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TLK3104SCIGNT

Texas Instruments

TLK3104SCIGNT by Texas Instruments

TLK3104SCIGNT by Texas Instruments is a CMOS Ethernet transceiver with 4 functions. It features a grid array package style, 289 terminals, and 1mm terminal pitch. Ideal for network interfaces, it is surface mountable and has a compact size of 19x19mm for various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,548 parts In-Stock

1+ parts

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5,548

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Digiode

USA . 3,365 parts In-Stock

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3,365

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 458 parts In-Stock

1+ parts

$9.162

100+ parts

-

1k+ parts

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458

$9.162

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Parana Technologies

USA . 446 parts In-Stock

1+ parts

$13.671

100+ parts

$1,269.587

1k+ parts

$12.304

10k+ parts

-

446

$13.671

$1,269.587

$12.304

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DigiPath Technology Company

USA . 421 parts In-Stock

1+ parts

$15.054

100+ parts

$13.849

1k+ parts

-

10k+ parts

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421

$15.054

$13.849

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IDEA Electronic Components Group

UK . 2,191 parts In-Stock

1+ parts

$15.361

100+ parts

$14.593

1k+ parts

$13.825

10k+ parts

-

2,191

$15.361

$14.593

$13.825

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ChromeModa Solutions

Germany . 1,847 parts In-Stock

1+ parts

$15.361

100+ parts

$12.596

1k+ parts

-

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1,847

$15.361

$12.596

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One Stop Electronics

USA . 277 parts In-Stock

1+ parts

$977.000

100+ parts

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277

$977.000

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Corphita

USA . 2,161 parts In-Stock

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2,161

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Overview

Unlock the power of seamless networking with the TLK3104SCIGNT by Texas Instruments. As a leader in cutting-edge technology, Texas Instruments delivers top-quality network interface solutions for a wide range of applications. With its innovative design and reliable performance, this Ethernet transceiver offers unparalleled value and benefits to customers. Say goodbye to connectivity issues and experience smooth, fast data transfer with the TLK3104SCIGNT. Elevate your networking experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying assembly processes.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional components, simplifying the design and potentially lowering costs.

Package Shape: SQUARE

The square package shape makes it easier to align and place on a circuit board, improving overall assembly accuracy.

No. of Terminals: 289

A high number of terminals allows for more connections and functionality, making this product versatile and adaptable to various networking requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides better thermal dissipation and electrical performance, enhancing the overall reliability and longevity of the product.

Terminal Position: BOTTOM

Having terminals at the bottom facilitates easier and more secure soldering, improving the overall stability and performance of the component.

Maximum Seated Height: 2 mm

With a low seated height, this product is suitable for applications where space is limited, allowing for greater flexibility in design.

Width: 19 mm

The compact width of 19mm ensures that this product can fit into tight spaces without sacrificing functionality or performance.

Length: 19 mm

The matching length of 19mm complements the width, making it a compact and space-efficient choice for network interfaces.

Technology: CMOS

Using CMOS technology in this product ensures low power consumption, high speed, and compatibility with a wide range of devices and systems.

Terminal Form: BALL

The ball terminal form enhances the electrical connection stability and performance, ensuring reliable data transmission in network applications.

Telecom IC Type: ETHERNET TRANSCEIVER

Being an Ethernet transceiver makes this product suitable for networking applications, allowing for high-speed data transmission and reliable connectivity.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, this product provides precise and secure connections, enhancing the overall performance and reliability of the network interface.

Technical Specifications

Network Interfaces TLK3104SCIGNT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

No. of Functions:

4

No. of Terminals:

289

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Trade Compliance

TLK3104SCIGNT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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