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TLK3114SCZPV

Texas Instruments

TLK3114SCZPV by Texas Instruments

TLK3114SCZPV by Texas Instruments is a Network Interfaces IC with 289 terminals, operating at 2.5V. It features a grid array package style, CMOS technology, and supports circuit applications in commercial temperature grades.

Median Price

$65.734

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,524 parts In-Stock

1+ parts

-

100+ parts

$58.430

1k+ parts

$52.280

10k+ parts

$49.210

4,524

-

$58.430

$52.280

$49.210

DigiKey

USA . 4,524 parts In-Stock

1+ parts

-

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-

1k+ parts

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4,524

-

-

-

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Verical

USA . 4,456 parts In-Stock

1+ parts

-

100+ parts

$73.037

1k+ parts

$65.350

10k+ parts

$61.513

4,456

-

$73.037

$65.350

$61.513

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,044 parts In-Stock

1+ parts

$61.684

100+ parts

-

1k+ parts

-

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-

1,044

$61.684

-

-

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Vyrian

USA . 2,685 parts In-Stock

1+ parts

$64.930

100+ parts

-

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-

10k+ parts

-

2,685

$64.930

-

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DigiKey Marketplace

USA . 4,524 parts In-Stock

1+ parts

$67.530

100+ parts

-

1k+ parts

-

10k+ parts

-

4,524

$67.530

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 402 parts In-Stock

1+ parts

$5.698

100+ parts

-

1k+ parts

$6.492

10k+ parts

-

402

$5.698

-

$6.492

-

DigiPath Technology Company

USA . 1,038 parts In-Stock

1+ parts

$6.274

100+ parts

$5.772

1k+ parts

-

10k+ parts

-

1,038

$6.274

$5.772

-

-

ChromeModa Solutions

Germany . 6,242 parts In-Stock

1+ parts

$6.402

100+ parts

$5.250

1k+ parts

-

10k+ parts

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6,242

$6.402

$5.250

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IDEA Electronic Components Group

UK . 2,235 parts In-Stock

1+ parts

$6.402

100+ parts

-

1k+ parts

$5.762

10k+ parts

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2,235

$6.402

-

$5.762

-

Advanced Electronics

New Zealand . 64 parts In-Stock

1+ parts

$18.645

100+ parts

$16.967

1k+ parts

$15.289

10k+ parts

-

64

$18.645

$16.967

$15.289

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Corphita

USA . 4,134 parts In-Stock

1+ parts

$58.437

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4,134

$58.437

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QUARKTWIN TECHNOLOGY LTD

USA . 14,983 parts In-Stock

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14,983

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 230 parts In-Stock

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230

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Perfect Parts

USA . 195 parts In-Stock

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195

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Overview

Elevate your network interfaces with the TLK3114SCZPV by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. This versatile device is perfect for a wide range of applications, offering seamless connectivity and enhanced performance. Say goodbye to connectivity issues and hello to smooth operations with the TLK3114SCZPV. Upgrade your network today and experience the unparalleled value and benefits that this exceptional product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and lightweight design for easy handling and installation.

Surface Mount: YES

Allows for easy and secure installation on circuit boards.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even under high temperature conditions.

No. of Terminals: 289

Provides a large number of connection points for versatile networking capabilities.

Technology: CMOS

Uses CMOS technology for efficient power consumption and high-speed processing.

Nominal Supply Voltage: 2.5 V

Operates at a standard voltage level for compatibility with most systems.

Technical Specifications

Network Interfaces TLK3114SCZPV attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

19 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.65 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Trade Compliance

TLK3114SCZPV Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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