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TLK3114SCGPV

Texas Instruments

TLK3114SCGPV by Texas Instruments

TLK3114SCGPV by Texas Instruments is a network interface with 289 terminals, operating at 0-70°C. It has a supply voltage of 2.5V and consumes 0.65mA current. Ideal for telecom support circuits, this CMOS technology IC comes in a square grid array package for surface mounting applications.

Median Price

$69.030

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,346 parts In-Stock

1+ parts

-

100+ parts

$61.360

1k+ parts

$54.900

10k+ parts

$51.670

14,346

-

$61.360

$54.900

$51.670

DigiKey

USA . 14,346 parts In-Stock

1+ parts

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14,346

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-

-

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Verical

USA . 13,842 parts In-Stock

1+ parts

-

100+ parts

$76.700

1k+ parts

$68.625

10k+ parts

$64.588

13,842

-

$76.700

$68.625

$64.588

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,352 parts In-Stock

1+ parts

$64.771

100+ parts

-

1k+ parts

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-

1,352

$64.771

-

-

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Vyrian

USA . 3,814 parts In-Stock

1+ parts

$68.180

100+ parts

-

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3,814

$68.180

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DigiKey Marketplace

USA . 14,346 parts In-Stock

1+ parts

$70.910

100+ parts

-

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10k+ parts

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14,346

$70.910

-

-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,096 parts In-Stock

1+ parts

$5.805

100+ parts

-

1k+ parts

$6.595

10k+ parts

-

1,096

$5.805

-

$6.595

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DigiPath Technology Company

USA . 1,270 parts In-Stock

1+ parts

$6.392

100+ parts

$5.880

1k+ parts

-

10k+ parts

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1,270

$6.392

$5.880

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ChromeModa Solutions

Germany . 6,524 parts In-Stock

1+ parts

$6.522

100+ parts

$5.348

1k+ parts

-

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6,524

$6.522

$5.348

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IDEA Electronic Components Group

UK . 1,156 parts In-Stock

1+ parts

$6.522

100+ parts

-

1k+ parts

$5.870

10k+ parts

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1,156

$6.522

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$5.870

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Corphita

USA . 4,864 parts In-Stock

1+ parts

$61.362

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4,864

$61.362

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QUARKTWIN TECHNOLOGY LTD

USA . 8,102 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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5,000

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Microchip USA

USA . 3,018 parts In-Stock

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3,018

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Perfect Parts

USA . 228 parts In-Stock

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228

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Overview

Discover the cutting-edge TLK3114SCGPV by Texas Instruments, a top-tier manufacturer known for superior quality and reliability. As part of the Network Interfaces category, this product offers seamless connectivity solutions for various applications. With its advanced technology and commercial-grade temperature range, customers can trust in the TLK3114SCGPV to deliver optimal performance. Experience the value of effortless integration and enhanced functionality with this standout telecom IC type, designed to exceed expectations. Step up your network game with Texas Instruments' TLK3114SCGPV.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight, durable, and cost-effective, making this product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation on PCBs, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

The square package shape helps optimize space on the PCB and allows for efficient component placement.

Power Supplies (V): 2.5

Operating at 2.5V makes this product energy-efficient and suitable for a wide range of applications.

No. of Terminals: 289

Having a high number of terminals allows for more connectivity options and flexibility in designing network interfaces.

Package Style: GRID ARRAY

The grid array package style offers high signal density and excellent electrical performance, making it ideal for networking applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can withstand extended use in various environments without overheating.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions, making it suitable for a wide range of deployments.

Terminal Finish: TIN LEAD

Tin lead terminal finish is known for its solderability and reliability, ensuring strong connections and overall product durability.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB placement and maintenance, enhancing overall usability and accessibility.

Maximum Seated Height: 2 mm

With a low seated height, this product enables a compact design and helps reduce overall system profile.

Width: 19 mm

The moderate width of 19mm strikes a balance between space efficiency and terminal accessibility, making it easy to integrate into various setups.

Maximum Time At Peak Reflow Temperature (s): 20

Being able to withstand the peak reflow temperature for 20 seconds ensures effective soldering and enhances overall product reliability.

Peak Reflow Temperature °C: 220

With a high peak reflow temperature of 220°C, this product can withstand the reflow process without thermal degradation, ensuring a reliable solder joint.

Length: 19 mm

The length of 19mm provides a compact form factor, making this product suitable for space-constrained applications.

Temperature Grade: COMMERCIAL

A commercial temperature grade indicates that this product is suitable for standard operating conditions, offering reliable performance in typical environments.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of systems, making this product energy-efficient and versatile.

Terminal Form: BALL

Ball terminal form helps in easy installation and rework, providing a reliable electrical connection for efficient networking functionality.

Maximum Supply Current: 0.65 mA

The low maximum supply current of 0.65mA indicates energy efficiency and helps in minimizing power consumption in network interfaces.

Telecom IC Type: SUPPORT CIRCUIT

Support circuit telecom IC type enhances the performance and reliability of network interfaces, ensuring seamless communication and connectivity.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V ensures compatibility with standard power sources and enhances the efficiency of the network interface.

Terminal Pitch: 1 mm

A terminal pitch of 1mm allows for precise and compact connections, enabling high-density integration and efficient signal transmission.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that this product is suitable for standard moisture exposure levels in manufacturing and usage environments.

Technical Specifications

Network Interfaces TLK3114SCGPV attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e0

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.65 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

19 mm

Trade Compliance

TLK3114SCGPV Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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