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TLK3114SAGNT

Texas Instruments

TLK3114SAGNT by Texas Instruments

TLK3114SAGNT by Texas Instruments is a Network Interfaces IC with 289 terminals, operating at 0-70°C. It supports circuits for telecom applications, with a supply voltage of 2.5V and CMOS technology. The package is square-shaped, measuring 19mm in width and length, suitable for surface mount assembly.

Median Price

$71.696

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,214 parts In-Stock

1+ parts

-

100+ parts

$63.730

1k+ parts

$57.020

10k+ parts

$53.660

1,214

-

$63.730

$57.020

$53.660

DigiKey

USA . 1,214 parts In-Stock

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1,214

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Verical

USA . 828 parts In-Stock

1+ parts

-

100+ parts

$79.662

1k+ parts

$71.275

10k+ parts

$67.075

828

-

$79.662

$71.275

$67.075

Distributors (In-Stock)

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Digiode

USA . 4,668 parts In-Stock

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$67.260

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4,668

$67.260

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DigiKey Marketplace

USA . 1,214 parts In-Stock

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$73.630

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1,214

$73.630

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Vyrian

USA . 5,725 parts In-Stock

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5,725

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Prism Electronics

USA . 61 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 50 parts In-Stock

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50

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R&J Components

USA . 24 parts In-Stock

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24

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Electronic Expediters

USA . 7 parts In-Stock

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LWI Electronics Inc

India . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,219 parts In-Stock

1+ parts

$13.151

100+ parts

-

1k+ parts

$13.657

10k+ parts

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1,219

$13.151

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$13.657

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IDEA Electronic Components Group

UK . 545 parts In-Stock

1+ parts

$14.776

100+ parts

$14.037

1k+ parts

$13.298

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545

$14.776

$14.037

$13.298

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ChromeModa Solutions

Germany . 361 parts In-Stock

1+ parts

$14.776

100+ parts

$12.116

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361

$14.776

$12.116

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Ampacity Inc.

Singapore . 703 parts In-Stock

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$60.180

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703

$60.180

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Corphita

USA . 1,708 parts In-Stock

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$63.720

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1,708

$63.720

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QUARKTWIN TECHNOLOGY LTD

USA . 6,924 parts In-Stock

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6,924

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DigiPath Technology Company

USA . 1,838 parts In-Stock

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$13.322

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1,838

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$13.322

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Metaverse IC Inc.

Canada . 189 parts In-Stock

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189

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Perfect Parts

USA . 143 parts In-Stock

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143

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Microchip USA

USA . 127 parts In-Stock

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127

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Overview

Enhance your network interfaces with the TLK3114SAGNT by Texas Instruments, a top-quality product that offers unmatched performance and reliability. Designed with precision and expertise, this innovative solution caters to various applications in the telecom industry. Experience seamless connectivity and superior data transmission with this advanced technology. Elevate your networking capabilities and stay ahead of the game. Choose Texas Instruments for cutting-edge solutions that deliver value and efficiency. Elevate your networking capabilities and stay ahead of the game with TLK3114SAGNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material which ensures the product is sturdy and helps to reduce overall weight.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and offering a clean appearance.

Package Shape: SQUARE

Square shape is commonly used in electronic components, making it compatible with various applications.

Power Supplies (V): 1.5/2.5, 2.5

Offers flexibility in power requirements for different setups, making it versatile for various projects.

No. of Terminals: 289

High number of terminals allows for connectivity to multiple devices and integration into complex systems.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures, suitable for different environments and applications.

Minimum Operating Temperature: 0 °C

Can withstand low temperatures, ensuring reliability in chilly environments.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and connection in a setup.

Maximum Seated Height: 2 mm

Low seated height saves space and allows for compact designs.

Width: 19 mm

Standard width size that fits well in most PCB layouts.

Length: 19 mm

Standard length size for easy integration into electronic assemblies.

Temperature Grade: COMMERCIAL

Meets commercial standards for temperature range, suitable for regular commercial applications.

Technology: CMOS

CMOS technology provides low power consumption, ideal for energy-efficient devices.

Terminal Form: BALL

Ball terminals offer secure connections and are commonly used in high-speed applications.

Telecom IC Type: SUPPORT CIRCUIT

Support circuit ensures stable telecom operations and connectivity.

Nominal Supply Voltage: 2.5 V

Steady supply voltage for consistent performance.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high-density integration on PCBs.

Technical Specifications

Network Interfaces TLK3114SAGNT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.5/2.5,2.5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Trade Compliance

TLK3114SAGNT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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