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DLKPC192SGNT

Texas Instruments

DLKPC192SGNT by Texas Instruments

DLKPC192SGNT by Texas Instruments is an Ethernet transceiver IC with 289 terminals in a square grid array package. Operating at temperatures from 0 to 70°C, it has power supplies of 1.8V, 2.5V, and 3.3V for commercial-grade applications. Its CMOS technology and ball terminal form make it suitable for networking interfaces requiring high performance in compact spaces.

Median Price

$88.605

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 422 parts In-Stock

1+ parts

-

100+ parts

$78.760

1k+ parts

$70.470

10k+ parts

$66.330

422

-

$78.760

$70.470

$66.330

DigiKey

USA . 422 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

422

-

-

-

-

Verical

USA . 351 parts In-Stock

1+ parts

-

100+ parts

$98.450

1k+ parts

$88.088

10k+ parts

$82.912

351

-

$98.450

$88.088

$82.912

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,558 parts In-Stock

1+ parts

$83.134

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$83.134

-

-

-

DigiKey Marketplace

USA . 422 parts In-Stock

1+ parts

$91.010

100+ parts

-

1k+ parts

-

10k+ parts

-

422

$91.010

-

-

-

Vyrian

USA . 8,248 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,248

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 171 parts In-Stock

1+ parts

$0.900

100+ parts

-

1k+ parts

-

10k+ parts

-

171

$0.900

-

-

-

Northwest PG Solutions

USA . 1,140 parts In-Stock

1+ parts

$0.990

100+ parts

-

1k+ parts

-

10k+ parts

-

1,140

$0.990

-

-

-

Parana Technologies

USA . 1,194 parts In-Stock

1+ parts

$14.519

100+ parts

-

1k+ parts

$14.957

10k+ parts

-

1,194

$14.519

-

$14.957

-

DigiPath Technology Company

USA . 1,497 parts In-Stock

1+ parts

$15.987

100+ parts

$14.708

1k+ parts

-

10k+ parts

-

1,497

$15.987

$14.708

-

-

ChromeModa Solutions

Germany . 6,024 parts In-Stock

1+ parts

$16.313

100+ parts

$13.377

1k+ parts

-

10k+ parts

-

6,024

$16.313

$13.377

-

-

IDEA Electronic Components Group

UK . 875 parts In-Stock

1+ parts

$16.313

100+ parts

$15.497

1k+ parts

$14.682

10k+ parts

-

875

$16.313

$15.497

$14.682

-

Corphita

USA . 1,498 parts In-Stock

1+ parts

$78.759

100+ parts

-

1k+ parts

-

10k+ parts

-

1,498

$78.759

-

-

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Component Stockers USA

USA . 771 parts In-Stock

1+ parts

$88.510

100+ parts

$83.200

1k+ parts

-

10k+ parts

-

771

$88.510

$83.200

-

-

Microchip USA

USA . 499 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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499

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-

-

-

Overview

Experience seamless connectivity with the DLKPC192SGNT by Texas Instruments, a top-of-the-line Network Interface component designed to exceed industry standards. Manufactured by Texas Instruments, known for its commitment to quality and innovation, this product offers unparalleled reliability and performance. Whether you're looking to enhance your networking capabilities or streamline communication processes, this Ethernet transceiver is the perfect solution. Say goodbye to connectivity issues and hello to a world of endless possibilities with the DLKPC192SGNT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for a network interface that may need to be moved or transported.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Power Supplies (V): 1.8,2.5,3.3

The compatibility with multiple power supply voltages provides flexibility in design and allows for integration into various systems.

No. of Terminals: 289

With a high number of terminals, this network interface can support a wide range of connections and functions, making it versatile for different applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in challenging environments or during heavy usage.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows the product to function effectively in colder conditions without compromising performance.

Technology: CMOS

The use of CMOS technology ensures efficient power consumption and high-speed operation, making the product energy-efficient and reliable.

Telecom IC Type: ETHERNET TRANSCEIVER

Being an Ethernet transceiver, this product is designed specifically for networking applications, ensuring seamless communication and data transfer within a network.

Technical Specifications

Network Interfaces DLKPC192SGNT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

No. of Functions:

1

No. of Terminals:

289

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Power Supplies (V):

1.8,2.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

19 mm

Trade Compliance

DLKPC192SGNT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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