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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
LCMXO2-4000HC-4BG332I by Lattice Semiconductor

LCMXO2-4000HC-4BG332I

Lattice Semiconductor

LCMXO2-4000HC-4BG332I by Lattice Semiconductor is a FPGA with 4320 logic cells, 274 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

4320

274

274

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

2 mm

Tray

BGA332,20X20,32

Bottom

Ball

Tin/Silver/Copper

.8 mm

332

S-PBGA-B332

e1

No

LCMXO2-7000HC-4BG332C by Lattice Semiconductor

LCMXO2-7000HC-4BG332C

Lattice Semiconductor

LCMXO2-7000HC-4BG332C by Lattice Semiconductor is a FPGA with 6864 logic cells, 278 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-speed processing and programmable ICs in a compact grid array package.

FPGA

6864

278

278

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

2 mm

Tray

BGA332,20X20,32

Bottom

Ball

Tin/Silver/Copper

.8 mm

332

S-PBGA-B332

e1

No

LCMXO2-7000HC-4BG332I by Lattice Semiconductor

LCMXO2-7000HC-4BG332I

Lattice Semiconductor

LCMXO2-7000HC-4BG332I by Lattice Semiconductor is a FPGA with 6864 logic cells, 278 inputs/outputs, and operates at 2.5V/3.3V. Ideal for applications requiring high-speed processing in industrial automation, telecommunications, and consumer electronics due to its fine pitch grid array package style.

FPGA

6864

278

278

Field Programmable Gate Arrays

Also Operates at 3.3 V nominal supply

2.5

2.375 V

3.465 V

2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

2 mm

Tray

BGA332,20X20,32

Bottom

Ball

Tin/Silver/Copper

.8 mm

332

S-PBGA-B332

e1

No

LCMXO2-7000ZE-1BG332I by Lattice Semiconductor

LCMXO2-7000ZE-1BG332I

Lattice Semiconductor

LCMXO2-7000ZE-1BG332I by Lattice Semiconductor is a FPGA with 6864 logic cells, 278 inputs/outputs, and operates at 1.2V. It's used in applications requiring high-speed processing and customization like telecommunications equipment and industrial automation systems.

FPGA

6864

278

278

Field Programmable Gate Arrays

1.2

1.14 V

1.26 V

1.2 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

2 mm

Tray

BGA332,20X20,32

Bottom

Ball

Tin/Silver/Copper

.8 mm

332

S-PBGA-B332

e1

No

XA6SLX16-2CSG225Q by Xilinx

XA6SLX16-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX16-2CSG324I by Xilinx

XA6SLX16-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA324,18X18,32;

FPGA

14579

232

232

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX16-2CSG324Q by Xilinx

XA6SLX16-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

14579

232

232

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX16-3CSG225Q by Xilinx

XA6SLX16-3CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

14579

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX25-2CSG324I by Xilinx

XA6SLX25-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Power Supplies (V): 1.2,2.5/3.3;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-2CSG324Q by Xilinx

XA6SLX25-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-3CSG324I by Xilinx

XA6SLX25-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; No. of Outputs: 226;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25-3CSG324Q by Xilinx

XA6SLX25-3CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

24051

226

226

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX25T-2CSG324Q by Xilinx

XA6SLX25T-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; No. of Inputs: 190;

FPGA

24051

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX4-2CSG225I by Xilinx

XA6SLX4-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Screening Level: AEC-Q100;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX4-2CSG225Q by Xilinx

XA6SLX4-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

3840

132

132

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX45-2CSG324I by Xilinx

XA6SLX45-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-2CSG324Q by Xilinx

XA6SLX45-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-2CSG484I by Xilinx

XA6SLX45-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B484;

FPGA

43661

320

320

667 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45-3CSG324I by Xilinx

XA6SLX45-3CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-3CSG324Q by Xilinx

XA6SLX45-3CSG324Q

Xilinx

The Xilinx XA6SLX45-3CSG324Q is a FPGA with 43661 logic cells, 218 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.

FPGA

43661

218

218

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45-3CSG484I by Xilinx

XA6SLX45-3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43661

320

320

862 MHz

CMOS

Field Programmable Gate Arrays

1.2,1.2/3.3,2.5/3.3 V

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA6SLX45T-2CSG324Q by Xilinx

XA6SLX45T-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

FPGA

43661

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX45T-3CSG324Q by Xilinx

XA6SLX45T-3CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

43661

190

190

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX75-2CSG484Q by Xilinx

XA6SLX75-2CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.26 ns

5831 CLBS

1.23

1.2 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX75-3CSG484Q by Xilinx

XA6SLX75-3CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.21 ns

5831 CLBS

1.2

1.14 V

1.26 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

XA6SLX9-2CSG225I by Xilinx

XA6SLX9-2CSG225I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG225Q by Xilinx

XA6SLX9-2CSG225Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;

FPGA

9152

160

160

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA225,15X15,32

Bottom

Ball

Tin Silver Copper

.8 mm

225

S-PBGA-B225

e1

No

AEC-Q100

XA6SLX9-2CSG324I by Xilinx

XA6SLX9-2CSG324I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 62.5 MHz;

FPGA

9152

200

200

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XA6SLX9-2CSG324Q by Xilinx

XA6SLX9-2CSG324Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

FPGA

9152

200

200

62.5 MHz

Field Programmable Gate Arrays

1.2,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

BGA324,18X18,32

Bottom

Ball

Tin Silver Copper

.8 mm

324

S-PBGA-B324

e1

No

AEC-Q100

XC6SLX100-N3CSG484C by Xilinx

XC6SLX100-N3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

338

338

7911

806 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-1SBG484C by Xilinx

XC7A200T-1SBG484C

Xilinx

Xilinx XC7A200T-1SBG484C is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1098 MHz. It operates b/w -40 to 85 °C and is used in high-performance computing applications.

