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EP2AGX45DF25C4G

Intel

EP2AGX45DF25C4G by Intel

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 572; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,295 parts In-Stock

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Chip Stock

USA . 1,174 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Digiode

USA . 172 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,441 parts In-Stock

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$19.000

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$19.000

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AZTECH Wire

Italy . 931 parts In-Stock

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$21.020

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Texas Native Microelectronics

USA . 578 parts In-Stock

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$152.375

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$134.090

578

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$134.090

Kenton Components

USA . 928 parts In-Stock

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$182.850

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$175.536

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$170.050

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$160.908

928

$182.850

$175.536

$170.050

$160.908

Qasali Group International

UK . 1,000 parts In-Stock

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$411.412

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$382.614

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Microchip USA

USA . 1,778 parts In-Stock

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$912.197

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Continental Prestige Electronics

USA . 3,094 parts In-Stock

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MARBEL Systems

Belgium . 2,465 parts In-Stock

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Argo Parts USA

USA . 1,969 parts In-Stock

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Corphita

USA . 431 parts In-Stock

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Aranea Global

USA . 50 parts In-Stock

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Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX45DF25C4G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

42959

No. of Inputs:

260

No. of Outputs:

260

No. of CLBs:

1805

Organization:

1805 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

25 mm

Width:

25 mm

Maximum Seated Height:

2.15 mm

Package Equivalence Code:

BGA572,24X24,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

572

Standards

JESD-30 Code:

S-PBGA-B572

Trade Compliance

EP2AGX45DF25C4G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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