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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC4VLX15-10SFG363I by Xilinx

XC4VLX15-10SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-11SFG363C by Xilinx

XC4VLX15-11SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-11SFG363I by Xilinx

XC4VLX15-11SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-10SFG363C by Xilinx

XC4VLX25-10SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-10SFG363I by Xilinx

XC4VLX25-10SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 4;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-11SFG363C by Xilinx

XC4VLX25-11SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-11SFG363I by Xilinx

XC4VLX25-11SFG363I

Xilinx

XC4VLX25-11SFG363I by Xilinx is a FPGA with 24192 logic cells, 2688 CLBs, and 240 inputs/outputs. It operates at a max frequency of 1205 MHz and uses CMOS technology. Ideal for applications requiring high-speed processing and complex logic functions in compact designs.

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX25-12SFG363C by Xilinx

XC4VLX25-12SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

MPF100T-1FCVG484E by Microchip Technology

MPF100T-1FCVG484E

Microchip Technology

MPF100T-1FCVG484E by Microchip is a CMOS FPGA with 284 inputs/outputs, operating b/w 0-100°C. It features a grid array package style with 0.8mm terminal pitch, suitable for applications requiring high-density programmable logic solutions.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100T-FCVG484E by Microchip Technology

MPF100T-FCVG484E

Microchip Technology

MPF100T-FCVG484E by Microchip Technology is a CMOS FPGA with 284 inputs/outputs, operating b/w 0-100°C. It features a grid array package with 0.8mm terminal pitch and 484 ball terminals. Ideal for applications requiring high-density programmable logic solutions in compact spaces.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100TL-FCVG484E by Microchip Technology

MPF100TL-FCVG484E

Microchip Technology

Microchip Technology's MPF100TL-FCVG484E is a CMOS FPGA with 284 inputs/outputs, operating b/w 0-100°C. Its grid array package has 484 ball terminals on a 0.8mm pitch, suitable for high-density applications requiring programmable logic solutions. The plastic/epoxy body measures 19x19mm with a seated height of 3.32mm, making it ideal for compact designs in various industries.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100TL-FCVG484I by Microchip Technology

MPF100TL-FCVG484I

Microchip Technology

MPF100TL-FCVG484I by Microchip Technology is a CMOS FPGA with 284 inputs/outputs, operating b/w -40 to 100°C. It features a grid array package with 0.8mm terminal pitch and 484 ball terminals. Ideal for applications requiring high-density programmable logic solutions in compact spaces.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100TLS-FCVG484I by Microchip Technology

MPF100TLS-FCVG484I

Microchip Technology

MPF100TLS-FCVG484I by Microchip: FPGA with 284 inputs/outputs, CMOS tech, 0.97V to 1.03V supply voltage range. Ideal for high-performance computing applications due to fine-pitch grid array package style and operating temp of -40°C to 100°C.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100TS-1FCVG484I by Microchip Technology

MPF100TS-1FCVG484I

Microchip Technology

MPF100TS-1FCVG484I by Microchip Tech is a CMOS FPGA with 284 inputs/outputs, operating temp range -40 to 100°C. It has a grid array package style, 0.8mm terminal pitch, and is suitable for applications requiring high-density programmable logic solutions.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF100TS-FCVG484I by Microchip Technology

MPF100TS-FCVG484I

Microchip Technology

MPF100TS-FCVG484I by Microchip Technology is a CMOS FPGA with 284 inputs/outputs, 484 terminals, and operates b/w -40 to 100°C. It features a grid array package style suitable for applications requiring high-density programmable logic solutions in compact spaces.

FPGA

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF200T-FCVG484I by Microchip Technology

MPF200T-FCVG484I

Microchip Technology

MPF200T-FCVG484I by Microchip Technology is a 192K logic cell FPGA with CMOS technology. Featuring 284 inputs/outputs, it operates b/w -40 to 100°C. Ideal for applications requiring high-density programmable logic in a compact grid array package.

