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VSC8552XKS-04

Microchip Technology

VSC8552XKS-04 by Microchip Technology

VSC8552XKS-04 by Microchip: Ethernet transceiver IC with 256 terminals, operating temp. range -40 to 125°C. Square package style, grid array shape for automotive applications. Surface mountable, terminal pitch of 1mm, and nominal voltage of 1V make it ideal for network interfaces.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,868 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,868

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-

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 345 parts In-Stock

1+ parts

$11.095

100+ parts

-

1k+ parts

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10k+ parts

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345

$11.095

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-

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Ampacity Inc.

Singapore . 1,493 parts In-Stock

1+ parts

$689.000

100+ parts

-

1k+ parts

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10k+ parts

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1,493

$689.000

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,000

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-

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Vigor

Singapore . 7,700 parts In-Stock

1+ parts

-

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7,700

-

-

-

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Fulton Briggs Corp.

USA . 6,130 parts In-Stock

1+ parts

-

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6,130

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-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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-

-

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Perfect Parts

USA . 706 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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706

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Microchip USA

USA . 283 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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283

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Overview

Revolutionize your network interfaces with the VSC8552XKS-04 by Microchip Technology. Known for their top-quality products, Microchip Technology delivers a game-changing solution that offers unparalleled performance and reliability. This Ethernet transceiver is perfect for automotive applications, ensuring seamless connectivity and optimal functionality. With a durable plastic/epoxy body and 256 terminals, this product guarantees a hassle-free installation process. Trust Microchip Technology to provide you with a superior networking experience that exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability while keeping the overall weight of the product low.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient in various electronic devices.

Package Shape: SQUARE

The square shape allows for a more compact design, saving space in electronic devices.

No. of Terminals: 256

Having a higher number of terminals enables more connectivity options, making this product versatile in use.

Package Style (Meter): GRID ARRAY

The grid array package style provides higher density and better electrical performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of environments without compromising performance.

Terminal Position: BOTTOM

The bottom terminal position makes it easier to integrate this product into various electronic designs.

Maximum Seated Height: 1.8 mm

The low seated height enables a sleek design and allows for easier integration into compact electronic devices.

Width: 17 mm

The compact width of 17mm allows for easy placement in tight spaces within electronic devices.

Length: 17 mm

The square shape and length of 17mm make this product easy to fit into various electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this product can withstand the temperature variations typically found in automotive applications.

Terminal Form: BALL

The ball terminal form provides a reliable and secure connection for superior performance.

Telecom IC Type: ETHERNET TRANSCEIVER

The Ethernet transceiver type enables high-speed data transfer and communication over a network.

Nominal Supply Voltage: 1 V

The 1V supply voltage ensures efficient power consumption and compatibility with various electronic systems.

Terminal Pitch: 1 mm

The 1mm terminal pitch allows for easy connection and integration into electronic circuit designs.

Technical Specifications

Network Interfaces VSC8552XKS-04 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.8 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

VSC8552XKS-04 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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