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XC6SLX45-2CSG484C

Xilinx

XC6SLX45-2CSG484C by Xilinx

Xilinx XC6SLX45-2CSG484C FPGA features 43661 logic cells, 3411 CLBs, and 310 inputs/outputs. Utilized in applications requiring high-speed processing up to 667 MHz with a max operating temperature of 85°C. Ideal for designs needing programmable ICs with low power consumption and compact form factor.

Median Price

$106.880

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Overview

Discover the Xilinx XC6SLX45-2CSG484C, a powerful Field Programmable Gate Array (FPGA) that offers unmatched flexibility and performance. With 43661 logic cells and 3411 CLBs, this FPGA is perfect for a wide range of applications, from industrial automation to telecommunications. Xilinx, a renowned manufacturer in the industry, ensures top-notch quality and reliability in every product. Experience the benefits of cutting-edge CMOS technology, low power consumption, and high-speed processing capabilities. Upgrade your projects with the XC6SLX45-2CSG484C and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable electronic applications.

No. of Logic Cells: 43661

High number of logic cells allows for complex programmable logic designs to be implemented.

Surface Mount: YES

Surface mount packaging enables easy and efficient PCB assembly, reducing manufacturing time and cost.

Maximum Supply Voltage: 1.26 V

Low maximum supply voltage requirement helps in reducing power consumption and heat generation.

No. of CLBs: 3411

Large number of Configurable Logic Blocks (CLBs) provide flexibility in designing custom logic functions.

Technology Used: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers high speed, low power consumption, and noise immunity.

No. of Inputs: 310

Abundance of input pins allows for connecting multiple external signals and sensors.

Package Shape: SQUARE

Square package shape provides uniform mounting and easy placement on the PCB.

Form Of Terminal: BALL

Ball terminal design simplifies the soldering process during assembly and enhances mechanical reliability.

Nominal Supply Voltage (V): 1.2

Stable nominal supply voltage ensures consistent performance of the FPGA chip.

Power Supplies (V): 1.2,2.5/3.3

Support for multiple power supply voltages enables compatibility with different system requirements.

No. of Terminals: 484

High number of terminals allow for a greater number of input/output connections for external devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Field Programmable Gate Array (FPGA) allows for reconfigurable logic functions, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch layout optimizes signal integrity and thermal performance in high-density designs.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage requirement reduces power consumption while maintaining stable operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for reliable operation in various environmental conditions.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals enables high-density interconnects for efficient routing of signals.

Maximum Combinatorial Delay of a CLB: 0.26 ns

Low combinatorial delay ensures fast processing of logic functions, improving overall performance.

Organization: 3411 CLBS

Organized configuration of CLBs simplifies the design process and enhances logic function implementation.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable operation even in cold environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/silver/copper finishing provides excellent solderability, corrosion resistance, and mechanical strength for the terminals.

Position Of Terminal: BOTTOM

Bottom terminal positioning enables easy and secure mounting on the PCB, enhancing mechanical stability.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates moderate sensitivity to moisture during storage and assembly, requiring standard handling precautions.

Maximum Seated Height: 1.8 mm

Low seated height allows for compact and slim designs, suitable for applications with space constraints.

Width: 19 mm

Standard width facilitates easy integration into PCB layouts and ensures compatibility with standard mechanical specifications.

Maximum Clock Frequency: 667 MHz

High maximum clock frequency enables fast data processing and efficient execution of logic functions.

No. of Outputs: 310

Abundance of output pins allows for multiple signals to be sent to external devices or subsystems.

Maximum Time At Peak Reflow Temperature (s): 30

Adequate time at peak reflow temperature ensures proper soldering of the terminals during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability allows for reliable soldering of the terminals in lead-free processes.

Length: 19 mm

Standard length simplifies mechanical design considerations and ensures compatibility with industry-standard packaging.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC6SLX45-2CSG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

43661

No. of Inputs:

310

No. of Outputs:

310

No. of CLBs:

3411

Maximum Clock Frequency:

667 MHz

CLB Maximum Delay:

0.26 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

3411 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

1.8 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC6SLX45-2CSG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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