FPGA

215360

285

285

16825

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-1SBG484I by Xilinx

XC7A200T-1SBG484I

Xilinx

XC7A200T-1SBG484I by Xilinx is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates at max frequency of 1098 MHz and supports CMOS technology. Ideal for applications requiring high-speed processing in industrial settings.

FPGA

215360

285

285

16825

1098 MHz

1.27 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-2SBG484C by Xilinx

XC7A200T-2SBG484C

Xilinx

Xilinx XC7A200T-2SBG484C FPGA offers 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with fine pitch terminals.

FPGA

215360

285

285

16825

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-2SBG484I by Xilinx

XC7A200T-2SBG484I

Xilinx

Xilinx XC7A200T-2SBG484I FPGA offers 215360 logic cells, 16825 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable IC technology in a compact grid array package with fine pitch terminals.

FPGA

215360

285

285

16825

1286 MHz

1.05 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-3SBG484E by Xilinx

XC7A200T-3SBG484E

Xilinx

The Xilinx XC7A200T-3SBG484E is a FPGA with 215360 logic cells, 16825 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

215360

285

285

16825

1412 MHz

0.94 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

1

.95 V

1.05 V

1 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC7A200T-2SB484I by Xilinx

XC7A200T-2SB484I

Xilinx

The Xilinx XC7A200T-2SB484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100°C and has a max supply voltage of 1.05V. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

215360

285

285

16825

1.05 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

Bottom

Ball

Tin/Lead

.8 mm

484

S-PBGA-B484

e0

XC7A200T-1SB484I by Xilinx

XC7A200T-1SB484I

Xilinx

The Xilinx XC7A200T-1SB484I is a FPGA with 215360 logic cells, 16825 CLBs, and 285 inputs/outputs. It operates b/w -40 to 100 °C and has a max supply voltage of 1.05 V. Ideal for applications requiring high-speed processing and programmable ICs in compact spaces.

FPGA

215360

285

285

16825

1.27 ns

16825 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

Bottom

Ball

Tin/Lead

.8 mm

484

S-PBGA-B484

e0

XC7A200T-L2SBG484E by Xilinx

XC7A200T-L2SBG484E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Technology Used: CMOS;

FPGA

215360

285

285

16825

1286 MHz

1.51 ns

CMOS

Field Programmable Gate Arrays

16825 CLBS

Also Operates at 1 V supply

.9

.87 V

.93 V

0.9 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

2.44 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

LFE5U-45F-6BG554I by Lattice Semiconductor

LFE5U-45F-6BG554I

Lattice Semiconductor

Lattice Semiconductor's LFE5U-45F-6BG554I FPGA features 44000 logic cells, 5500 CLBs, and 245 inputs/outputs. With a max supply voltage of 1.155V, it is ideal for applications requiring high-performance computing in industrial automation, telecommunications, and automotive systems.

FPGA

44000

245

245

5500

5500 CLBS

1.1

1.045 V

1.155 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

23 mm

23 mm

1.76 mm

BGA554,26X26,32

Bottom

Ball

Tin Silver Copper

.8 mm

554

S-PBGA-B554

e1

XC6SLX100-2CSG484C by Xilinx

XC6SLX100-2CSG484C

Xilinx

The Xilinx XC6SLX100-2CSG484C is a FPGA with 101261 logic cells, 7911 CLBs, and 320 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like telecommunications and signal processing. With a package style of grid array and fine pitch, it offers versatile integration options in electronic designs.

FPGA

101261

320

320

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-2CSG484I by Xilinx

XC6SLX100-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

320

320

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-3CSG484C by Xilinx

XC6SLX100-3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

320

320

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-3CSG484I by Xilinx

XC6SLX100-3CSG484I

Xilinx

The Xilinx XC6SLX100-3CSG484I is a FPGA with 101261 logic cells, 7911 CLBs, and 338 inputs/outputs. It operates at max clock frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package style.

FPGA

101261

338

338

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-L1CSG484C by Xilinx

XC6SLX100-L1CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

338

338

7911

0.46 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100-L1CSG484I by Xilinx

XC6SLX100-L1CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

320

320

7911

0.46 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-2CSG484C by Xilinx

XC6SLX100T-2CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

290

290

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-2CSG484I by Xilinx

XC6SLX100T-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

290

290

7911

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-3CSG484C by Xilinx

XC6SLX100T-3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

290

290

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No