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BALL Network Interfaces 94

Network Interfaces
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Data Rate JESD-30 Code JESD-609 Code Length Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width
BCM5464SA1IRB by Broadcom

BCM5464SA1IRB

Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 354; Package Code: BGA; Package Shape: RECTANGULAR; No. of Functions: 1;

1000 Mbps

R-PBGA-B354

1

354

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

CMOS

ETHERNET TRANSCEIVER

BALL

BOTTOM

UPD60510F1-HN4-M1-A by Renesas Electronics

UPD60510F1-HN4-M1-A

Renesas Electronics

Network Interfaces; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B324

e6

324

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

3.3

Not Qualified

Network Interfaces

3.3 V

YES

INDUSTRIAL

TIN BISMUTH

BALL

1 mm

BOTTOM

MC-10287F1-HN4-M1-A by Renesas Electronics

MC-10287F1-HN4-M1-A

Renesas Electronics

Network Interfaces; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B324

e6

324

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA324,18X18,40

SQUARE

GRID ARRAY

3.3

Not Qualified

Network Interfaces

3.3 V

YES

INDUSTRIAL

TIN BISMUTH

BALL

1 mm

BOTTOM

TLK10034AAJ by Texas Instruments

TLK10034AAJ

Texas Instruments

TLK10034AAJ by Texas Instruments is a Network Interfaces IC with 4 transceivers, supporting data rate of 10 Gbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. Package style is grid array with 324 terminals in square shape.

10000 Mbps

S-PBGA-B324

e1

19 mm

4

1

324

4

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

3.29 mm

1249 mA

1 V

YES

CMOS

SUPPORT CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

19 mm

BCM5388KPB by Broadcom

BCM5388KPB

Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 324; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

S-PBGA-B324

1

324

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

1.2 V

YES

CMOS

ETHERNET TRANSCEIVER

BALL

BOTTOM

NOT SPECIFIED

BCM5464A1KRBG by Broadcom

BCM5464A1KRBG

Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 354; Package Code: BGA; Package Shape: UNSPECIFIED; Package Style (Meter): GRID ARRAY;

X-PBGA-B354

1

354

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

NOT SPECIFIED

YES

CMOS

ETHERNET TRANSCEIVER

BALL

BOTTOM

NOT SPECIFIED

BCM5466SRA0KFBG by Broadcom

BCM5466SRA0KFBG

Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: UNSPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;

X-PBGA-B256

1

256

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

NOT SPECIFIED

YES

CMOS

ETHERNET TRANSCEIVER

BALL

BOTTOM

NOT SPECIFIED

BCM5461SA1IPF by Broadcom

BCM5461SA1IPF

Broadcom

ETHERNET TRANSCEIVER; Terminal Form: BALL; No. of Terminals: 100; Package Code: BGA; Package Shape: UNSPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

X-PBGA-B100

1

100

PLASTIC/EPOXY

BGA

UNSPECIFIED

GRID ARRAY

NOT SPECIFIED

YES

CMOS

ETHERNET TRANSCEIVER

BALL

BOTTOM

NOT SPECIFIED

DS33Z11 by Maxim Integrated

DS33Z11

Maxim Integrated

DS33Z11 by Maxim Integrated is a network interface IC with 169 terminals in a low-profile grid array package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Supports circuits at 1.8V nominal voltage, ideal for telecom applications.

S-PBGA-B169

14 mm

3

1

169

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

Not Qualified

1.5 mm

1.8 V

YES

SUPPORT CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

14 mm

DS33ZH11 by Maxim Integrated

DS33ZH11

Maxim Integrated

SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: FBGA; Package Shape: SQUARE;

S-PBGA-B100

e1

10 mm

1

100

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

225

Not Qualified

1.8 V

YES

SUPPORT CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

10 mm

PX1011B-EL1/N,551 by NXP Semiconductors

PX1011B-EL1/N,551

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

3

1

81

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

9 mm

PX1012A-EL1/G,551 by NXP Semiconductors

PX1012A-EL1/G,551

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.25 V

YES

INTERFACE CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

9 mm

PX1011A-EL1/G,557 by NXP Semiconductors

PX1011A-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

9 mm

PX1011A-EL1:557 by NXP Semiconductors

PX1011A-EL1:557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

1

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

BALL

.8 mm

BOTTOM

9 mm

PX1011B-EL1/G,557 by NXP Semiconductors

PX1011B-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

3

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

BALL

.8 mm

BOTTOM

9 mm

PX1011B-EL1/N,557 by NXP Semiconductors

PX1011B-EL1/N,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

9 mm

3

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

BALL

.8 mm

BOTTOM

9 mm

PX1011BI-EL1/G,557 by NXP Semiconductors

PX1011BI-EL1/G,557

NXP Semiconductors

NXP Semiconductors' PX1011BI-EL1/G,557 is a network interface with 81 terminals in a square package. It operates b/w -40 to 85°C and has a low profile of 1.6mm height. Ideal for industrial telecom applications requiring a 1.2V supply voltage and fine pitch grid array style.

