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STULPI01ATBR

STMicroelectronics

STULPI01ATBR by STMicroelectronics

STULPI01ATBR by STMicroelectronics is a robust network interface with a max operating temp of 85 °C and supports industrial applications. It features a compact 3.6mm square package with 36 terminals, ensuring reliable connectivity. Ideal for telecom circuits, it operates at a nominal voltage of 1.8V.

Median Price

$6.262

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 995 parts In-Stock

1+ parts

$6.262

100+ parts

-

1k+ parts

-

10k+ parts

-

995

$6.262

-

-

-

Rochester

USA . 17,189 parts In-Stock

1+ parts

-

100+ parts

$8.510

1k+ parts

$7.620

10k+ parts

$7.170

17,189

-

$8.510

$7.620

$7.170

Chip1Stop

Japan . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$4.909

6,000

-

-

-

$4.909

Verical

USA . 995 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

995

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,585 parts In-Stock

1+ parts

$5.795

100+ parts

-

1k+ parts

-

10k+ parts

-

2,585

$5.795

-

-

-

IBS Electronics

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$10.617

6,000

-

-

-

$10.617

Vyrian

USA . 3,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,877

-

-

-

-

NAC Semi

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$5.500

3,000

-

-

-

$5.500

Anansix

USA . 2,727 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,727

-

-

-

-

Cyclops Electronics Ltd

UK . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,775 parts In-Stock

1+ parts

$5.490

100+ parts

-

1k+ parts

-

10k+ parts

-

3,775

$5.490

-

-

-

Component Stockers USA

USA . 7,515 parts In-Stock

1+ parts

$6.260

100+ parts

$6.080

1k+ parts

$5.990

10k+ parts

-

7,515

$6.260

$6.080

$5.990

-

Andel Nordic

Denmark . 508 parts In-Stock

1+ parts

$7.851

100+ parts

-

1k+ parts

$7.537

10k+ parts

$7.537

508

$7.851

-

$7.537

$7.537

IDEA Electronic Components Group

UK . 118 parts In-Stock

1+ parts

$8.392

100+ parts

-

1k+ parts

$7.553

10k+ parts

-

118

$8.392

-

$7.553

-

Microchip USA

USA . 1,713 parts In-Stock

1+ parts

$10.673

100+ parts

-

1k+ parts

-

10k+ parts

-

1,713

$10.673

-

-

-

AZTECH Wire

Italy . 852 parts In-Stock

1+ parts

$13.020

100+ parts

-

1k+ parts

-

10k+ parts

-

852

$13.020

-

-

-

MKK Technologies

India . 1,351 parts In-Stock

1+ parts

$15.781

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

$15.781

-

-

-

DigiPath Technology Company

USA . 1,351 parts In-Stock

1+ parts

$15.781

100+ parts

-

1k+ parts

-

10k+ parts

-

1,351

$15.781

-

-

-

Authorized Procurement Solutions

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 20,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,077

-

-

-

-

Metaverse IC Inc.

Canada . 11,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,749

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,975

-

-

-

-

Perfect Parts

USA . 3,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,361

-

-

-

-

Parana Technologies

USA . 2,053 parts In-Stock

1+ parts

-

100+ parts

$10.034

1k+ parts

-

10k+ parts

-

2,053

-

$10.034

-

-

Overview

Unlock seamless connectivity with the STULPI01ATBR from STMicroelectronics, a leader in innovative network interfaces. Designed for resilience and efficiency, this product thrives in diverse industrial environments, operating reliably from -40 °C to 85 °C. Its compact, surface-mount design ensures easy integration into your systems, enhancing performance while minimizing space. Elevate your applications with unparalleled quality and support from a trusted manufacturer, maximizing value and reliability for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for quick and efficient assembly, leading to lower manufacturing costs and improved reliability.

Package Shape: SQUARE

The square shape optimizes space on printed circuit boards (PCBs), allowing for efficient layout and component density.

No. of Terminals: 36

A higher number of terminals increases the versatility and functionality of the network interface, accommodating complex connections.

Package Style (Meter): GRID ARRAY

Grid array packaging enhances electrical performance and simplifies the design, facilitating a better thermal and electrical connection.

Maximum Operating Temperature: 85 °C

This high maximum operating temperature ensures reliability in demanding environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this product suitable for use in extreme conditions, enhancing its versatility.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The robust terminal finish ensures excellent conductivity and resistance to corrosion, enhancing overall performance and longevity.

Terminal Position: BOTTOM

Bottom terminal positioning provides enhanced connectivity options on the PCB, optimizing routing and reducing signal interference.

Maximum Seated Height: 1.16 mm

A low seated height allows for compact design and minimizes the overall profile of the assembly, making it easier to fit in tight spaces.

Width: 3.6 mm

Narrow width enhances placement flexibility on the PCB, allowing for efficient use of space in compact designs.

Maximum Time At Peak Reflow Temperature: 30 s

Short peak reflow times reduce the risk of component damage during manufacturing, enhancing reliability and yield.

Peak Reflow Temperature: 260 °C

High peak reflow temperature capability ensures compatibility with modern soldering processes, leading to better assembly outcomes.

Length: 3.6 mm

Compact length aids in creating smaller designs, making it ideal for modern electronic devices requiring miniaturization.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the product can perform reliably in harsh industrial environments.

Terminal Form: BALL

Ball terminal form enhances solder joint reliability, improving the performance and lifespan of the device.

Telecom IC Type: SUPPORT CIRCUIT

Being a support circuit type allows integration into various telecommunications applications, enhancing system functionality.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage contributes to energy efficiency, making it suitable for battery-powered applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density connections, making it ideal for compact and advanced electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, ensuring that proper handling during storage and assembly is manageable.

Technical Specifications

Network Interfaces STULPI01ATBR attributes and parameters. Explore more Network Interfaces devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B36

JESD-609 Code:

e1

Length:

3.6 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.16 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.6 mm

Trade Compliance

STULPI01ATBR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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