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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC6SLX100T-3CSG484I by Xilinx

XC6SLX100T-3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

296

296

7911

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

7911 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX100T-4CSG484C by Xilinx

XC6SLX100T-4CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

101261

296

296

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-2CSG484C by Xilinx

XC6SLX150-2CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

330

330

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-2CSG484I by Xilinx

XC6SLX150-2CSG484I

Xilinx

Xilinx XC6SLX150-2CSG484I FPGA features 147443 logic cells, 11519 CLBs, and 330 inputs/outputs. Operating at max frequency of 667 MHz, it's ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide supply voltage range and low combinatorial delay, it offers versatile performance capabilities.

FPGA

147443

330

330

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-3CSG484C by Xilinx

XC6SLX150-3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

330

330

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-3CSG484I by Xilinx

XC6SLX150-3CSG484I

Xilinx

The Xilinx XC6SLX150-3CSG484I is a FPGA with 147443 logic cells, 11519 CLBs, and 338 inputs/outputs. It operates at max frequency of 862 MHz, suitable for industrial applications requiring high-speed processing and low power consumption. With a package style of grid array and fine pitch, it offers flexibility in design while maintaining reliability.

FPGA

147443

338

338

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150-L1CSG484I by Xilinx

XC6SLX150-L1CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

330

330

11519

0.46 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-2CSG484C by Xilinx

XC6SLX150T-2CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

290

290

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-2CSG484I by Xilinx

XC6SLX150T-2CSG484I

Xilinx

The Xilinx XC6SLX150T-2CSG484I is a FPGA with 147443 logic cells, 11519 CLBs, and max clock frequency of 667 MHz. It operates at industrial temperatures and is used in applications requiring high-speed processing and programmable ICs.

FPGA

147443

290

290

11519

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-3CSG484C by Xilinx

XC6SLX150T-3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

290

290

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-3CSG484I by Xilinx

XC6SLX150T-3CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

296

296

11519

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

11519 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX150T-4CSG484C by Xilinx

XC6SLX150T-4CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

147443

296

296

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-2CSG484C by Xilinx

XC6SLX45-2CSG484C

Xilinx

Xilinx XC6SLX45-2CSG484C FPGA features 43661 logic cells, 3411 CLBs, and 310 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low power consumption and compact form factor.

FPGA

43661

310

310

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-2CSG484I by Xilinx

XC6SLX45-2CSG484I

Xilinx

The Xilinx XC6SLX45-2CSG484I is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at industrial temperature range (-40 to 100°C) and uses CMOS technology. Ideal for applications requiring high-speed processing and programmable ICs in compact form factors.

FPGA

43661

310

310

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-3CSG484C by Xilinx

XC6SLX45-3CSG484C

Xilinx

The Xilinx XC6SLX45-3CSG484C is a FPGA with 43661 logic cells, 3411 CLBs, and 310 inputs/outputs. It operates at max frequency of 862 MHz, suitable for applications requiring high-speed processing like telecommunications equipment and industrial automation systems. With a package style of grid array and fine pitch, it offers flexibility in design while maintaining reliability.

FPGA

43661

310

310

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-3CSG484I by Xilinx

XC6SLX45-3CSG484I

Xilinx

The Xilinx XC6SLX45-3CSG484I is a FPGA with 43661 logic cells, 3411 CLBs, and 320 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factor with a grid array package style.

FPGA

43661

320

320

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45-L1CSG484I by Xilinx

XC6SLX45-L1CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

43661

310

310

3411

0.46 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45T-2CSG484C by Xilinx

XC6SLX45T-2CSG484C

Xilinx

The Xilinx XC6SLX45T-2CSG484C is a FPGA with 43661 logic cells, 3411 CLBs, and max clock frequency of 667 MHz. It operates at a supply voltage range of 1.14V to 1.26V and is ideal for applications requiring high-speed processing and programmable ICs in various industries.

FPGA

43661

290

290

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45T-2CSG484I by Xilinx

XC6SLX45T-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

43661

290

290

3411

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45T-3CSG484C by Xilinx

XC6SLX45T-3CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

43661

290

290

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45T-3CSG484I by Xilinx

XC6SLX45T-3CSG484I

Xilinx

Xilinx XC6SLX45T-3CSG484I FPGA features 43661 logic cells, 3411 CLBs, and a max clock frequency of 862 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with a 0.8 mm terminal pitch.

FPGA

43661

296

296

3411

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

3411 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX45T-4CSG484C by Xilinx

XC6SLX45T-4CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

43661

296

296

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-2CSG484C by Xilinx

XC6SLX75-2CSG484C

Xilinx

Xilinx XC6SLX75-2CSG484C FPGA features 74637 logic cells, 5831 CLBs, and a max clock frequency of 667 MHz. Ideal for applications requiring high-speed processing and programmable ICs in various industries like telecommunications and automotive.

FPGA

74637

310

310

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-2CSG484I by Xilinx

XC6SLX75-2CSG484I

Xilinx

Xilinx XC6SLX75-2CSG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs with a supply voltage range of 1.14V to 1.26V.

FPGA

74637

310

310

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-3CSG484C by Xilinx

XC6SLX75-3CSG484C

Xilinx

Xilinx XC6SLX75-3CSG484C FPGA features 74637 logic cells, 5831 CLBs, and 310 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, such as telecommunications equipment and industrial automation systems. Operating temperature range from 0 to 85°C with a compact grid array package style.

FPGA

74637

310

310

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-3CSG484I by Xilinx

XC6SLX75-3CSG484I

Xilinx

The Xilinx XC6SLX75-3CSG484I is a FPGA with 74637 logic cells, 5831 CLBs, and 328 inputs/outputs. It operates at max frequency of 862 MHz and supports supply voltages of 1.2V, 2.5/3.3V. Ideal for industrial applications requiring high-speed processing in compact form factors due to its advanced CMOS technology and fine pitch grid array package style.

