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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LCMXO2-2000UHC-4FG484C by Lattice Semiconductor

LCMXO2-2000UHC-4FG484C

Lattice Semiconductor

LCMXO2-2000UHC-4FG484C by Lattice Semiconductor is a FPGA with 2112 logic cells, 278 inputs/outputs, and operates at 2.5V. Ideal for applications requiring high-speed data processing in industrial automation, telecommunications, and consumer electronics due to its compact size and versatile programmable features.

FPGA

2112

278

278

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.6 mm

Tray

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

LCMXO2-4000HC-4FG484C by Lattice Semiconductor

LCMXO2-4000HC-4FG484C

Lattice Semiconductor

LCMXO2-4000HC-4FG484C by Lattice Semiconductor is a 4320 logic cell FPGA with 278 inputs/outputs. Operating at 2.375V to 3.465V, it's ideal for applications requiring high-speed processing and flexibility in a compact 23x23mm grid array package.

FPGA

4320

278

278

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.6 mm

Tray

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

LCMXO2-4000HC-4FG484I by Lattice Semiconductor

LCMXO2-4000HC-4FG484I

Lattice Semiconductor

LCMXO2-4000HC-4FG484I by Lattice Semiconductor is a 4320 logic cell FPGA with 278 inputs/outputs. Operating at 2.5V, it has a max temp of 100°C and uses a grid array package for applications in various electronic systems requiring high-speed processing and flexibility.

FPGA

4320

278

278

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.6 mm

Tray

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

LCMXO2-4000HC-6FG484C by Lattice Semiconductor

LCMXO2-4000HC-6FG484C

Lattice Semiconductor

LCMXO2-4000HC-6FG484C by Lattice Semiconductor is a FPGA with 4320 logic cells, 278 inputs/outputs, and operates at 2.5V. It is used in applications requiring high-speed processing and programmable ICs in compact spaces.

FPGA

4320

278

278

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.6 mm

Tray

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

LCMXO2-7000HC-4FG484C by Lattice Semiconductor

LCMXO2-7000HC-4FG484C

Lattice Semiconductor

LCMXO2-7000HC-4FG484C by Lattice Semiconductor is a FPGA with 6864 logic cells, 334 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-speed data processing and complex algorithm implementation in various industries.

FPGA

6864

334

334

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.6 mm

Tray

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

LCMXO2-7000HC-4FG484I by Lattice Semiconductor

LCMXO2-7000HC-4FG484I

Lattice Semiconductor

LCMXO2-7000HC-4FG484I by Lattice Semiconductor is a FPGA with 6864 logic cells, 334 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

6864

334

334

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.6 mm

Tray

BGA484,22X22,40

Bottom

Ball

Tin/Silver/Copper

1 mm

484

S-PBGA-B484

e1

No

XC7A200T-1FB484I by Xilinx

XC7A200T-1FB484I

Xilinx

The Xilinx XC7A200T-1FB484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C and has a max supply voltage of 1.05V. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

23 mm

23 mm

2.54 mm

Bottom

Ball

Tin Lead

1 mm

484

S-PBGA-B484

e0

XCKU13P-L1FFVE900I by Xilinx

XCKU13P-L1FFVE900I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: HBGA; Package Shape: SQUARE;

FPGA

746550

304

304

42660

42660 CLBS

It also Operates at 0.85 V

.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

245 °C (473 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

3.42 mm

BGA900,30X30,40

Bottom

Ball

Tin Silver Copper

1 mm

900

S-PBGA-B900

e1

5AGXFB3H4F35I3G by Intel

5AGXFB3H4F35I3G

Intel

The Intel 5AGXFB3H4F35I3G is a FPGA with 362K logic cells, TSMC technology, and 13688 CLBs. It operates at 1.12-1.18V with -40 to 100°C temperature range. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXBA1D4F27C4G by Intel

5AGXBA1D4F27C4G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: HBGA; Package Shape: SQUARE;

FPGA

75000

416

416

2830

TSMC

2830 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

27 mm

27 mm

2.7 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

5AGXFA5H4F35I5G by Intel

5AGXFA5H4F35I5G

Intel

Intel's 5AGXFA5H4F35I5G FPGA boasts 190,000 logic cells and TSMC technology. With 7170 CLBs, it offers 544 inputs/outputs and operates b/w -40 to 100°C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXFB5K4F40I5G by Intel

5AGXFB5K4F40I5G

Intel

Intel's 5AGXFB5K4F40I5G FPGA features 420,000 logic cells and TSMC technology. With 15849 CLBs and 704 inputs/outputs, it is ideal for industrial applications requiring high performance in a compact package with a max operating temperature of 100°C.

FPGA

420000

704

704

15849

TSMC

15849 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXFB7H4F35I3G by Intel

5AGXFB7H4F35I3G

Intel

Intel's 5AGXFB7H4F35I3G FPGA features 504K logic cells, TSMC technology, and 19024 CLBs. Ideal for industrial applications with a max operating temp of 100°C and min of -40°C. Package style is grid array with heat sink/slug, suitable for surface mount assembly.

