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PX1011B-EL1/Q900

NXP Semiconductors

PX1011B-EL1/Q900 by NXP Semiconductors

PX1011B-EL1/Q900 by NXP Semiconductors is a low-profile network interface IC designed for commercial applications. It features an operating temp range of 0 °C to 70 °C, a nominal voltage of 1.2V, and a compact 9mm x 9mm grid array package. Ideal for telecom systems, it ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,888 parts In-Stock

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2,888

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Vyrian

USA . 1,429 parts In-Stock

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1,429

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Anansix

USA . 811 parts In-Stock

1+ parts

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811

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,564 parts In-Stock

1+ parts

$543.000

100+ parts

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1,564

$543.000

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UNI Independent Distributors

Spain . 7,197 parts In-Stock

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7,197

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Corphita

USA . 4,552 parts In-Stock

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4,552

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Overview

Experience unmatched reliability and performance with the PX1011B-EL1/Q900 from NXP Semiconductors. Renowned for their commitment to quality, NXP delivers cutting-edge network interfaces that excel in commercial applications. This compact, low-profile solution ensures seamless connectivity and optimized efficiency, making it ideal for both telecom and data-centric environments. Elevate your projects with a product designed to exceed expectations and drive innovation forward.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures longevity and resilience against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs, enabling more efficient use of space on circuit boards.

Package Shape: SQUARE

A square package shape can simplify PCB layout and improve thermal performance due to even distribution of heat.

No. of Terminals: 81

A higher number of terminals provides flexibility for various connectivity options and enhanced functionality.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Low profile and fine pitch designs are beneficial for high-density applications, allowing for efficient packaging.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for a wide range of applications, ensuring stability under stress.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable performance in colder environments.

Terminal Finish: TIN SILVER COPPER

The tin-silver-copper finish provides excellent solderability and good electrical performance over time.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for compact designs and improves the reliability of solder joints.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm caters to low-profile applications, making it suitable for modern slim designs.

Width: 9 mm

With a width of 9 mm, this component strikes a balance between size and performance, fitting well in various applications.

Length: 9 mm

The 9 mm length provides a compact footprint, allowing for easier integration into tight spaces on PCBs.

Temperature Grade: COMMERCIAL

Commercial temperature grades mean this product is designed to operate reliably under standard conditions encountered in everyday use.

Terminal Form: BALL

Ball terminals enhance the soldering process and provide reliable connections, essential for maintaining signal integrity.

Telecom IC Type: INTERFACE CIRCUIT

Being an interface circuit, this product is ideally suited for communication applications, enhancing effective data transfer.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage of 1.2 V supports energy-efficient designs, particularly valuable in battery-powered devices.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for fine-pitch designs, accommodating advanced circuit layouts and minimizing PCB space.

Technical Specifications

Network Interfaces PX1011B-EL1/Q900 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PBGA-B81

JESD-609 Code:

e1

Length:

9 mm

No. of Functions:

1

No. of Terminals:

81

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

9 mm

Trade Compliance

PX1011B-EL1/Q900 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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