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SN65HVD230QDG4

Texas Instruments

SN65HVD230QDG4 by Texas Instruments

SN65HVD230QDG4 by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate. It operates at 3.3V, suitable for automotive applications. This small outline package has 8 terminals and can withstand temperatures from -40 to 125°C.

Median Price

$3.010

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,304 parts In-Stock

1+ parts

$1.520

100+ parts

$1.490

1k+ parts

$1.460

10k+ parts

-

2,304

$1.520

$1.490

$1.460

-

Mouser Electronics

USA . 2,218 parts In-Stock

1+ parts

$4.500

100+ parts

$3.200

1k+ parts

$2.410

10k+ parts

$2.130

2,218

$4.500

$3.200

$2.410

$2.130

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,718 parts In-Stock

1+ parts

$1.444

100+ parts

-

1k+ parts

-

10k+ parts

-

4,718

$1.444

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$2.860

-

-

-

Chip Stock

USA . 18,503 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,503

-

-

-

-

Vyrian

USA . 2,050 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,050

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,053 parts In-Stock

1+ parts

$1.290

100+ parts

$1.258

1k+ parts

$1.251

10k+ parts

-

2,053

$1.290

$1.258

$1.251

-

Corphita

USA . 3,756 parts In-Stock

1+ parts

$1.368

100+ parts

-

1k+ parts

-

10k+ parts

-

3,756

$1.368

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.803

100+ parts

-

1k+ parts

$2.691

10k+ parts

-

1,000

$2.803

-

$2.691

-

Ampacity Inc.

Singapore . 1,916 parts In-Stock

1+ parts

$2.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,916

$2.810

-

-

-

Continental Prestige Electronics

USA . 6,715 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

$2.803

6,715

$2.860

-

-

$2.803

Argo Parts USA

USA . 2,388 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

2,388

$2.860

-

-

-

Corohmni

South Africa . 69 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

69

$2.860

-

-

-

Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$2.946

100+ parts

$2.799

1k+ parts

$2.799

10k+ parts

-

61

$2.946

$2.799

$2.799

-

Parana Technologies

USA . 999 parts In-Stock

1+ parts

$13.973

100+ parts

-

1k+ parts

$14.446

10k+ parts

-

999

$13.973

-

$14.446

-

DigiPath Technology Company

USA . 311 parts In-Stock

1+ parts

$15.386

100+ parts

-

1k+ parts

-

10k+ parts

-

311

$15.386

-

-

-

IDEA Electronic Components Group

UK . 759 parts In-Stock

1+ parts

$15.700

100+ parts

$14.915

1k+ parts

$14.130

10k+ parts

-

759

$15.700

$14.915

$14.130

-

ChromeModa Solutions

Germany . 381 parts In-Stock

1+ parts

$15.700

100+ parts

$12.874

1k+ parts

-

10k+ parts

-

381

$15.700

$12.874

-

-

Microchip USA

USA . 445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

445

-

-

-

-

Perfect Parts

USA . 24 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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24

-

-

-

-

Overview

Enhance your network interfaces with the SN65HVD230QDG4 by Texas Instruments, a top-quality product offering reliability and high performance. With Texas Instruments' reputation for excellence, this interface circuit is ideal for automotive applications, providing seamless communication at 1 Mbps data rate. The compact design and low power consumption make it an excellent choice for customers seeking efficient and durable solutions for their networking needs. Upgrade your system today with the SN65HVD230QDG4 and experience the difference in quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term use.

Power Supplies (V): 3.3

Operates at a standard 3.3V power supply, making it compatible with various systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold finish ensures excellent conductivity and corrosion resistance.

Technology: BICMOS

Utilizes BICMOS technology for efficient performance and power consumption.

Data Rate: 1 Mbps

Supports high data rates of up to 1 Mbps for fast and reliable connectivity.

Technical Specifications

Network Interfaces SN65HVD230QDG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.017 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN65HVD230QDG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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