FPGA

504000

704

704

19024

TSMC

19024 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXFB7K4F40I5G by Intel

5AGXFB7K4F40I5G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1517; Package Code: HBGA; Package Shape: SQUARE;

FPGA

504000

704

704

19024

TSMC

19024 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXBB1D4F40I5G by Intel

5AGXBB1D4F40I5G

Intel

Intel's 5AGXBB1D4F40I5G FPGA boasts 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for industrial applications with a max operating temp of 100°C, it features a grid array package style and supports up to 704 inputs/outputs.

FPGA

300000

704

704

11321

TSMC

11321 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGTFD3H3F35I3G by Intel

5AGTFD3H3F35I3G

Intel

Intel's 5AGTFD3H3F35I3G FPGA boasts 362K logic cells, 13688 CLBs, and operates at a max voltage of 1.18V. Ideal for industrial applications with temp range -40 to 100°C, featuring a grid array package style with heat sink and square shape.

FPGA

362000

704

704

13688

13688 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXMB3G6F40C6G by Intel

5AGXMB3G6F40C6G

Intel

Intel's 5AGXMB3G6F40C6G FPGA boasts 362K logic cells, TSMC technology, and 1.13V max supply voltage. Ideal for applications requiring high-speed data processing, such as telecommunications infrastructure and industrial automation systems.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXMA7G4F35I5G by Intel

5AGXMA7G4F35I5G

Intel

Intel's 5AGXMA7G4F35I5G FPGA features 242K logic cells, TSMC technology, and 9168 CLBs. Ideal for industrial applications requiring high performance with a max operating temperature of 100°C.

FPGA

242000

544

544

9168

TSMC

9168 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXMA5G4F31I5G by Intel

5AGXMA5G4F31I5G

Intel

The Intel 5AGXMA5G4F31I5G is a FPGA with 190,000 logic cells and 7,170 CLBs. It operates at a max supply voltage of 1.13V and has TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA5G4F31C4G by Intel

5AGXMA5G4F31C4G

Intel

The Intel 5AGXMA5G4F31C4G is a FPGA with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w 0-85°C. Ideal for applications requiring high-speed data processing and customizable hardware acceleration in compact designs.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA5G4F31I3G by Intel

5AGXMA5G4F31I3G

Intel

The Intel 5AGXMA5G4F31I3G is a Field Programmable Gate Array with 190,000 logic cells and 7170 CLBs. It operates at a max supply voltage of 1.18V and has TSMC technology. Ideal for industrial applications requiring high-performance FPGA solutions in compact form factors.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.15

1.12 V

1.18 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXMA3D4F27I5G by Intel

5AGXMA3D4F27I5G

Intel

Intel's 5AGXMA3D4F27I5G FPGA boasts 156K logic cells, TSMC technology, and 416 inputs/outputs. Ideal for industrial applications with a wide operating temperature range of -40 to 100°C. The package features a grid array style with a compact size of 27x27mm and low seated height of 2.7mm.

FPGA

156000

416

416

5890

TSMC

5890 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

27 mm

27 mm

2.7 mm

BGA672,26X26,40

Bottom

Ball

1 mm

672

S-PBGA-B672

5AGXMA5G4F35I5G by Intel

5AGXMA5G4F35I5G

Intel

The Intel 5AGXMA5G4F35I5G is a Field Programmable Gate Array (FPGA) with 190,000 logic cells and TSMC technology. It has 7170 CLBs, 544 inputs/outputs, and operates b/w -40 to 100 °C. Ideal for industrial applications requiring high-performance programmable ICs in a compact grid array package.

FPGA

190000

544

544

7170

TSMC

7170 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.7 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

5AGXMA3D4F31C5G by Intel

5AGXMA3D4F31C5G

Intel

Intel's 5AGXMA3D4F31C5G FPGA features 156K logic cells, TSMC technology, and 5890 CLBs. Ideal for applications requiring high-speed processing, such as data centers and telecommunications infrastructure.

FPGA

156000

416

416

5890

TSMC

5890 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

31 mm

31 mm

2.7 mm

BGA896,30X30,40

Bottom

Ball

1 mm

896

S-PBGA-B896

5AGXFB3H4F40I5G by Intel

5AGXFB3H4F40I5G

Intel

Intel's 5AGXFB3H4F40I5G FPGA boasts 362K logic cells, TSMC technology, and 13688 CLBs. With a max supply voltage of 1.13V, it is ideal for industrial applications requiring high-performance computing in a compact form factor with a grid array package style.

FPGA

362000

704

704

13688

TSMC

13688 CLBS

1.1

1.07 V

1.13 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

5AGXFB1H4F40C5G by Intel

5AGXFB1H4F40C5G

Intel

Intel's 5AGXFB1H4F40C5G FPGA features 300K logic cells, TSMC technology, and 11321 CLBs. Ideal for applications requiring high-speed data processing, such as telecommunications equipment and industrial automation systems.