FPGA

192000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF300T-1FCVG484E by Microchip Technology

MPF300T-1FCVG484E

Microchip Technology

MPF300T-1FCVG484E by Microchip Technology is a CMOS FPGA with 300K logic cells, 284 inputs/outputs, and operates b/w 0-100°C. It features a grid array package with 0.8mm pitch terminals suitable for various applications requiring high-density programmable ICs.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF300T-1FCVG484I by Microchip Technology

MPF300T-1FCVG484I

Microchip Technology

MPF300T-1FCVG484I by Microchip Technology is a CMOS FPGA with 300K logic cells, 284 inputs/outputs. It operates b/w -40 to 100°C and has a package style of grid array, fine pitch. Ideal for applications requiring high-density programmable logic in compact form factors.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF300T-FCVG484E by Microchip Technology

MPF300T-FCVG484E

Microchip Technology

MPF300T-FCVG484E by Microchip is a CMOS FPGA with 300K logic cells, 284 inputs/outputs, and operates b/w 0-100°C. It features a fine pitch grid array package suitable for surface mount applications. Ideal for high-performance computing, telecommunications, and industrial automation systems.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF300TL-FCVG484E by Microchip Technology

MPF300TL-FCVG484E

Microchip Technology

MPF300TL-FCVG484E by Microchip Technology is a CMOS FPGA with 300K logic cells, 284 inputs/outputs, and operates b/w 0-100°C. It features a grid array package with 0.8mm terminal pitch suitable for various applications requiring high-density programmable logic solutions.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

0 °C (32 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

MPF300TL-FCVG484I by Microchip Technology

MPF300TL-FCVG484I

Microchip Technology

MPF300TL-FCVG484I by Microchip Technology is a CMOS-based FPGA with 300,000 logic cells. It operates at a voltage range of 0.97V to 1.03V and has a max operating temperature of 100°C. This programmable IC is commonly used in applications requiring high-performance computing and advanced digital signal processing.

FPGA

300000

284

284

CMOS

It also Operates at 1.05 V nominal supply

1

.97 V

1.03 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

3.32 mm

BGA484,22X22,32

Bottom

Ball

.8 mm

484

S-PBGA-B484

XC6SLX100-N3CSG484I by Xilinx

XC6SLX100-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

338

338

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-N3CSG484C by Xilinx

XC6SLX100T-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-N3CSG484I by Xilinx

XC6SLX100T-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-N3CSG484I by Xilinx

XC6SLX150-N3CSG484I

Xilinx

Xilinx XC6SLX150-N3CSG484I FPGA features 147443 logic cells, 11519 CLBs, and 338 inputs/outputs. Utilized in industrial applications, it operates at up to 806 MHz clock frequency with a combinatorial delay of 0.26 ns per CLB. With a max supply voltage of 1.26 V and operating temperature range from -40 to 100 °C, this FPGA is ideal for high-performance computing tasks.

FPGA

147443

338

338

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-N3CSG484C by Xilinx

XC6SLX150T-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-N3CSG484I by Xilinx

XC6SLX150T-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-N3CSG484C by Xilinx

XC6SLX45-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

43661

320

320

3411

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-N3CSG484C by Xilinx

XC6SLX75-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-N3CSG484I by Xilinx

XC6SLX75-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-N3CSG484I by Xilinx

XC6SLX75T-N3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

292

292

5831

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-L1SBG484I by Xilinx

XC7A200T-L1SBG484I

Xilinx

Xilinx XC7A200T-L1SBG484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C, has a max supply voltage of 0.98V, and uses PLASTIC/EPOXY package material. Ideal for applications requiring high-speed processing and customization in compact designs.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

LFE5U-12F-6BG381C by Lattice Semiconductor

LFE5U-12F-6BG381C

Lattice Semiconductor

LFE5U-12F-6BG381C by Lattice Semiconductor is a Field Programmable Gate Array (FPGA) with 1500 CLBs and 197 inputs/outputs. Operating at a voltage range of 1.045V to 1.155V, it is suitable for applications requiring high-speed processing and programmable logic in industrial automation, telecommunications, and aerospace industries. The package style is a grid array with fine pitch terminals, making it ideal for compact designs where space optimization is crucial.

