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Part# Info IC Features Power Characteristics Temperature and Environmental Ratings Packaging and Physical Characteristics Terminal Characteristcs Standards
Part RoHS Manufacturer Description Programmable IC Type No. of Logic Cells No. of Inputs No. of Outputs No. of CLBs No. of Equivalent Gates Maximum Clock Frequency CLB Maximum Delay Technology Sub-Category Organization Additional Features Nominal Supply Voltage Minimum Supply Voltage Maximum Supply Voltage Power Supplies Minimum Operating Temperature Maximum Operating Temperature Temperature Grade Peak Reflow Temperature Peak Reflow Time Moisture Sensitivity Level (MSL) Total Radiation Exposure Package Body Material Surface Mountable Package Style Package Code Package Shape Length Width Maximum Seated Height Packing Method Package Equivalence Code Terminal Position Terminal Style Terminal Finish Terminal Pitch No. of Terminals JESD-30 Code JESD-609 Code Qualified Screening Level
XC2VP40-5FG676I by Xilinx

XC2VP40-5FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP40-6FG676C by Xilinx

XC2VP40-6FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP40-6FG676I by Xilinx

XC2VP40-6FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

-40 °C (-40 °F)

100 °C (212 °F)

Industrial

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XC2VP40-7FG676C by Xilinx

XC2VP40-7FG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

0 °C (32 °F)

85 °C (185 °F)

Other

225 °C (437 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Lead (Sn63Pb37)

1 mm

676

S-PBGA-B676

e0

No

XA3SD1800A-4FGG676I by Xilinx

XA3SD1800A-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

37440

519

409

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

100 °C (212 °F)

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XA3SD1800A-4FGG676Q by Xilinx

XA3SD1800A-4FGG676Q

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

37440

519

409

4160

37440

667 MHz

0.71 ns

CMOS

Field Programmable Gate Arrays

4160 CLBS, 37440 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5/3.3 V

-40 °C (-40 °F)

125 °C (257 °F)

Automotive

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XA3SD3400A-4FGG676I by Xilinx

XA3SD3400A-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

53712

469

409

5968

53712

667 MHz

CMOS

Field Programmable Gate Arrays

5968 CLBS, 53712 Gates

1.2,1.2/3.3,2.5/3.3 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

AEC-Q100

XC2V1500-4FGG676C by Xilinx

XC2V1500-4FGG676C

Xilinx

XC2V1500-4FGG676C by Xilinx is a CMOS FPGA with 17280 logic cells and 1920 CLBs. It operates at a max clock frequency of 650 MHz and is commonly used in applications requiring high-performance programmable logic solutions.

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-4FGG676I by Xilinx

XC2V1500-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

17280

392

392

1920

1500000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-5FGG676C by Xilinx

XC2V1500-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-5FGG676I by Xilinx

XC2V1500-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

FPGA

17280

392

392

1920

1500000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V1500-6FGG676C by Xilinx

XC2V1500-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

392

392

1920

1500000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1500000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-4FGG676C by Xilinx

XC2V2000-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

456

456

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-4FGG676I by Xilinx

XC2V2000-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

24192

456

456

2688

2000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-5FGG676C by Xilinx

XC2V2000-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

456

456

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-5FGG676I by Xilinx

XC2V2000-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FPGA

24192

456

456

2688

2000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V2000-6FGG676C by Xilinx

XC2V2000-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

24192

456

456

2688

2000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

2688 CLBS, 2000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC3S1000-4FGG676C by Xilinx

XC3S1000-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1000-4FGG676I by Xilinx

XC3S1000-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

FPGA

17280

391

391

1920

1000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1000-5FGG676C by Xilinx

XC3S1000-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

17280

391

391

1920

1000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

1920 CLBS, 1000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1500-4FGG676C by Xilinx

XC3S1500-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1500-4FGG676I by Xilinx

XC3S1500-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;

FPGA

29952

487

487

3328

1500000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S1500-5FGG676C by Xilinx

XC3S1500-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

29952

487

487

3328

1500000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

3328 CLBS, 1500000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S2000-4FGG676C by Xilinx

XC3S2000-4FGG676C

Xilinx

The Xilinx XC3S2000-4FGG676C is a FPGA with 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates. It operates at a max frequency of 630 MHz and has 489 inputs/outputs. Ideal for applications requiring high-speed processing in electronics and telecommunications industries.

FPGA

46080

489

489

5120

2000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S2000-4FGG676I by Xilinx

XC3S2000-4FGG676I

Xilinx

Xilinx XC3S2000-4FGG676I FPGA features 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for high-performance applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and ball terminals.

