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TLK3104SCGNT

Texas Instruments

TLK3104SCGNT by Texas Instruments

TLK3104SCGNT by Texas Instruments is an Ethernet transceiver IC with CMOS technology. It operates b/w -40°C to 75°C, with a supply voltage of 2.5V. This network interface has a grid array package style, square shape, and 289 terminals for high-speed data communication applications.

Median Price

$127.452

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 478 parts In-Stock

1+ parts

-

100+ parts

$113.290

1k+ parts

$101.360

10k+ parts

$95.400

478

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$113.290

$101.360

$95.400

DigiKey

USA . 478 parts In-Stock

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-

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478

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Verical

USA . 478 parts In-Stock

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$141.613

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478

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$141.613

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Distributors (In-Stock)

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Digiode

USA . 4,883 parts In-Stock

1+ parts

$119.576

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4,883

$119.576

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Vyrian

USA . 9,009 parts In-Stock

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9,009

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Prism Electronics

USA . 17 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,663 parts In-Stock

1+ parts

$7.450

100+ parts

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$7.939

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1,663

$7.450

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$7.939

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DigiPath Technology Company

USA . 2,003 parts In-Stock

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$8.204

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$7.547

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2,003

$8.204

$7.547

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IDEA Electronic Components Group

UK . 1,933 parts In-Stock

1+ parts

$8.371

100+ parts

$7.952

1k+ parts

$7.534

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-

1,933

$8.371

$7.952

$7.534

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ChromeModa Solutions

Germany . 419 parts In-Stock

1+ parts

$8.371

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$6.864

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419

$8.371

$6.864

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Ampacity Inc.

Singapore . 102 parts In-Stock

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$106.990

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102

$106.990

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Corphita

USA . 4,509 parts In-Stock

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$113.283

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4,509

$113.283

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Component Stockers USA

USA . 1,085 parts In-Stock

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$129.500

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$121.730

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1,085

$129.500

$121.730

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Microchip USA

USA . 452 parts In-Stock

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Perfect Parts

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Overview

Experience seamless connectivity like never before with the TLK3104SCGNT by Texas Instruments. Crafted with precision and reliability in mind, this network interface device offers unparalleled performance for a wide range of applications. From industrial automation to telecommunications, this Ethernet transceiver ensures fast and secure data transmission, making it a valuable addition to any project. Trust in Texas Instruments to deliver top-notch quality and advanced technology, setting the standard for networking solutions in the industry. Elevate your connectivity game with the TLK3104SCGNT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, perfect for networking applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation of the network interface on PCBs, saving time and labor costs.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it ideal for space-constrained electronic designs.

No. of Terminals: 289

With a high number of terminals, this network interface can support complex networking functionalities and connections.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the network interface to function in a wide range of temperature environments, enhancing its versatility.

Technology: CMOS

Utilizing CMOS technology enables efficient power consumption and high-speed performance, essential for networking applications.

Nominal Supply Voltage: 2.5 V

The low nominal supply voltage of 2.5V reduces power consumption and heat generation, contributing to energy efficiency.

Terminal Pitch: 1 mm

The small terminal pitch of 1mm allows for high-density mounting, enabling more terminals to be packed in a limited space.

Technical Specifications

Network Interfaces TLK3104SCGNT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Trade Compliance

TLK3104SCGNT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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