S-PBGA-B81

9 mm

3

1

81

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

9 mm

PX1012A-EL1/G,557 by NXP Semiconductors

PX1012A-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

70 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

COMMERCIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

9 mm

PX1012AI-EL1/G,557 by NXP Semiconductors

PX1012AI-EL1/G,557

NXP Semiconductors

INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B81

e1

9 mm

1

81

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.6 mm

1.2 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

9 mm

TLK3114SAGNT by Texas Instruments

TLK3114SAGNT

Texas Instruments

TLK3114SAGNT by Texas Instruments is a Network Interfaces IC with 289 terminals, operating at 0-70°C. It supports circuits for telecom applications, with a supply voltage of 2.5V and CMOS technology. The package is square-shaped, measuring 19mm in width and length, suitable for surface mount assembly.

S-PBGA-B289

19 mm

1

289

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA289,17X17,40

SQUARE

GRID ARRAY

NOT SPECIFIED

1.5/2.5,2.5

Not Qualified

2 mm

Other Telecom ICs

2.5 V

YES

CMOS

SUPPORT CIRCUIT

COMMERCIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

19 mm

CYP15G0101DXB-BBI by Cypress Semiconductor

CYP15G0101DXB-BBI

Cypress Semiconductor

CYP15G0101DXB-BBI by Cypress Semiconductor is a Network Interface with 100 terminals, operating at 3.3V. It features a data rate of 1500 Mbps and operates in industrial temperature range (-40 to 85 °C). Ideal for high-speed interface circuits in telecom applications.

1500 Mbps

S-PBGA-B100

e0

11 mm

3

1

100

1

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA100,10X10,40

SQUARE

GRID ARRAY, LOW PROFILE

3.3

Not Qualified

1.4 mm

Network Interfaces

3.3 V

YES

BICMOS

INTERFACE CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

1 mm

BOTTOM

11 mm

TLK2208GPV by Texas Instruments

TLK2208GPV

Texas Instruments

TLK2208GPV by Texas Instruments is an Ethernet transceiver with 8 channels, operating at a data rate of 1300 Mbps. It features a package style of grid array, with a terminal pitch of 1 mm and nominal voltage of 1.8 V. Ideal for network interfaces in commercial-grade applications due to its CMOS technology and compact square package shape.

1300 Mbps

S-PBGA-B289

19 mm

1

289

8

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA289,17X17,40

SQUARE

GRID ARRAY

NOT SPECIFIED

1.8,1.8/2.5

Not Qualified

2 mm

Network Interfaces

1.8 V

YES

CMOS

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

19 mm

TLK3114SBGNT by Texas Instruments

TLK3114SBGNT

Texas Instruments

TLK3114SBGNT by Texas Instruments is a network interface IC with 289 terminals in a square grid array package. Operating at 0-70°C, it supports circuits with a supply voltage of 2.5V. Ideal for telecom applications, this CMOS technology IC has a compact size of 19x19mm and terminal pitch of 1mm.

S-PBGA-B289

19 mm

1

289

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA289,17X17,40

SQUARE

GRID ARRAY

NOT SPECIFIED

1.5/2.5,2.5

Not Qualified

2 mm

Other Telecom ICs

2.5 V

YES

CMOS

SUPPORT CIRCUIT

COMMERCIAL

BALL

1 mm

BOTTOM

NOT SPECIFIED

19 mm

CYP15G0401DXB-BGI by Cypress Semiconductor

CYP15G0401DXB-BGI

Cypress Semiconductor

CYP15G0401DXB-BGI by Cypress Semiconductor is a Network Interface with 4 Ethernet transceivers, operating at 1500 Mbps. It has 256 terminals in a square package style, suitable for industrial applications with temperature range from -40 to 85°C. The device features BICMOS technology and requires a nominal voltage of 3.3V.