FPGA

74637

328

328

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-L1CSG484C by Xilinx

XC6SLX75-L1CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

328

328

5831

0.46 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75-L1CSG484I by Xilinx

XC6SLX75-L1CSG484I

Xilinx

Xilinx XC6SLX75-L1CSG484I FPGA features 74637 logic cells, 5831 CLBs, and 310 inputs/outputs. Utilized in industrial applications, it operates at -40 to 100°C with a max supply voltage of 1.05V. The package is a grid array with fine pitch terminals for surface mounting.

FPGA

74637

310

310

5831

0.46 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1

.95 V

1.05 V

1,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-2CSG484C by Xilinx

XC6SLX75T-2CSG484C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

290

290

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-2CSG484I by Xilinx

XC6SLX75T-2CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

74637

290

290

5831

667 MHz

0.26 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3CSG484C by Xilinx

XC6SLX75T-3CSG484C

Xilinx

Xilinx XC6SLX75T-3CSG484C is a FPGA with 74637 logic cells, 5831 CLBs, and max clock frequency of 862 MHz. It operates at 1.2V nominal voltage and is used in applications requiring high-speed processing and programmable ICs.

FPGA

74637

290

290

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-3CSG484I by Xilinx

XC6SLX75T-3CSG484I

Xilinx

Xilinx XC6SLX75T-3CSG484I FPGA features 74637 logic cells, 5831 CLBs, and max clock freq of 862 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with fine pitch terminals. Operating temp range -40 to 100°C makes it versatile for various environments.

FPGA

74637

292

292

5831

862 MHz

0.21 ns

CMOS

Field Programmable Gate Arrays

5831 CLBS

1.2

1.14 V

1.26 V

1.2,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XC6SLX75T-4CSG484C by Xilinx

XC6SLX75T-4CSG484C

Xilinx

Xilinx XC6SLX75T-4CSG484C is a CMOS FPGA with 74637 logic cells, 292 inputs/outputs, and operates at temperatures from 0 to 85°C. It features a grid array package style with 0.8mm terminal pitch, suitable for various applications requiring high-performance programmable ICs.

FPGA

74637

292

292

CMOS

Field Programmable Gate Arrays

1.2,2.5/3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

.8 mm

484

S-PBGA-B484

e1

No

XA3SD1800A-4CSG484Q by Xilinx

XA3SD1800A-4CSG484Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE;

FPGA

37440

309

249

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XA3SD3400A-4CSG484I by Xilinx

XA3SD3400A-4CSG484I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 1.8 mm;

FPGA

53712

309

249

5968

53712

667 MHz

CMOS

Field Programmable Gate Arrays

5968 CLBS, 53712 Gates

1.2,1.2/3.3,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

19 mm

19 mm

1.8 mm

BGA484,22X22,32

Bottom

Ball

Tin Silver Copper

.8 mm

484

S-PBGA-B484

e1

No

AEC-Q100

XC4VFX12-10SF363I by Xilinx

XC4VFX12-10SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 225;

FPGA

12312

240

240

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-10SF363C by Xilinx

XC4VLX15-10SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-10SF363I by Xilinx

XC4VLX15-10SF363I

Xilinx

Xilinx XC4VLX15-10SF363I FPGA features 13824 logic cells, 1536 CLBs, and a max clock frequency of 1028 MHz. Ideal for high-performance applications requiring fast processing speeds and extensive logic capabilities in a compact form factor.

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX15-11SF363I by Xilinx

XC4VLX15-11SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Pitch Of Terminal: .8 mm;

FPGA

13824

240

240

1536

1205 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-10SF363C by Xilinx

XC4VLX25-10SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-10SF363I by Xilinx

XC4VLX25-10SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Qualification: Not Qualified;

FPGA

24192

240

240

2688

1028 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-11SF363C by Xilinx

XC4VLX25-11SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-11SF363I by Xilinx

XC4VLX25-11SF363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.26 V;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VLX25-12SF363C by Xilinx

XC4VLX25-12SF363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

24192

240

240

2688

1205 MHz

CMOS

Field Programmable Gate Arrays

2688 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Lead

.8 mm

363

S-PBGA-B363

e0

No

XC4VFX12-10SFG363C by Xilinx

XC4VFX12-10SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

12312

240

240

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VFX12-10SFG363I by Xilinx

XC4VFX12-10SFG363I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE; Organization: 1368 CLBS;

FPGA

12312

240

240

1368

1028 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VFX12-11SFG363C by Xilinx

XC4VFX12-11SFG363C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 363; Package Code: FBGA; Package Shape: SQUARE;

FPGA

12312

240

240

1368

1181 MHz

CMOS

Field Programmable Gate Arrays

1368 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No

XC4VLX15-10SFG363C by Xilinx

XC4VLX15-10SFG363C

Xilinx

The Xilinx XC4VLX15-10SFG363C is a FPGA with 13824 logic cells, 1536 CLBs, and max clock frequency of 1028 MHz. It operates at a supply voltage range of 1.14V to 1.26V and is ideal for applications requiring high-speed processing and programmable IC solutions in various industries.

FPGA

13824

240

240

1536

1028 MHz

CMOS

Field Programmable Gate Arrays

1536 CLBS

1.2

1.14 V

1.26 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array, Fine Pitch

FBGA

Square

17 mm

17 mm

1.99 mm

BGA363,20X20,32

Bottom

Ball

Tin Silver Copper

.8 mm

363

S-PBGA-B363

e1

No