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XA1243FPBGABL

Texas Instruments

XA1243FPBGABL by Texas Instruments

Texas Instruments XA1243FPBGABL is a network interface IC with 161 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. Features include thin profile, fine pitch, and AEC-Q100 screening level.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,775 parts In-Stock

1+ parts

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2,775

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Digiode

USA . 954 parts In-Stock

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954

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 149 parts In-Stock

1+ parts

$6.418

100+ parts

-

1k+ parts

$7.163

10k+ parts

-

149

$6.418

-

$7.163

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DigiPath Technology Company

USA . 1,159 parts In-Stock

1+ parts

$7.067

100+ parts

$6.501

1k+ parts

-

10k+ parts

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1,159

$7.067

$6.501

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ChromeModa Solutions

Germany . 4,610 parts In-Stock

1+ parts

$7.211

100+ parts

$5.913

1k+ parts

-

10k+ parts

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4,610

$7.211

$5.913

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IDEA Electronic Components Group

UK . 394 parts In-Stock

1+ parts

$7.211

100+ parts

-

1k+ parts

$6.490

10k+ parts

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394

$7.211

-

$6.490

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$11.941

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271

$11.941

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One Stop Electronics

USA . 648 parts In-Stock

1+ parts

$62.000

100+ parts

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648

$62.000

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A-Z Elektronik GmbH

Germany . 2,628 parts In-Stock

1+ parts

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2,628

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Corphita

USA . 287 parts In-Stock

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287

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Overview

Unleash the power of seamless connectivity with the XA1243FPBGABL by Texas Instruments. Designed with precision and excellence, this network interface module boasts top-tier quality and reliability that only a manufacturer like Texas Instruments can deliver. Perfect for automotive applications and beyond, this product offers unparalleled value and benefits to customers seeking cutting-edge technology in a compact package. Elevate your projects with the XA1243FPBGABL and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the network interface, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

Complies with automotive industry standards for quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Compact design that can fit in tight spaces on the PCB, optimizing layout and space usage.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance, ideal for automotive environments with varying temperature conditions.

Nominal Supply Voltage: 1.2 V

Operates efficiently at a low supply voltage, helping to reduce power consumption and heat dissipation.

Technical Specifications

Network Interfaces XA1243FPBGABL attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B161

Length:

10.4 mm

No. of Functions:

1

No. of Terminals:

161

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.17 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

10.4 mm

Trade Compliance

XA1243FPBGABL Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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