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FBGA Multi-functional Peripherals 94

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
VCE6467TZUTL1 by Texas Instruments

VCE6467TZUTL1

Texas Instruments

Multifunction Peripherals; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;

0

32

YES

I2C; USB

35 MHz

0

FIXED POINT

S-PBGA-B529

19 mm

4

33

529

85 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

245

1.3,1.8/3.3

Not Qualified

128

3.3 mm

Digital Signal Processors

1.365 V

1.235 V

1.3 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

30

19 mm

MIMX8MD6CVAHZAA by NXP Semiconductors

MIMX8MD6CVAHZAA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE;

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ5CVAHZAA by NXP Semiconductors

MIMX8MQ5CVAHZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MQ5CVAHZAA is a multi-functional peripheral IC with 621 terminals, operating at -40 to 105°C. It features 81920 RAM words, supports Ethernet, I2C, and USB buses, and has a max clock frequency of 40 MHz. Ideal for industrial applications requiring high-speed data processing in compact form factors.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ6CVAHZAA by NXP Semiconductors

MIMX8MQ6CVAHZAA

NXP Semiconductors

The NXP Semiconductors MIMX8MQ6CVAHZAA is a multi-functional peripheral with a max clock frequency of 40 MHz. It is widely used in industrial applications and supports various bus compatibilities such as Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MD6CVAHZAB by NXP Semiconductors

MIMX8MD6CVAHZAB

NXP Semiconductors

NXP Semiconductors' MIMX8MD6CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and 40 MHz max clock frequency. Ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART & USB bus compatibility at -40 to 105°C operating temp.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ5CVAHZAB by NXP Semiconductors

MIMX8MQ5CVAHZAB

NXP Semiconductors

The NXP Semiconductors MIMX8MQ5CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and a max clock frequency of 40 MHz. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility in a compact square package with fine pitch grid array style.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

e2

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8MQ6CVAHZAB by NXP Semiconductors

MIMX8MQ6CVAHZAB

NXP Semiconductors

The NXP Semiconductors MIMX8MQ6CVAHZAB is a multi-functional peripheral IC with 621 terminals, 81920 RAM words, and a max clock frequency of 40 MHz. It is ideal for industrial applications requiring Ethernet, I2C, I2S, PCI, RS-232, SPI, UART, and USB bus compatibility in a compact square package with a terminal pitch of 0.65 mm.

0.9 V NOMINAL ALSO AVAILABLE @800MHZ,DRAM_AC (39) AND DRAM_DQ(32) NVCC_DRAM AVAILABLE

YES

ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB

40 MHz

S-PBGA-B621

e2

17 mm

3

16

621

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

81920

2.18 mm

1.05 V

.9 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.65 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

TDA2HGBRQABCRQ1 by Texas Instruments

TDA2HGBRQABCRQ1

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;

16

32

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.5M

AEC-Q100

2.96 mm

750 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TDA2SGBRQABCRQ1 by Texas Instruments

TDA2SGBRQABCRQ1

Texas Instruments

TDA2SGBRQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 2.5M RAM words, operating at up to 38.4 MHz clock frequency. Ideal for automotive applications, it features CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB compatibility in a compact square package with 760 terminals and low power mode.

16

32

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.5M

AEC-Q100

2.96 mm

750 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TDA2SXBTQABCRQ1 by Texas Instruments

TDA2SXBTQABCRQ1

Texas Instruments

TDA2SXBTQABCRQ1 by Texas Instruments is a 32-bit microprocessor with 760 terminals, operating at up to 38.4 MHz. Ideal for automotive applications, it supports CAN, Ethernet, I2C, IRDA, PCI, SPI, UART and USB bus compatibility. With low power mode and boundary scan feature, it ensures efficient performance in multi-functional peripherals.

16

32

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

247

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.5M

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA722AHGABCQ1 by Texas Instruments

DRA722AHGABCQ1

Texas Instruments

DRA722AHGABCQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and a max clock frequency of 27 MHz. Ideal for automotive applications, this microprocessor features a CMOS technology, operates at temperatures ranging from -40 to 125 °C, and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA722AHGABCRQ1 by Texas Instruments

DRA722AHGABCRQ1

Texas Instruments

DRA722AHGABCRQ1 by Texas Instruments is a multi-functional peripheral with 16-bit address bus width, 32-bit external data bus width, and 512K RAM words. Ideal for automotive applications, it operates at temperatures ranging from -40 to 125 °C and supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