1500 Mbps

S-PBGA-B256

e0

27 mm

3

1

256

4

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA256,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

3.3

Not Qualified

1.745 mm

Network Interfaces

3.3 V

YES

BICMOS

ETHERNET TRANSCEIVER

INDUSTRIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

TLK3104SCGNT by Texas Instruments

TLK3104SCGNT

Texas Instruments

TLK3104SCGNT by Texas Instruments is an Ethernet transceiver IC with CMOS technology. It operates b/w -40°C to 75°C, with a supply voltage of 2.5V. This network interface has a grid array package style, square shape, and 289 terminals for high-speed data communication applications.

S-PBGA-B289

19 mm

1

289

75 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

Not Qualified

2 mm

2.5 V

YES

CMOS

ETHERNET TRANSCEIVER

OTHER

BALL

1 mm

BOTTOM

NOT SPECIFIED

19 mm

STULPI01ATBR by STMicroelectronics

STULPI01ATBR

STMicroelectronics

STULPI01ATBR by STMicroelectronics is a robust network interface with a max operating temp of 85 °C and supports industrial applications. It features a compact 3.6mm square package with 36 terminals, ensuring reliable connectivity. Ideal for telecom circuits, it operates at a nominal voltage of 1.8V.

S-PBGA-B36

e1

3.6 mm

3

1

36

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY

260

Not Qualified

1.16 mm

1.8 V

YES

SUPPORT CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

3.6 mm

CYP15G0403DXB-BGXI by Cypress Semiconductor

CYP15G0403DXB-BGXI

Cypress Semiconductor

CYP15G0403DXB-BGXI by Cypress Semiconductor is a Network Interface with 4 transceivers, operating at 1500 Mbps data rate. It has a supply voltage of 3.3V and operates in industrial temperature range (-40 to 85°C). The package style is grid array with a square shape, suitable for Ethernet applications.

1500 Mbps

S-PBGA-B256

e1

27 mm

3

1

256

4

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

BGA256,20X20,50

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

3.3

Not Qualified

1.745 mm

Network Interfaces

1.32 mA

3.3 V

YES

BICMOS

ETHERNET TRANSCEIVER

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

20

27 mm

DLKPC192SGNT by Texas Instruments

DLKPC192SGNT

Texas Instruments

DLKPC192SGNT by Texas Instruments is an Ethernet transceiver IC with 289 terminals in a square grid array package. Operating at temperatures from 0 to 70°C, it has power supplies of 1.8V, 2.5V, and 3.3V for commercial-grade applications. Its CMOS technology and ball terminal form make it suitable for networking interfaces requiring high performance in compact spaces.

S-PBGA-B289

19 mm

1

289

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA289,17X17,40

SQUARE

GRID ARRAY

1.8,2.5,3.3

Not Qualified

2 mm

Other Telecom ICs

1.8 V

YES

CMOS

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

1 mm

BOTTOM

19 mm

XA1243FPBGABL by Texas Instruments

XA1243FPBGABL

Texas Instruments

Texas Instruments XA1243FPBGABL is a network interface IC with 161 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include thin profile, fine pitch, and AEC-Q100 screening level.

S-PBGA-B161

10.4 mm

1

161

125 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

AEC-Q100

1.17 mm

1.2 V

YES

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

.65 mm

BOTTOM

10.4 mm

VSC8486YJB-11 by Microchip Technology

VSC8486YJB-11

Microchip Technology

VSC8486YJB-11 by Microchip: Ethernet transceiver with 144 terminals, 1.2V supply voltage, and data rate of 0.00001 Mbps. Ideal for network interfaces in industrial telecom applications due to its low profile grid array package and wide temperature range from -40 to 85°C.

.00001 Mbps

S-PBGA-B144

13 mm

1

144

1

85 Cel

-40 Cel

PLASTIC/EPOXY

LBGA

BGA144,12X12,40

SQUARE

GRID ARRAY, LOW PROFILE

1.4 mm

1.2 V

YES

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

1 mm

BOTTOM

13 mm

VSC8504XKS-04 by Microchip Technology

VSC8504XKS-04

Microchip Technology

VSC8504XKS-04 by Microchip: 4 Ethernet transceivers, 1000 Mbps data rate. Automotive grade with -40 to 125 °C temp range. Ideal for network interfaces in automotive applications.

