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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XCKU3P-3FFVA676E by Xilinx

XCKU3P-3FFVA676E

Xilinx

Xilinx XCKU3P-3FFVA676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for high-performance applications requiring advanced programmable ICs with a max supply voltage of 0.927 V. Suitable for various industries due to its versatility and robust design.

FPGA

355950

304

304

20340

20340 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-3FFVB676E by Xilinx

XCKU3P-3FFVB676E

Xilinx

Xilinx XCKU3P-3FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.927 V. Suitable for various industries due to its plastic/epoxy package body material and grid array package style.

FPGA

355950

304

304

20340

20340 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-L1FFVB676I by Xilinx

XCKU3P-L1FFVB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

355950

304

304

20340

20340 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-L2FFVB676E by Xilinx

XCKU3P-L2FFVB676E

Xilinx

Xilinx XCKU3P-L2FFVB676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 110°C. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly.

FPGA

355950

304

304

20340

20340 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVA676E by Xilinx

XCKU5P-1FFVA676E

Xilinx

Xilinx XCKU5P-1FFVA676E FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-speed processing and customization in industries like telecommunications, aerospace, and automotive due to its advanced programmable capabilities. Operates b/w -40°C to 100°C with a supply voltage range of 0.825V to 0.876V.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVB676E by Xilinx

XCKU5P-1FFVB676E

Xilinx

Xilinx XCKU5P-1FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V, making it suitable for various industrial environments.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-1FFVB676I by Xilinx

XCKU5P-1FFVB676I

Xilinx

Xilinx XCKU5P-1FFVB676I FPGA features 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. With a supply voltage range of 0.825V to 0.876V, it is ideal for industrial applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and ball terminals, suitable for surface mount assembly processes.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-2FFVB676I by Xilinx

XCKU5P-2FFVB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-3FFVB676E by Xilinx

XCKU5P-3FFVB676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.9

.873 V

.927 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L1FFVB676I by Xilinx

XCKU5P-L1FFVB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVA676E by Xilinx

XCKU5P-L2FFVA676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-L2FFVB676E by Xilinx

XCKU5P-L2FFVB676E

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

474600

304

304

27120

27120 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

0 °C (32 °F)

110 °C (230 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S100-1FGGA676C by Xilinx

XC7S100-1FGGA676C

Xilinx

The Xilinx XC7S100-1FGGA676C is a FPGA with 102400 logic cells, 8000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S100-1FGGA676I by Xilinx

XC7S100-1FGGA676I

Xilinx

Xilinx XC7S100-1FGGA676I FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 676 terminals.

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S100-2FGGA676C by Xilinx

XC7S100-2FGGA676C

Xilinx

The Xilinx XC7S100-2FGGA676C is a FPGA with 102400 logic cells, 8000 CLBs, and max clock frequency of 1286 MHz. It uses HKMG tech and operates b/w 0-85°C. Ideal for applications requiring high-speed processing like telecommunications and data centers.

FPGA

102400

400

400

8000

1286 MHz

1.05 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S100-2FGGA676I by Xilinx

XC7S100-2FGGA676I

Xilinx

Xilinx XC7S100-2FGGA676I FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact 27mm square grid array package with PLASTIC/EPOXY body material.

FPGA

102400

400

400

8000

1286 MHz

1.05 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S100-L1FGGA676I by Xilinx

XC7S100-L1FGGA676I

Xilinx

Xilinx XC7S100-L1FGGA676I FPGA features 102400 logic cells, 8000 CLBs, and max clock freq of 1098 MHz. Ideal for industrial applications with temp range -40 to 100 °C, uses HKMG tech, and has 400 inputs/outputs for high-performance computing tasks.

FPGA

102400

400

400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-1FGGA676C by Xilinx

XC7S75-1FGGA676C

Xilinx

Xilinx XC7S75-1FGGA676C FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-1FGGA676I by Xilinx

XC7S75-1FGGA676I

Xilinx

Xilinx XC7S75-1FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 400 inputs/outputs.

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-2FGGA676C by Xilinx

XC7S75-2FGGA676C

Xilinx

The Xilinx XC7S75-2FGGA676C is a FPGA with 76800 logic cells, 6000 CLBs, and max clock frequency of 1286 MHz. It uses HKMG tech and operates b/w 0-85°C. Ideal for applications requiring high-speed processing like telecommunications and data centers.

FPGA

76800

400

400

6000

1286 MHz

1.05 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-2FGGA676I by Xilinx

XC7S75-2FGGA676I

Xilinx

Xilinx XC7S75-2FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact package with PLASTIC/EPOXY material.

FPGA

76800

400

400

6000

1286 MHz

1.05 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-L1FGGA676I by Xilinx

XC7S75-L1FGGA676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-2FFVA676E by Xilinx

XCKU3P-2FFVA676E

Xilinx

Xilinx XCKU3P-2FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU3P-2FFVB676E by Xilinx

XCKU3P-2FFVB676E

Xilinx

Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.

