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VSC8562XKS-14

Microchip Technology

VSC8562XKS-14 by Microchip Technology

VSC8562XKS-14 by Microchip: 1000 Mbps Ethernet transceiver with 2 transceivers. Operates at -40 to 125 °C, suitable for automotive applications. Package style: grid array, surface mountable, with 256 terminals in a square shape.

Median Price

$45.100

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 75 parts In-Stock

1+ parts

$45.100

100+ parts

$34.170

1k+ parts

$31.570

10k+ parts

$29.930

75

$45.100

$34.170

$31.570

$29.930

DigiKey

USA . 56 parts In-Stock

1+ parts

$45.100

100+ parts

$36.300

1k+ parts

-

10k+ parts

-

56

$45.100

$36.300

-

-

Mouser Electronics

USA . 8 parts In-Stock

1+ parts

$45.100

100+ parts

-

1k+ parts

-

10k+ parts

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8

$45.100

-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 89 parts In-Stock

1+ parts

$41.490

100+ parts

$38.210

1k+ parts

$35.410

10k+ parts

-

89

$41.490

$38.210

$35.410

-

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

-

100+ parts

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 167 parts In-Stock

1+ parts

$10.520

100+ parts

-

1k+ parts

-

10k+ parts

-

167

$10.520

-

-

-

Advanced Electronics

New Zealand . 70 parts In-Stock

1+ parts

$12.474

100+ parts

$11.351

1k+ parts

$10.229

10k+ parts

-

70

$12.474

$11.351

$10.229

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Vigor

Singapore . 360 parts In-Stock

1+ parts

$31.060

100+ parts

-

1k+ parts

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10k+ parts

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360

$31.060

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Ampacity Inc.

Singapore . 216 parts In-Stock

1+ parts

$38.340

100+ parts

-

1k+ parts

-

10k+ parts

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216

$38.340

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-

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,000

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Fulton Briggs Corp.

USA . 2,808 parts In-Stock

1+ parts

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2,808

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Netroflash

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Unleash the power of high-speed networking with the VSC8562XKS-14 by Microchip Technology. As a leader in network interfaces, Microchip Technology ensures top quality and reliability in every product they create. The VSC8562XKS-14 is designed to meet the demands of automotive applications, offering a data rate of 1000 Mbps with two transceivers for seamless connectivity. With its compact square package shape and surface mount capabilities, this Ethernet transceiver provides unmatched performance and value for customers looking to optimize their network infrastructure. Elevate your networking experience with the VSC8562XKS-14 and stay connected at lightning speed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and lightweight, ideal for use in various environments.

Surface Mount: YES

The surface mount feature allows for easy and secure installation onto a circuit board, ensuring stability during operation.

No. of Terminals: 256

Having 256 terminals provides ample connectivity options, allowing for versatile networking configurations.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the product can withstand intense heat conditions, suitable for automotive and industrial applications.

No. of Transceivers: 2

The presence of two transceivers enhances connectivity and network performance, making the product efficient for data transmission.

Data Rate: 1000 Mbps

The high data rate of 1000 Mbps ensures fast and reliable network connectivity, ideal for high-speed data transfer applications.

Technical Specifications

Network Interfaces VSC8562XKS-14 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.8 mm

Maximum Supply Current:

1130 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Trade Compliance

VSC8562XKS-14 Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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