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XCAU20P-1FFVB676E

Xilinx

XCAU20P-1FFVB676E by Xilinx

Xilinx XCAU20P-1FFVB676E FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-speed processing and complex algorithms in industries like telecommunications, aerospace, and automotive. Package style: Grid Array; Operating temp: 0-100°C; Supply voltage range: 0.825-0.876V.

Median Price

$343.670

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VNN

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Overview

Discover endless possibilities with the XCAU20P-1FFVB676E by Xilinx, a cutting-edge Field Programmable Gate Array that boasts 238437 logic cells and 13625 CLBs. This FPGA is designed with precision and reliability in mind, using high-quality materials like PLASTIC/EPOXY for optimal performance. Whether you're in the aerospace, telecommunications, or automotive industry, this versatile product offers unparalleled flexibility and customization to suit your specific needs. Experience the power of innovation with Xilinx and elevate your projects to new heights today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for various environments.

No. of Logic Cells: 238437

With a large number of logic cells, this FPGA offers high processing power and capability for complex designs.

Surface Mount: YES

The surface mount feature allows for easy installation and replacement, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 0.876 V

This low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 13625

The high number of Configurable Logic Blocks (CLBs) increases the versatility and customization options for the FPGA design.

No. of Inputs: 228

With a large number of inputs, this FPGA can handle multiple data streams and signals simultaneously.

Package Shape: SQUARE

The square shape of the package provides efficient use of space on a circuit board, maximizing design flexibility.

Form Of Terminal: BALL

The ball terminal format ensures secure connections and efficient signal transmission within the FPGA.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85V optimizes the performance and reliability of the FPGA during operation.

No. of Terminals: 676

A high number of terminals allows for versatile connectivity options and integration with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device, this FPGA offers flexibility for customization and adaptation to specific application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a robust and secure mounting solution for the FPGA on the circuit board.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures stable operation and functionality under various operating conditions.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and extended use.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals enables compact and efficient layout designs on the circuit board.

Organization: 13625 CLBS

The organized arrangement of 13625 Configurable Logic Blocks (CLBs) enhances the FPGA's processing efficiency and performance.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for reliable operation in colder environments without compromising performance.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals ensures reliable connections and reduces the risk of corrosion.

Position Of Terminal: BOTTOM

The bottom position of terminals offers easy access for soldering and maintenance during the assembly process.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this FPGA can withstand moderate exposure to humidity without affecting its performance.

Maximum Seated Height: 3.52 mm

The low maximum seated height allows for compact and space-saving designs in electronic systems.

Width: 27 mm

The 27mm width provides a balance between space efficiency and component density, making it suitable for various applications.

No. of Outputs: 228

With a high number of outputs, this FPGA can drive multiple external devices and interfaces efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and bonding during assembly.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FPGA can withstand the soldering process without damage to its components.

Length: 27 mm

The 27mm length provides a compact form factor for the FPGA, allowing for versatile integration into various electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCAU20P-1FFVB676E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

238437

No. of Inputs:

228

No. of Outputs:

228

No. of CLBs:

13625

Organization:

13625 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCAU20P-1FFVB676E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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