, 1.1mJ EAS, and 0.222 ohm Drain-Source On Resistance. Operates in -55 to 150 °C with Matte Tin finish and DUAL Terminal Position.
DMN4034SSSQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.1 W; Maximum Pulsed Drain Current (IDM): 36 A; No. of Terminals: 8;
19 mJ
6.5 A
.034 ohm
59 pF
36 A
DMP65H13D0HSS-13
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.9 W; Terminal Finish: MATTE TIN; Operating Mode: ENHANCEMENT MODE;
650 V
.25 A
13 ohm
3.3 pF
1.9 W
2 A
DMP65H11D0HSS-13
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.9 W; Operating Mode: ENHANCEMENT MODE; JESD-609 Code: e3;
.27 A
11 ohm
3.5 pF
2.3 A
Matte Tin (Sn)
DMN29M9UFDF-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Peak Reflow Temperature (C): 260; JESD-30 Code: R-PDSO-N6;
20 V
.0135 ohm
R-PDSO-N6
2 W
50 A
DMN2024UVTQ-13
N-CHANNEL; Configuration: COMMON DRAIN, 2 ELEMENTS; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; No. of Terminals: 6; Maximum Operating Temperature: 150 Cel;
COMMON DRAIN, 2 ELEMENTS
7 A
.024 ohm
R-PDSO-G6
1.6 W
35 A
DMP1011LFVQ-7
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.16 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 19 A;
86 mJ
SOURCE
12 V
19 A
.0117 ohm
53 pF
2.16 W
70 A
DMP1011LFVQ-13
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.16 W; JESD-30 Code: R-PDSO-F8; Package Body Material: PLASTIC/EPOXY;
DMT32M5LPSW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 100 W; Maximum Drain Current (ID): 100 A; Maximum Operating Temperature: 150 Cel;
140 mJ
186 pF
100 W
350 A
DMNH6069SFVW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 38 W; Package Body Material: PLASTIC/EPOXY; Transistor Element Material: SILICON;
5 A
.05 ohm
38 W
72 A
DMNH6069SFVW-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 38 W; Maximum Operating Temperature: 175 Cel; Maximum Feedback Capacitance (Crss): 28 pF;
DMN3055LFDBQ-13
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.36 W; Maximum Drain Current (ID): 5 A; Package Body Material: PLASTIC/EPOXY;
6 mJ
.04 ohm
44 pF
1.36 W
25 A
DMNH6069SFVWQ-7
DMNH6069SFVWQ-7 by Diodes Inc. is a N-channel FET with 60V DS breakdown voltage, 72A pulsed drain current, and 0.05 ohm max drain-source resistance. Ideal for switching applications in automotive electronics due to its AEC-Q101 compliance and 175°C operating temp.
DMNH6069SFVWQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 38 W; Maximum Pulsed Drain Current (IDM): 72 A; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
DMC2025UFDBQ-13
N-CHANNEL AND P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1.4 W; Avalanche Energy Rating (EAS): 8.5 mJ; Case Connection: DRAIN;
8.5 mJ
6 A
.035 ohm
77 pF
N-CHANNEL AND P-CHANNEL
1.4 W
20 A
NO
DMN2024UQ-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.4 W; Transistor Application: SWITCHING; Peak Reflow Temperature (C): 260;
R-PDSO-G3
3
45 A
DMT35M4LFDF4-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.19 W; Package Style (Meter): SMALL OUTLINE; Case Connection: DRAIN;
25 mJ
.009 ohm
50 pF
2.19 W
DMT35M4LFDF4-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2.19 W; Maximum Drain-Source On Resistance: .009 ohm; Terminal Form: NO LEAD;
DMN14M8UFDF-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.9 W; Transistor Application: SWITCHING; Peak Reflow Temperature (C): 260;
1.6 mJ
14.7 A
.006 ohm
352 pF
DMTH8028LFVW-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3.5 W; Package Shape: SQUARE; Transistor Application: SWITCHING;
23.4 mJ
27 A
19.5 pF
3.5 W
108 A
DMTH8028LFVW-7
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3.5 W; Package Shape: SQUARE; Maximum Operating Temperature: 175 Cel;
DMT8008SK3-13
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JEDEC-95 Code: TO-252; Avalanche Energy Rating (EAS): 80 mJ;
80 mJ
90 A
.0078 ohm
56 pF
TO-252
3 W
360 A
DMC10H220LSD-13
N-CHANNEL AND P-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.5 W; Package Body Material: PLASTIC/EPOXY; Maximum Pulsed Drain Current (IDM): 9 A;
.5 mJ
1.7 A
.22 ohm
1.5 W
9 A
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