800 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA724JGABCRQ1 by Texas Instruments

DRA724JGABCRQ1

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

1

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1000 rpm

.01 mA

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725LGABCRQ1 by Texas Instruments

DRA725LGABCRQ1

Texas Instruments

DRA725LGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 38.4 MHz max clock frequency, and 512K RAM words. Ideal for automotive applications, it features a CMOS technology microprocessor with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART & USB compatibility.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725AGGABCQ1 by Texas Instruments

DRA725AGGABCQ1

Texas Instruments

The Texas Instruments DRA725AGGABCQ1 is a multi-functional peripheral with 760 terminals, 512K RAM words, and a max clock frequency of 38.4 MHz. Ideal for automotive applications, this microprocessor supports various bus compatibilities like CAN, Ethernet, and USB while operating at temperatures ranging from -40 to 125 °C.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA725AGGABCRQ1 by Texas Instruments

DRA725AGGABCRQ1

Texas Instruments

DRA725AGGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 760 terminals, and 512K RAM words. Ideal for automotive applications, this microprocessor features a max clock frequency of 38.4 MHz and operates in a temperature range from -40 to 125°C.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

38.4 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1176 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA726APGABCQ1 by Texas Instruments

DRA726APGABCQ1

Texas Instruments

DRA726APGABCQ1 by Texas Instruments is a multi-functional peripheral IC with 32-bit external data bus width, 512K RAM words, and 27 MHz max clock frequency. It is designed for automotive applications, featuring a CMOS technology, AEC-Q100 screening level, and compatibility with CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB interfaces.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

DRA726APGABCRQ1 by Texas Instruments

DRA726APGABCRQ1

Texas Instruments

DRA726APGABCRQ1 by Texas Instruments is a multi-functional peripheral with 32-bit external data bus width, 512K RAM words, and 27 MHz max clock frequency. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, IRDA, PCI, SPI, UART, and USB.

16

YES

CAN; ETHERNET; I2C; IRDA; PCI; SPI; UART; USB

27 MHz

32

FIXED POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

215

760

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

512K

AEC-Q100

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

LS1026ASN8P1A by NXP Semiconductors

LS1026ASN8P1A

NXP Semiconductors

LS1026ASN8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 1400 MHz max clock frequency, and 780 terminals. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact square package with a terminal pitch of 0.8 mm.

14

YES

I2C, PCI, SPI, UART, USB

1400 MHz

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8MQA by NXP Semiconductors

LS1026ASE8MQA

NXP Semiconductors

LS1026ASE8MQA by NXP Semiconductors is a multi-functional peripheral with a package body made of plastic/epoxy. It has a max supply voltage of 0.93V and an address bus width of 14. This versatile component is compatible with I2C, PCI, SPI, UART, and USB buses and can be used in various applications requiring high-performance peripherals.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8P1A by NXP Semiconductors

LS1026ASE8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Minimum Supply Voltage: .97 V;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8Q1A by NXP Semiconductors

LS1026ASE8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASE8T1A by NXP Semiconductors

LS1026ASE8T1A

NXP Semiconductors

LS1026ASE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility in a compact grid array package style.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8MQA by NXP Semiconductors

LS1026ASN8MQA

NXP Semiconductors

LS1026ASN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and CMOS technology.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8Q1A by NXP Semiconductors

LS1026ASN8Q1A

NXP Semiconductors

LS1026ASN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 780 terminals. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026ASN8T1A by NXP Semiconductors

LS1026ASN8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 14;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8MQA by NXP Semiconductors

LS1026AXE8MQA

NXP Semiconductors

LS1026AXE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width and 14-bit address bus width. It features a grid array, fine pitch package style and is compatible with I2C, PCI, SPI, UART, and USB buses. This component is suitable for applications requiring high-speed data processing in compact electronic devices.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8P1A by NXP Semiconductors

LS1026AXE8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8Q1A by NXP Semiconductors

LS1026AXE8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Seated Height: 2.61 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXE8T1A by NXP Semiconductors

LS1026AXE8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B780;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8MQA by NXP Semiconductors

LS1026AXN8MQA

NXP Semiconductors

LS1026AXN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is ideal for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8P1A by NXP Semiconductors

LS1026AXN8P1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8Q1A by NXP Semiconductors

LS1026AXN8Q1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1026AXN8T1A by NXP Semiconductors