FPGA

300000

704

704

11321

TSMC

11321 CLBS

1.1

1.07 V

1.13 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

40 mm

40 mm

2.7 mm

BGA1517,39X39,40

Bottom

Ball

1 mm

1517

S-PBGA-B1517

EP2AGX45DF25C6G by Intel

EP2AGX45DF25C6G

Intel

EP2AGX45DF25C6G by Intel is a FPGA with 42959 logic cells, 1805 CLBs, and 260 inputs/outputs. It operates b/w -40 to 85°C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

42959

260

260

1805

1805 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

25 mm

25 mm

2.15 mm

BGA572,24X24,40

Bottom

Ball

1 mm

572

S-PBGA-B572

EP2AGX65DF29C6G by Intel

EP2AGX65DF29C6G

Intel

EP2AGX65DF29C6G by Intel is a FPGA with 60214 logic cells, 2530 CLBs, and 372 inputs/outputs. It operates b/w temperatures of 0-85°C and has a supply voltage range of 0.87-0.93V. Ideal for applications requiring high-speed data processing and customizable logic functions in compact designs.

FPGA

60214

372

372

2530

2530 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

29 mm

29 mm

2.6 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP2AGX125EF29C4G by Intel

EP2AGX125EF29C4G

Intel

EP2AGX125EF29C4G by Intel is a Field Programmable Gate Array (FPGA) with 118,143 logic cells. It has a max supply voltage of 0.93V and can operate at temperatures up to 85°C. This FPGA is suitable for various applications requiring programmable ICs and offers a package style of grid array with heat sink/slug.

FPGA

118143

372

372

4964

4964 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

29 mm

29 mm

2.6 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP2AGX45DF25I5G by Intel

EP2AGX45DF25I5G

Intel

EP2AGX45DF25I5G by Intel is a FPGA with 42959 logic cells, 1805 CLBs, and 260 inputs/outputs. It operates b/w -40 to 100°C, with a supply voltage range of 0.87V to 0.93V. This versatile device in a square package is ideal for applications requiring high-speed data processing and programmable logic capabilities.

FPGA

42959

260

260

1805

1805 CLBS

0.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

25 mm

25 mm

2.15 mm

BGA572,24X24,40

Bottom

Ball

1 mm

572

S-PBGA-B572

EP2AGX125EF29I5G by Intel

EP2AGX125EF29I5G

Intel

EP2AGX125EF29I5G by Intel is a FPGA with 118143 logic cells, 4964 CLBs, and 372 inputs/outputs. It operates b/w -40 to 100 °C and has a supply voltage range of 0.87V to 0.93V. This device is suitable for applications requiring high-speed processing and programmable logic capabilities in compact form factors.

FPGA

118143

372

372

4964

4964 CLBS

0.9

.87 V

.93 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

29 mm

29 mm

2.6 mm

BGA780,28X28,40

Bottom

Ball

1 mm

780

S-PBGA-B780

EP2AGX190FF35C6G by Intel

EP2AGX190FF35C6G

Intel

EP2AGX190FF35C6G by Intel is a FPGA with 181165 logic cells, 7612 CLBs, and 612 inputs/outputs. It operates b/w -40 to 85°C and has a supply voltage range of 0.87V to 0.93V. Ideal for applications requiring high-speed data processing in compact electronic systems.

FPGA

181165

612

612

7612

7612 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.55 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP2AGX260FF35C6G by Intel

EP2AGX260FF35C6G

Intel

EP2AGX260FF35C6G by Intel is a FPGA with 244188 logic cells, 10260 CLBs, and 612 inputs/outputs. It operates b/w -40°C to 85°C, has a supply voltage range of 0.87V to 0.93V, and features a grid array package suitable for various applications in electronics design and development.

FPGA

244188

612

612

10260

10260 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.55 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP2AGX95EF35C4G by Intel

EP2AGX95EF35C4G

Intel

EP2AGX95EF35C4G by Intel is a FPGA with 89178 logic cells, 3747 CLBs, and 612 inputs/outputs. It operates b/w -40 to 85 °C and has a package style of grid array. Ideal for applications requiring high-speed processing and customization in compact designs.

FPGA

89178

612

612

3747

3747 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

35 mm

35 mm

2.55 mm

BGA1152,34X34,40

Bottom

Ball

1 mm

1152

S-PBGA-B1152

EP2AGX45DF25C4G by Intel

EP2AGX45DF25C4G

Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

42959

260

260

1805

1805 CLBS

0.9

.87 V

.93 V

0 °C (32 °F)

85 °C (185 °F)

Plastic/Epoxy

Yes

Grid Array, Heat Sink/Slug

HBGA

Square

25 mm

25 mm

2.15 mm

BGA572,24X24,40

Bottom

Ball

1 mm

572

S-PBGA-B572