1000 Mbps

S-PBGA-B256

17 mm

1

256

4

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8 mm

1 V

YES

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

1 mm

BOTTOM

17 mm

VSC8552XKS-04 by Microchip Technology

VSC8552XKS-04

Microchip Technology

VSC8552XKS-04 by Microchip: Ethernet transceiver IC with 256 terminals, operating temp. range -40 to 125°C. Square package style, grid array shape for automotive applications. Surface mountable, terminal pitch of 1mm, and nominal voltage of 1V make it ideal for network interfaces.

S-PBGA-B256

17 mm

1

256

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

1.8 mm

1 V

YES

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

1 mm

BOTTOM

17 mm

VSC8562XKS-14 by Microchip Technology

VSC8562XKS-14

Microchip Technology

VSC8562XKS-14 by Microchip: 1000 Mbps Ethernet transceiver with 2 transceivers. Operates at -40 to 125 °C, suitable for automotive applications. Package style: grid array, surface mountable, with 256 terminals in a square shape.

1000 Mbps

S-PBGA-B256

17 mm

1

256

2

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

NOT SPECIFIED

1.8 mm

1130 mA

2.5 V

YES

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

1 mm

BOTTOM

NOT SPECIFIED

17 mm

VSC8572XKS-05 by Microchip Technology

VSC8572XKS-05

Microchip Technology

Microchip Technology's VSC8572XKS-05 is an Ethernet transceiver with 2 transceivers, supporting data rate of 1000 Mbps. Operating temperature ranges from -40 to 125°C, ideal for automotive applications. With a package size of 17x17 mm and terminal pitch of 1 mm, it offers high performance in network interfaces.

1000 Mbps

S-PBGA-B256

17 mm

1

256

2

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8 mm

800 mA

2.5 V

YES

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

1 mm

BOTTOM

17 mm

VSC8575XKS-14 by Microchip Technology

VSC8575XKS-14

Microchip Technology

Microchip Technology's VSC8575XKS-14 is an Ethernet transceiver with 4 transceivers, supporting data rate of 1000 Mbps. Operating temperature ranges from -40 to 125°C, suitable for automotive applications. Package style is grid array with 256 terminals in a square shape.

1000 Mbps

S-PBGA-B256

17 mm

1

256

4

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8 mm

1890 mA

1 V

YES

ETHERNET TRANSCEIVER

AUTOMOTIVE

BALL

1 mm

BOTTOM

17 mm

VSC8584XKS-14 by Microchip Technology

VSC8584XKS-14

Microchip Technology

VSC8584XKS-14 by Microchip: 4 Ethernet transceivers, 1000 Mbps data rate. Automotive grade with -40 to 125 °C operating temp range. Square package with 256 terminals for network interfaces in surface mount applications.

1000 Mbps

S-PBGA-B256

e1

17 mm

1

256

4

125 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

1.8 mm

1890 mA

2.5 V

YES

ETHERNET TRANSCEIVER

AUTOMOTIVE

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

VSC8662XIC-03 by Microchip Technology

VSC8662XIC-03

Microchip Technology

VSC8662XIC-03 by Microchip: Industrial-grade Ethernet transceiver with 1000 Mbps data rate. Features 2 transceivers, operates at -40 to 100°C. Suitable for network interfaces in various applications.

1000 Mbps

S-PBGA-B256

e1

17 mm

1

256

2

100 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

GRID ARRAY

2 mm

1.2 V

YES

ETHERNET TRANSCEIVER

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

BCM5387KFBG by Broadcom

BCM5387KFBG

Broadcom

BCM5387KFBG by Broadcom is a Network Interfaces IC with 256 terminals, CMOS technology, and 1.2V supply voltage. It's an Ethernet transceiver suitable for commercial-grade applications, featuring a low profile grid array package style ideal for surface mount designs. Operating temperature ranges from 0 to 70°C.

S-PBGA-B256

17 mm

3

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

LBGA

BGA256,16X16,40

SQUARE

GRID ARRAY, LOW PROFILE

1.7 mm

812 mA

1.2 V

YES

CMOS

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

1 mm

BOTTOM

17 mm

BCM53134PIFBG by Broadcom

BCM53134PIFBG

Broadcom

BCM53134PIFBG by Broadcom is a network interface IC with 212 terminals in a square package. Operating temperature ranges from -45 to 85°C, suitable for industrial use. Features include Ethernet transceiver technology, 1V supply voltage, and thin profile grid array package style.

