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XC3S2000-4FGG676I

Xilinx

XC3S2000-4FGG676I by Xilinx

Xilinx XC3S2000-4FGG676I FPGA features 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates. With a max clock frequency of 630 MHz, it is ideal for high-performance applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and ball terminals.

Median Price

$65.700

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VNN

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Nova Conductors

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Ampacity Inc.

Singapore . 423 parts In-Stock

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AZTECH Wire

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Modulus Dynamics

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Texas Native Microelectronics

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Aztec Data Supply Inc.

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Kenton Components

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Continental Prestige Electronics

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Microchip USA

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RC Electronics

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Overview

Unlock endless possibilities with the XC3S2000-4FGG676I by Xilinx, a leading manufacturer known for its top-notch quality in Field Programmable Gate Arrays (FPGA). This innovative product offers a seamless integration of advanced technology, providing a versatile solution for various applications. With 46080 logic cells and 5120 CLBs, this FPGA delivers unmatched performance and efficiency. Experience the power of 2000000 equivalent gates at a maximum clock frequency of 630 MHz, all in a compact square package. Elevate your projects with the XC3S2000-4FGG676I and discover a world of limitless opportunities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and durable, suitable for various applications.

No. of Logic Cells: 46080

With a large number of logic cells, this FPGA can handle complex processes and calculations efficiently.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 5120

Having a high number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic functions.

Technology Used: CMOS

Utilizing CMOS technology ensures low power consumption, high noise immunity, and fast switching speeds, enhancing overall performance.

No. of Inputs: 489

The ample number of inputs allows for connecting multiple external devices and sensors, enabling versatile input processing.

Package Shape: SQUARE

The square package shape facilitates easy placement and alignment on PCBs, optimizing space utilization.

Form Of Terminal: BALL

Ball terminals provide reliable connections and enable easy soldering during assembly, ensuring robust electrical connections.

No. of Equivalent Gates: 2000000

A high number of equivalent gates enable complex programmable logic operations, making the FPGA suitable for advanced applications.

Nominal Supply Voltage (V): 1.2

The stable nominal supply voltage ensures consistent performance and reliable operation of the FPGA.

Power Supplies (V): 1.2,1.2/3.3,2.5

Supporting multiple power supply voltages enables compatibility with different circuit configurations and power requirements.

No. of Terminals: 676

Having a sufficient number of terminals facilitates easy connectivity and routing of signals, enhancing design flexibility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows customization and reprogramming of logic functions, making it adaptable to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style simplifies the alignment and mounting of the FPGA on PCBs, ensuring accurate placement and secure connections.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage ensures reliable operation even under varying voltage conditions, enhancing the FPGA's robustness.

Pitch Of Terminal: 1 mm

The tight pitch of terminals allows for compact placement on PCBs, saving space and enabling high-density designs.

Maximum Combinatorial Delay of a CLB: 0.61 ns

The minimal combinatorial delay of a Configurable Logic Block (CLB) ensures fast processing of logic operations, enhancing overall speed and efficiency.

Organization: 5120 CLBS, 2000000 GATES

The organized structure of 5120 CLBs and 2,000,000 gates provides a clear architecture for implementing complex logic functions effectively.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper for terminal finishing ensures reliable solder joints, high conductivity, and corrosion resistance, enhancing the FPGA's durability.

Position Of Terminal: BOTTOM

Having the terminals at the bottom allows for easy mounting and soldering, simplifying the assembly process and ensuring secure connections.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, the FPGA can withstand normal manufacturing and storage conditions without degradation.

Maximum Seated Height: 2.6 mm

The low maximum seated height makes the FPGA suitable for compact electronic devices and applications with strict height constraints.

Width: 27 mm

The moderate width ensures compatibility with standard PCB sizes and allows for easy integration into various electronic systems.

Maximum Clock Frequency: 630 MHz

Supporting a high maximum clock frequency of 630 MHz enables fast operation and real-time processing of data, making the FPGA suitable for high-speed applications.

No. of Outputs: 489

With a substantial number of outputs, the FPGA can drive multiple devices and signals, enabling efficient data processing and communication.

Maximum Time At Peak Reflow Temperature (s): 30

The specified maximum time at peak reflow temperature ensures reliable soldering and assembly processes, preventing thermal damage to the FPGA.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance of 260°C, the FPGA can withstand lead-free soldering processes and harsh manufacturing environments.

Length: 27 mm

The moderate length allows for easy integration into standard PCB layouts and compact electronic devices, optimizing space utilization.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S2000-4FGG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

46080

No. of Inputs:

489

No. of Outputs:

489

No. of CLBs:

5120

No. of Equivalent Gates:

2000000

Maximum Clock Frequency:

630 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5120 CLBS, 2000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S2000-4FGG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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