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XCKU3P-2FFVA676E

Xilinx

XCKU3P-2FFVA676E by Xilinx

Xilinx XCKU3P-2FFVA676E FPGA offers 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from 0 to 100°C makes it versatile for various industrial uses.

Median Price

$1,964.488

Lifecycle Status

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6

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1k+

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Nova Conductors

Japan . 450 parts In-Stock

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Chip Stock

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Component Sense

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Digiode

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Semicontronic

India . 1,103 parts In-Stock

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AZTECH Wire

Italy . 697 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 336 parts In-Stock

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Modulus Dynamics

Lithuania . 531 parts In-Stock

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Aztec Data Supply Inc.

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Corohmni

South Africa . 499 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

USA . 30 parts In-Stock

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$213.332

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$206.665

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$195.554

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Qasali Group International

UK . 2,649 parts In-Stock

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Argo Parts USA

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$1,925.198

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$1,905.553

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Continental Prestige Electronics

USA . 1,314 parts In-Stock

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Microchip USA

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Supply Digital

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Netroflash

USA . 50 parts In-Stock

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Overview

Unleash the power of innovation with the XCKU3P-2FFVA676E by Xilinx, a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA). With its impressive 355,950 logic cells and 20,340 CLBs, this FPGA offers unparalleled versatility and performance. Whether you're in the automotive, aerospace, or telecommunications industry, this FPGA is designed to meet your specific needs, providing you with a competitive edge in today's fast-paced market. Elevate your designs with the XCKU3P-2FFVA676E and experience the quality, reliability, and cutting-edge technology that only Xilinx can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the FPGA suitable for a wide range of environments.

No. of Logic Cells: 355950

Offers a large amount of logic cells for complex programmable functions and designs.

Surface Mount: YES

Allows for easy installation on PCBs, saving time and effort in the assembly process.

Maximum Supply Voltage: 0.876 V

Efficient power consumption and operation within a safe voltage range.

No. of CLBs: 20340

Provides a high number of Configurable Logic Blocks for versatile programming options.

No. of Inputs: 304

Offers a large number of input channels for versatile connectivity and signal processing.

Package Shape: SQUARE

Facilitates easy handling and integration into PCB layouts.

Nominal Supply Voltage (V): 0.85

Optimal voltage level for efficient and reliable operation.

No. of Terminals: 676

Provides a sufficient number of terminals for adequate connectivity and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Enables flexible and customizable logic configurations for various applications.

Package Style (Meter): GRID ARRAY

Ensures secure mounting and connectivity on PCBs.

Minimum Supply Voltage: 0.825 V

Allows for operation at lower power levels, reducing energy consumption.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, suitable for demanding industrial environments.

Pitch Of Terminal: 1 mm

Optimal spacing between terminals for ease of soldering and connection.

Minimum Operating Temperature: 0 °C

Can operate reliably in low-temperature environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Ensures good conductivity and corrosion resistance for reliable connections.

Position Of Terminal: BOTTOM

Facilitates easy access and connectivity during installation on PCBs.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection against moisture, suitable for various environmental conditions.

Maximum Seated Height: 3.52 mm

Compact size for efficient use of space on the PCB.

Width: 27 mm

Compact form factor for easy integration into different electronic systems.

No. of Outputs: 304

Provides a high number of output channels for signal processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and thermal management during assembly.

Peak Reflow Temperature °C: 250

Can withstand high reflow temperatures for reliable soldering and thermal stability.

Length: 27 mm

Compact and standardized length for easy integration into electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCKU3P-2FFVA676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

355950

No. of Inputs:

304

No. of Outputs:

304

No. of CLBs:

20340

Organization:

20340 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCKU3P-2FFVA676E Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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