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XC3S2000-5FGG676C

Xilinx

XC3S2000-5FGG676C by Xilinx

Xilinx XC3S2000-5FGG676C FPGA offers 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates. Ideal for applications requiring high clock frequency up to 725 MHz, with a max operating temperature of 85°C. Package style: grid array, package body material: plastic/epoxy.

Median Price

$211.920

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Mouser Electronics

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Modulus Dynamics

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Overview

Unlock the power of innovation with the XC3S2000-5FGG676C by Xilinx, a top-tier manufacturer in the field of FPGA technology. This cutting-edge Field Programmable Gate Array boasts 46080 logic cells, 5120 CLBs, and 2000000 equivalent gates, providing unparalleled performance for a wide range of applications. With a maximum clock frequency of 725 MHz and a minimum operating temperature of 0°C, this FPGA delivers reliability and efficiency like no other. Embrace the future of technology with the XC3S2000-5FGG676C and experience the difference that quality engineering can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making the FPGA reliable for a wide range of applications.

No. of Logic Cells: 46080

With a high number of logic cells, this FPGA can handle complex processing tasks efficiently.

Maximum Supply Voltage: 1.26 V

Operates efficiently at a maximum supply voltage of 1.26V, making it suitable for low-power applications.

Technology Used: CMOS

CMOS technology offers high speed and low power consumption, enhancing the performance of the FPGA.

No. of Equivalent Gates: 2000000

Having a large number of equivalent gates allows for the implementation of complex logic functions within the FPGA.

Nominal Supply Voltage (V): 1.2

Stable supply voltage of 1.2V ensures reliable operation of the FPGA.

Maximum Clock Frequency: 725 MHz

High maximum clock frequency allows for fast processing speeds, making the FPGA suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

Operates efficiently at temperatures up to 85°C, suitable for a wide range of operating environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S2000-5FGG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

46080

No. of Inputs:

489

No. of Outputs:

489

No. of CLBs:

5120

No. of Equivalent Gates:

2000000

Maximum Clock Frequency:

725 MHz

CLB Maximum Delay:

0.53 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

5120 CLBS, 2000000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.6 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S2000-5FGG676C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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