LS1026AXN8T1A

NXP Semiconductors

LS1026AXN8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, USB buses and has a max supply voltage of 1.03V. Ideal for applications requiring high-speed data processing and connectivity.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8MQA by NXP Semiconductors

LS1046ASE8MQA

NXP Semiconductors

LS1046ASE8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility. The package style is grid array with fine pitch terminals and CMOS technology.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8P1A by NXP Semiconductors

LS1046ASE8P1A

NXP Semiconductors

LS1046ASE8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a square package shape, and CMOS technology. It is suitable for applications requiring I2C, PCI, SPI, UART, or USB bus compatibility.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASE8T1A by NXP Semiconductors

LS1046ASE8T1A

NXP Semiconductors

LS1046ASE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, USB buses and has a CMOS technology with 14-bit address bus width. Ideal for high-performance computing applications.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASN8MQA by NXP Semiconductors

LS1046ASN8MQA

NXP Semiconductors

LS1046ASN8MQA by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with fine pitch terminals in a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASN8Q1A by NXP Semiconductors

LS1046ASN8Q1A

NXP Semiconductors

LS1046ASN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width and 14-bit address bus width. It features a grid array, fine pitch package style and is compatible with I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring high-speed data processing in compact electronic devices.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046ASN8T1A by NXP Semiconductors

LS1046ASN8T1A

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 14;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXE8P1A by NXP Semiconductors

LS1046AXE8P1A

NXP Semiconductors

LS1046AXE8P1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, and USB buses and is ideal for applications requiring high-speed data processing and connectivity.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXE8T1A by NXP Semiconductors

LS1046AXE8T1A

NXP Semiconductors

LS1046AXE8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals, and 14-bit address bus width. It is ideal for applications requiring I2C, PCI, SPI, UART, and USB bus compatibility in a compact square package with bottom terminal position.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXN8MQA by NXP Semiconductors

LS1046AXN8MQA

NXP Semiconductors

Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Width: 23 mm;

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXN8Q1A by NXP Semiconductors

LS1046AXN8Q1A

NXP Semiconductors

LS1046AXN8Q1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 14-bit address bus width, and 76 I/O lines. It is suitable for applications requiring I2C, PCI, SPI, UART, and USB bus compatibility. The package style is grid array with fine pitch terminals in a square shape measuring 23mm x 23mm.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

e1

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

LS1046AXN8T1A by NXP Semiconductors

LS1046AXN8T1A

NXP Semiconductors

LS1046AXN8T1A by NXP Semiconductors is a multi-functional peripheral with 64-bit external data bus width, 780 terminals in a grid array package style. It supports I2C, PCI, SPI, UART, and USB buses. Ideal for applications requiring high-speed data processing and connectivity in compact designs.

14

YES

I2C, PCI, SPI, UART, USB

64

S-PBGA-B780

23 mm

3

76

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

M86261G12 by NXP Semiconductors

M86261G12

NXP Semiconductors

Multifunction Peripherals; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

I2C, PCI, SPI, UART, USB

650 MHz

32

S-PBGA-B625

21 mm

3

64

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

32768

2.67 mm

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MIMX8QM5AVUFFAB by NXP Semiconductors

MIMX8QM5AVUFFAB

NXP Semiconductors

The NXP Semiconductors MIMX8QM5AVUFFAB is a multi-functional peripheral IC with 524288 RAM words, 24 MHz clock frequency, and 5000 mA supply current. It is designed for automotive applications, featuring CAN, Ethernet, I2C, I2S, IRDA, PCI, RS-232, RS-485, SPI, UART & USB bus compatibility at an operating temperature range of -40 to 125 °C.

lsio contains 8 GPIO lines

0

YES

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

24 MHz

0

S-PBGA-B1313

29 mm

3

1

1313

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

524288

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.75 mm

BOTTOM

40

29 mm

MULTIFUNCTION PERIPHERAL

MIMX8QM6AVUFFAB by NXP Semiconductors

MIMX8QM6AVUFFAB

NXP Semiconductors

The NXP Semiconductors MIMX8QM6AVUFFAB is a multi-functional peripheral IC with 524288 RAM words, operating at up to 24 MHz. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, I2C, and USB. With a temperature range of -40 to 125 °C, this CMOS technology chip has a max supply current of 5000 mA.

lsio contains 8 GPIO lines

0

YES

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

24 MHz

0

S-PBGA-B1313

e3

29 mm

3

1

1313

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

524288

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN

BALL

.75 mm

BOTTOM

40

29 mm

MULTIFUNCTION PERIPHERAL