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VSC8584XKS-14

Microchip Technology

VSC8584XKS-14 by Microchip Technology

VSC8584XKS-14 by Microchip: 4 Ethernet transceivers, 1000 Mbps data rate. Automotive grade with -40 to 125 °C operating temp range. Square package with 256 terminals for network interfaces in surface mount applications.

Median Price

$113.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 601 parts In-Stock

1+ parts

$113.630

100+ parts

$91.475

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601

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$91.475

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Chip Stock

USA . 3,487 parts In-Stock

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Vyrian

USA . 3,132 parts In-Stock

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Cyclops Electronics Ltd

UK . 276 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 333 parts In-Stock

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$11.258

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333

$11.258

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Corohmni

South Africa . 714 parts In-Stock

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$14.339

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714

$14.339

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Vigor

Singapore . 3,186 parts In-Stock

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$65.520

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Ampacity Inc.

Singapore . 6,257 parts In-Stock

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$79.070

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Microchip USA

USA . 2,075 parts In-Stock

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$170.445

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Lixinc

USA . 9,933 parts In-Stock

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Continental Prestige Electronics

USA . 4,775 parts In-Stock

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West Coast Incorporated

USA . 4,088 parts In-Stock

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Argo Parts USA

USA . 1,419 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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iodParts Technologies Inc.

India . 50 parts In-Stock

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Overview

Experience seamless and reliable network connectivity with the VSC8584XKS-14 by Microchip Technology. As a trusted leader in the industry, Microchip Technology delivers high-quality products that exceed expectations. This Ethernet transceiver offers exceptional performance, making it ideal for automotive applications where reliability is crucial. With its advanced features and durable construction, the VSC8584XKS-14 provides value and peace of mind to customers looking for top-of-the-line network interfaces. Trust Microchip Technology to deliver innovative solutions for all your networking needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

No. of Terminals: 256

Having a high number of terminals allows for versatile connectivity options and compatibility with different systems.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures the product can function optimally even in extreme environmental conditions.

Terminal Finish: TIN SILVER COPPER

This finish provides excellent conductivity and corrosion resistance, ensuring reliable signal transmission.

Width: 17 mm

The compact width makes the product space-saving and suitable for installations where space is limited.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the product meets stringent quality standards and can withstand harsh automotive environments.

Data Rate: 1000 Mbps

With a high data rate, this product enables fast and reliable network connectivity for various applications.

Technical Specifications

Network Interfaces VSC8584XKS-14 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

Data Rate:

1000 Mbps

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

No. of Functions:

1

No. of Terminals:

256

No. of Transceivers:

4

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

1.8 mm

Maximum Supply Current:

1890 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

VSC8584XKS-14 Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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