FPGA

46080

489

489

5120

2000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S2000-5FGG676C by Xilinx

XC3S2000-5FGG676C

Xilinx

Xilinx XC3S2000-5FGG676C FPGA offers 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates. Ideal for applications requiring high clock frequency up to 725 MHz, with a max operating temperature of 85°C. Package style: grid array, package body material: plastic/epoxy.

FPGA

46080

489

489

5120

2000000

725 MHz

0.53 ns

CMOS

Field Programmable Gate Arrays

5120 CLBS, 2000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC2VP20-5FGG676C by Xilinx

XC2VP20-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

404

404

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP20-5FGG676I by Xilinx

XC2VP20-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.44 mm;

FPGA

20880

404

404

2320

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP20-6FGG676C by Xilinx

XC2VP20-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

404

404

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP20-6FGG676I by Xilinx

XC2VP20-6FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Combinatorial Delay of a CLB: .32 ns;

FPGA

20880

404

404

2320

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP20-7FGG676C by Xilinx

XC2VP20-7FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

20880

404

404

2320

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

2320 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP30-5FGG676I by Xilinx

XC2VP30-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; No. of Logic Cells: 30816;

FPGA

30816

416

416

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP30-6FGG676C by Xilinx

XC2VP30-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

416

416

3424

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP30-5FGG676C by Xilinx

XC2VP30-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

30816

416

416

3424

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

3424 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-4FGG676C by Xilinx

XC2V3000-4FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

484

484

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-4FGG676I by Xilinx

XC2V3000-4FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;

FPGA

32256

484

484

3584

3000000

650 MHz

0.44 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-5FGG676C by Xilinx

XC2V3000-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

484

484

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-5FGG676I by Xilinx

XC2V3000-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

FPGA

32256

484

484

3584

3000000

750 MHz

0.39 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2V3000-6FGG676C by Xilinx

XC2V3000-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

32256

484

484

3584

3000000

820 MHz

0.35 ns

CMOS

Field Programmable Gate Arrays

3584 CLBS, 3000000 Gates

1.5

1.425 V

1.575 V

1.5,1.5/3.3,3.3 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-5FGG676C by Xilinx

XC2VP40-5FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-5FGG676I by Xilinx

XC2VP40-5FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

FPGA

43632

416

416

4848

1050 MHz

0.36 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-6FGG676C by Xilinx

XC2VP40-6FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-6FGG676I by Xilinx

XC2VP40-6FGG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

FPGA

43632

416

416

4848

1200 MHz

0.32 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC2VP40-7FGG676C by Xilinx

XC2VP40-7FGG676C

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;

FPGA

43632

416

416

4848

1350 MHz

0.28 ns

CMOS

Field Programmable Gate Arrays

4848 CLBS

1.5

1.425 V

1.575 V

1.5,1.5/3.3,2/2.5,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

250 °C (482 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.44 mm

BGA676,26X26,40

Bottom

Ball

Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)

1 mm

676

S-PBGA-B676

e1

No

XC3S4000-4FG676C by Xilinx

XC3S4000-4FG676C

Xilinx

The Xilinx XC3S4000-4FG676C is a FPGA with 62208 logic cells, 6912 CLBs, and 4000000 equivalent gates. It operates at a max frequency of 630 MHz and has 489 inputs/outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

62208

489

489

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S4000-4FG676I by Xilinx

XC3S4000-4FG676I

Xilinx

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Position Of Terminal: BOTTOM;

FPGA

62208

489

489

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Lead

1 mm

676

S-PBGA-B676

e0

No

XC3S4000-4FGG676C by Xilinx

XC3S4000-4FGG676C

Xilinx

The Xilinx XC3S4000-4FGG676C is a FPGA with 62208 logic cells, 6912 CLBs, and 4000000 equivalent gates. It operates at a max frequency of 630 MHz and has 489 inputs/outputs. Ideal for applications requiring high-speed processing in fields like telecommunications and industrial automation.

FPGA

62208

489

489

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

0 °C (32 °F)

85 °C (185 °F)

Other

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No

XC3S4000-4FGG676I by Xilinx

XC3S4000-4FGG676I

Xilinx

XC3S4000-4FGG676I by Xilinx is a CMOS FPGA with 62208 logic cells and 6912 CLBs. It operates at a max clock frequency of 630 MHz and is commonly used in applications requiring high-speed data processing.

FPGA

62208

489

489

6912

4000000

630 MHz

0.61 ns

CMOS

Field Programmable Gate Arrays

6912 CLBS, 4000000 Gates

1.2

1.14 V

1.26 V

1.2,1.2/3.3,2.5 V

260 °C (500 °F)

30 s

3

Plastic/Epoxy

Yes

Grid Array

BGA

Square

27 mm

27 mm

2.6 mm

BGA676,26X26,40

Bottom

Ball

Tin Silver Copper

1 mm

676

S-PBGA-B676

e1

No