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PX1011BI-EL1/G,557

NXP Semiconductors

PX1011BI-EL1/G,557 by NXP Semiconductors

NXP Semiconductors' PX1011BI-EL1/G,557 is a network interface with 81 terminals in a square package. It operates b/w -40 to 85°C and has a low profile of 1.6mm height. Ideal for industrial telecom applications requiring a 1.2V supply voltage and fine pitch grid array style.

Median Price

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Lifecycle Status

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6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 1,715 parts In-Stock

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Vyrian

USA . 6,651 parts In-Stock

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Anansix

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Flip Electronics

USA . 1,455 parts In-Stock

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Digiode

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Nova Conductors

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Microchip USA

USA . 327 parts In-Stock

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AZTECH Wire

Italy . 265 parts In-Stock

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Overview

Unlock the potential of your network interfaces with the PX1011BI-EL1/G,557 by NXP Semiconductors. Known for their top-notch quality and cutting-edge technology, NXP Semiconductors delivers a product that exceeds expectations in various applications. This innovative interface circuit offers unparalleled value and benefits, providing customers with reliable performance, efficiency, and flexibility. Say goodbye to outdated technology and elevate your network experience with the PX1011BI-EL1/G,557.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the network interface, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation on circuit boards, making it convenient for manufacturers to integrate into their products.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a variety of operating environments.

Terminal Form: BALL

Ball terminal form ensures a secure connection and stable performance for the network interface.

Nominal Supply Voltage: 1.2 V

Low supply voltage requirement helps in reducing power consumption, making it energy-efficient.

Technical Specifications

Network Interfaces PX1011BI-EL1/G,557 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B81

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

81

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Trade Compliance

PX1011BI-EL1/G,557 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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