S-PBGA-B212

11 mm

3

1

212

85 Cel

-45 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.017 mm

1 V

YES

CMOS

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

.65 mm

BOTTOM

11 mm

BCM53242MIPBG by Broadcom

BCM53242MIPBG

Broadcom

ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

1000 Mbps

S-PBGA-B400

27 mm

1

400

24

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

2.33 mm

1450 mA

1.2 V

YES

CMOS

ETHERNET TRANSCEIVER

INDUSTRIAL

BALL

1.27 mm

QUAD

27 mm

BCM53242MKPBG by Broadcom

BCM53242MKPBG

Broadcom

ETHERNET TRANSCEIVER; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: BGA; Package Shape: SQUARE;

1000 Mbps

S-PBGA-B400

27 mm

3

1

400

24

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA400,20X20,50

SQUARE

GRID ARRAY

2.33 mm

1450 mA

1.2 V

YES

CMOS

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

1.27 mm

QUAD

27 mm

BCM53125MIMMLG by Broadcom

BCM53125MIMMLG

Broadcom

BCM53125MIMMLG by Broadcom is a network interface IC with 186 terminals in a square plastic/epoxy package. It features Ethernet transceiver technology, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom applications due to its MSL level of 3.

S-PBGA-B186

3

1

186

1

PLASTIC/EPOXY

BGA186(UNSPEC)

SQUARE

YES

ETHERNET TRANSCEIVER

BALL

BOTTOM

TUSB2E22YCGT by Texas Instruments

TUSB2E22YCGT

Texas Instruments

TUSB2E22YCGT by Texas Instruments is a network interface IC with 2 channels, operating at 1.8V. It features a grid array package style with very thin profile and fine pitch, suitable for commercial-grade applications in telecom interface circuits. With a temperature range of -20 to 85°C, it offers reliable performance in various networking setups.

S-PBGA-B25

2 mm

1

2

1

25

85 Cel

-20 Cel

PLASTIC/EPOXY

VFBGA

BGA25,5X5,16

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

1.8 V

YES

INTERFACE CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.35 mm

BOTTOM

30

2 mm

BCM54140B0KFBG by Broadcom

BCM54140B0KFBG

Broadcom

BCM54140B0KFBG by Broadcom is a network interface with 4 Ethernet transceivers. It operates in commercial temperature range of 0-70°C, featuring CMOS technology and a grid array package style. Suitable for surface mount applications, it has 256 terminals in a rectangular plastic/epoxy body.

R-PBGA-B256

1

256

4

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

NOT SPECIFIED

YES

CMOS

ETHERNET TRANSCEIVER

COMMERCIAL

BALL

BOTTOM

NOT SPECIFIED

BCM54140B0IFBG by Broadcom

BCM54140B0IFBG

Broadcom

BCM54140B0IFBG by Broadcom is a network interface with 4 transceivers. It operates in industrial temperature range (-40 to 85°C) using CMOS technology. The package is a rectangular grid array with 256 terminals, suitable for Ethernet applications.

R-PBGA-B256

e1

1

256

4

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

255

YES

CMOS

ETHERNET TRANSCEIVER

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

ADIN2299BBCZ by Analog Devices

ADIN2299BBCZ

Analog Devices

ADIN2299BBCZ by Analog Devices is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a grid array package style with 194 terminals for surface mount applications. Ideal for telecom equipment requiring a 3.3V supply voltage and compact design.

100 Mbps

S-PBGA-B194

38 mm

1

194

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA194,17X17,87

SQUARE

GRID ARRAY

NOT SPECIFIED

3.56 mm

3.3 V

YES

ETHERNET TRANSCEIVER

BALL

2.2 mm

BOTTOM

NOT SPECIFIED

38 mm

TLK10031CTR by Texas Instruments

TLK10031CTR

Texas Instruments

TLK10031CTR by Texas Instruments is a network interface IC with 144 terminals in a square grid array package. It operates at temperatures ranging from -40 to 85°C, suitable for industrial applications. With a data rate of 10312.5 Mbps, it supports high-speed telecom circuits efficiently.

10312.5 Mbps

S-PBGA-B144

e1

13 mm

4

1

144

1

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA144,12X12,40

SQUARE

GRID ARRAY

260

Not Qualified

3.25 mm

700 mA

1 V

YES

CMOS

SUPPORT CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13 mm

AD9371BBCZ-REEL by Analog Devices

AD9371BBCZ-REEL

Analog Devices

AD9371BBCZ-REEL by Analog Devices is a network interface IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, suitable for industrial telecom applications. Features include a 1.3V supply voltage, tin silver copper terminal finish, and a compact square package shape of 12x12mm².

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.27 mm

1.3 V

YES

INTERFACE CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

12 mm