FPGA

197

197

1500

1500 CLBS

1.1

1.045 V

1.155 V

0 °C (32 °F)

85 °C (185 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.76 mm

BGA381,20X20,32

Bottom

Ball

.8 mm

381

S-PBGA-B381

LFE5U-12F-6BG381I by Lattice Semiconductor

LFE5U-12F-6BG381I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-12F-6BG381I FPGA features 1500 CLBs, 197 inputs/outputs, and a max supply voltage of 1.155V. Ideal for applications requiring high-performance computing in compact spaces with operating temperatures ranging from -40 to 100°C.

FPGA

197

197

1500

1500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.76 mm

BGA381,20X20,32

Bottom

Ball

.8 mm

381

S-PBGA-B381

XCKU040-3SFVA784E by Xilinx

XCKU040-3SFVA784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-1SFVA784I by Xilinx

XCKU035-1SFVA784I

Xilinx

Xilinx XCKU035-1SFVA784I FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. With a package style of grid array, fine pitch, it is ideal for industrial applications requiring high-performance programmable ICs in a compact form factor. Operating b/w -40 to 100°C, this FPGA offers versatility and reliability for various electronic designs.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-3SFVA784E by Xilinx

XCKU035-3SFVA784E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

1

.97 V

1.03 V

1 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-L1SFVA784I by Xilinx

XCKU040-L1SFVA784I

Xilinx

XCKU040-L1SFVA784I by Xilinx is a PLASTIC/EPOXY FPGA with 530250 logic cells. It has 30300 CLBs, 520 inputs/outputs, and operates at a max temperature of 100°C. This FPGA is commonly used in industrial applications for its high performance and versatility.

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

Also Operates at 0.95 V nominal supply

0.9

.88 V

.92 V

0.9 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-1SFVA784C by Xilinx

XCKU040-1SFVA784C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-2SFVA784E by Xilinx

XCKU035-2SFVA784E

Xilinx

Xilinx XCKU035-2SFVA784E FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.979 V. Package style is grid array, fine pitch, suitable for various industrial uses.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-2SFVA784E by Xilinx

XCKU040-2SFVA784E

Xilinx

Xilinx XCKU040-2SFVA784E FPGA offers 530250 logic cells, 30300 CLBs, and 520 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates at supply voltages ranging from 0.922V to 0.979V with a temperature range of 0°C to 100°C.

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

100 °C (212 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-2SFVA784I by Xilinx

XCKU035-2SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-2SFVA784I by Xilinx

XCKU040-2SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU040-1SFVA784I by Xilinx

XCKU040-1SFVA784I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 784; Package Code: FBGA; Package Shape: SQUARE;

FPGA

530250

520

520

30300

Field Programmable Gate Arrays

30300 CLBS

0.95

.922 V

.979 V

0.95 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU035-1SFVA784C by Xilinx

XCKU035-1SFVA784C

Xilinx

Xilinx XCKU035-1SFVA784C FPGA features 444343 logic cells, 25391 CLBs, and 520 inputs/outputs. With a package style of grid array, fine pitch, it's ideal for applications requiring high-performance programmable ICs in a compact form factor. Operating temperature ranges from 0 to 85°C with a max seated height of 3.52mm.

FPGA

444343

520

520

25391

Field Programmable Gate Arrays

25391 CLBS

0.95

.922 V

.979 V

0.95 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.52 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

No

XCKU3P-1SFVB784E by Xilinx

XCKU3P-1SFVB784E

Xilinx

Xilinx XCKU3P-1SFVB784E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing and complex algorithms in industries like aerospace, telecommunications, and automotive. Operating temperature range from 0 to 100 °C with a max supply voltage of 0.876 V makes it versatile for various environments.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-1SFVB784I by Xilinx

XCKU3P-1SFVB784I

Xilinx

Xilinx XCKU3P-1SFVB784I FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. With a max supply voltage of 0.876 V and operating temperature range from -40 to 100 °C, it's ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1

XCKU3P-2SFVB784I by Xilinx

XCKU3P-2SFVB784I

Xilinx

Xilinx XCKU3P-2SFVB784I FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for industrial applications requiring high-performance computing in a compact form factor with a max operating temperature of 100°C.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

3.32 mm

BGA784,28X28,32

Bottom

Ball

Tin Silver Copper

.8 mm

784

S-PBGA-B784

e1