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EP2AGX45DF25C6G

Intel

EP2AGX45DF25C6G by Intel

EP2AGX45DF25C6G by Intel is a FPGA with 42959 logic cells, 1805 CLBs, and 260 inputs/outputs. It operates b/w -40 to 85°C and has a package style of grid array. Ideal for applications requiring high-speed data processing in compact electronic systems.

Median Price

$713.830

Lifecycle Status

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Mouser Electronics

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Digiode

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$674.880

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Vyrian

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Classic Components Corporation

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Sensible Micro Corp

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Nova Conductors

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Texas Native Microelectronics

USA . 663 parts In-Stock

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$139.803

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$134.211

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$130.017

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$123.027

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Qasali Group International

UK . 29,518 parts In-Stock

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Vigor

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Component Stockers USA

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Ampacity Inc.

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Corphita

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Microchip USA

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QUARKTWIN TECHNOLOGY LTD

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Continental Prestige Electronics

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Kenton Components

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Aranea Global

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MARBEL Systems

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RC Electronics

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Futuretech Components

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Overview

Unlock limitless possibilities with the EP2AGX45DF25C6G by Intel. As a leading manufacturer in Field Programmable Gate Arrays (FPGA), Intel delivers top-notch quality and reliability. With 42959 logic cells and 1805 CLBs, this FPGA is perfect for a wide range of applications. From aerospace to automotive industries, this versatile product offers exceptional value and benefits, providing customers with unparalleled flexibility and performance. Upgrade your projects with Intel's EP2AGX45DF25C6G and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the FPGA suitable for a wide range of applications.

No. of Logic Cells: 42959

With a large number of logic cells, this FPGA can handle complex processing tasks efficiently.

Surface Mount: YES

Surface mount technology makes installation easier and allows for space-saving designs.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption, making the FPGA energy-efficient.

No. of CLBs: 1805

The high number of Configurable Logic Blocks (CLBs) provides flexibility and allows for customization of the FPGA functionality.

No. of Inputs: 260

Having a large number of inputs allows for a wide range of data to be processed simultaneously.

Package Shape: SQUARE

The square shape allows for easy integration into circuit boards and efficient use of space.

Form Of Terminal: BALL

Ball terminals provide a reliable connection and allow for easy soldering during installation.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage ensures stable operation and compatibility with standard power sources.

No. of Terminals: 572

Having a high number of terminals enables connectivity with multiple external components and peripherals.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC offers flexibility and reconfigurability for different applications.

Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG

The grid array package style with a heat sink/slug ensures efficient heat dissipation, allowing for reliable performance at high operating temperatures.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this FPGA can withstand demanding thermal conditions and maintain performance.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for easy installation and compatibility with standard PCB designs.

Organization: 1805 CLBS

The organization of 1805 Configurable Logic Blocks provides a structured and efficient architecture for implementing complex logic functions.

Minimum Operating Temperature: 0 °C

The FPGA can operate reliably even at low temperatures, ensuring performance in various environmental conditions.

Position Of Terminal: BOTTOM

The bottom position of terminals allows for easy access and connection when integrating the FPGA into a system.

Maximum Seated Height: 2.15 mm

With a low seated height, this FPGA can be integrated into compact designs without occupying much vertical space.

Width: 25 mm

The compact width of 25mm allows for easy integration into circuit boards and PCB layouts.

No. of Outputs: 260

Having a high number of outputs allows for the FPGA to drive multiple components and processes data efficiently.

Length: 25 mm

The compact length of 25mm makes this FPGA suitable for applications where space is a constraint.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP2AGX45DF25C6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

42959

No. of Inputs:

260

No. of Outputs:

260

No. of CLBs:

1805

Organization:

1805 CLBS

Power Characteristics

Nominal Supply Voltage:

0.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Heat Sink/Slug

Package Code:

Package Shape:

Length:

25 mm

Width:

25 mm

Maximum Seated Height:

2.15 mm

Package Equivalence Code:

BGA572,24X24,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

572

Standards

JESD-30 Code:

S-PBGA-B572

Trade Compliance

EP2AGX45DF25C6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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