FPGA

355950

304

304

20340

20340 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-2FFVA676E by Xilinx

XCKU5P-2FFVA676E

Xilinx

Xilinx XCKU5P-2FFVA676E is a FPGA with 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. It operates b/w -40 to 100°C and has a supply voltage range of 0.825V to 0.876V. Ideal for applications requiring high-speed processing and programmable ICs in compact designs.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCKU5P-2FFVB676E by Xilinx

XCKU5P-2FFVB676E

Xilinx

Xilinx XCKU5P-2FFVB676E FPGA offers 474600 logic cells, 27120 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C.

FPGA

474600

304

304

27120

27120 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

Other

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XC7S75-1FGGA676Q by Xilinx

XC7S75-1FGGA676Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

76800

400

400

6000

1098 MHz

1.27 ns

HKMG

6000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Matte Tin

1 mm

676

S-PBGA-B676

e3

XC7K160T-2FF676I by Xilinx

XC7K160T-2FF676I

Xilinx

Xilinx XC7K160T-2FF676I FPGA features 162240 logic cells, 12675 CLBs, and max clock frequency of 1818 MHz. Ideal for industrial applications requiring high-speed processing with a max operating temp of 100°C. Package style is grid array with PLASTIC/EPOXY material and tin/lead finishing.

FPGA

162240

400

400

12675

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

12675 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead

1 mm

676

S-PBGA-B676

e0

No

XC7K325T-2FF676I by Xilinx

XC7K325T-2FF676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

326080

400

400

25475

1818 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

25475 CLBS

1

.97 V

1.03 V

1,1.8,3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.37 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead

1 mm

676

S-PBGA-B676

e0

No

XA7S100-1FGGA676Q by Xilinx

XA7S100-1FGGA676Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

102400

8000

1098 MHz

1.27 ns

HKMG

8000 CLBS

1

.95 V

1.05 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

Bottom

Ball

1 mm

676

S-PBGA-B676

AEC-Q100; TS 16949

XC7K160T-1FF676I by Xilinx

XC7K160T-1FF676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 162240;

FPGA

162240

400

400

1818 MHz

CMOS

Field Programmable Gate Arrays

1,1.8,3.3 V

225 °C (437 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC5VLX50-1FFV676C by Xilinx

XC5VLX50-1FFV676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

46080

440

440

3600

0.9 ns

3600 CLBS

1

.95 V

1.05 V

0 °C (32 °F)

85 °C (185 °F)

Other

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

1 mm

676

S-PBGA-B676

XCAU25P-L1FFVB676I by Xilinx

XCAU25P-L1FFVB676I

Xilinx

Xilinx XCAU25P-L1FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 208 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries. Operating temperature ranges from -40 to 100°C with a max supply voltage of 0.742V.

FPGA

308437

208

208

17625

17625 CLBS

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCAU25P-2FFVB676I by Xilinx

XCAU25P-2FFVB676I

Xilinx

Xilinx XCAU25P-2FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 280 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100°C with a supply voltage range of 0.825V to 0.876V.

FPGA

308437

280

280

17625

17625 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCAU10P-L1FFVB676I by Xilinx

XCAU10P-L1FFVB676I

Xilinx

Xilinx XCAU10P-L1FFVB676I FPGA features 96250 logic cells, 5500 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operates b/w -40 to 100 °C with a supply voltage range of 0.698V to 0.742V.

FPGA

96250

228

228

5500

5500 CLBS

Also Operates at 0.85 V nominal supply

0.72

.698 V

.742 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCAU20P-1FFVB676E by Xilinx

XCAU20P-1FFVB676E

Xilinx

Xilinx XCAU20P-1FFVB676E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-speed processing and complex algorithms in industries like telecommunications, aerospace, and automotive. Package style: Grid Array; Operating temp: 0-100°C; Supply voltage range: 0.825-0.876V.

FPGA

238437

228

228

13625

13625 CLBS

0.85

.825 V

.876 V

0 °C (32 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XCAU15P-2FFVB676I by Xilinx

XCAU15P-2FFVB676I

Xilinx

Xilinx XCAU15P-2FFVB676I FPGA offers 170100 logic cells, 9720 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from -40 to 100°C makes it versatile for various environments.

FPGA

170100

228

228

9720

9720 CLBS

0.85

.825 V

.876 V

-40 °C (-40 °F)

100 °C (212 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3.52 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

XA7K160T-1FFG676Q by Xilinx

XA7K160T-1FFG676Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Screening Level: AEC-Q100; TS 16949;

FPGA

162240

400

400

12675

HKMG

12675 CLBS

1

.97 V

1.03 V

-40 °C (-40 °F)

125 °C (257 °F)

250 °C (482 °F)

30 s

4

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

3 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

AEC-Q100; TS 16949

XC7A200T-L1FB676I by Xilinx

XC7A200T-L1FB676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

FPGA

215360

400

400

16825

1098 MHz

1.27 ns

16825 CLBS

0.95

.92 V

.98 V

-40 °C (-40 °F)

100 °C (212 °F)

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.54 mm

BGA676,26X26,40

Bottom

Ball

1 mm

676

S-PBGA-B676