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FBGA Multi-functional Peripherals 94

Multi-functional Peripherals
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MIMX8QP5AVUFFAB by NXP Semiconductors

MIMX8QP5AVUFFAB

NXP Semiconductors

The NXP Semiconductors MIMX8QP5AVUFFAB is a multi-functional peripheral IC with 524288 RAM words, operating at up to 24 MHz. Ideal for automotive applications, it supports various bus compatibilities like CAN, Ethernet, and USB. With a package style of grid array and fine pitch, this CMOS technology chip has a max supply current of 5000 mA.

lsio contains 8 GPIO lines

0

YES

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

24 MHz

0

S-PBGA-B1313

29 mm

3

1

1313

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

524288

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.75 mm

BOTTOM

40

29 mm

MULTIFUNCTION PERIPHERAL

MIMX8QP6AVUFFAB by NXP Semiconductors

MIMX8QP6AVUFFAB

NXP Semiconductors

The NXP Semiconductors MIMX8QP6AVUFFAB is a multi-functional peripheral IC with 524288 RAM words, 24 MHz max clock frequency, and 5000 mA max supply current. Ideal for automotive applications, it supports CAN, Ethernet, I2C, I2S, IRDA, PCI, RS-232, RS-485, SPI, UART & USB bus compatibility.

lsio contains 8 GPIO lines

0

YES

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

24 MHz

0

S-PBGA-B1313

e6

29 mm

3

1

1313

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

524288

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER BISMUTH

BALL

.75 mm

BOTTOM

40

29 mm

MULTIFUNCTION PERIPHERAL

LS1024ASN7ELA by NXP Semiconductors

LS1024ASN7ELA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

650 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1200 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASE7MLA by NXP Semiconductors

LS1024ASE7MLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

1200 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1500 mA

1.164 V

1.096 V

1.13 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASE7ELA by NXP Semiconductors

LS1024ASE7ELA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

650 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1200 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASN7MLA by NXP Semiconductors

LS1024ASN7MLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

1200 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1500 mA

1.164 V

1.096 V

1.13 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASN7JLA by NXP Semiconductors

LS1024ASN7JLA

NXP Semiconductors

LS1024ASN7JLA by NXP Semiconductors is a multi-functional peripheral IC with 625 terminals, operating at up to 900 MHz clock frequency. It features a CMOS technology, 26-bit address bus width, and supports boundary scan. Ideal for commercial applications requiring high-speed data processing in compact electronic devices.

26

YES

900 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1400 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

LS1024ASE7JLA by NXP Semiconductors

LS1024ASE7JLA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

26

YES

900 MHz

0

S-PBGA-B625

21 mm

3

625

70 Cel

-10 Cel

PLASTIC/EPOXY

FBGA

BGA625,25X25,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.67 mm

1400 mA

1.155 V

1.045 V

1.1 V

YES

CMOS

COMMERCIAL

BALL

.8 mm

BOTTOM

30

21 mm

MULTIFUNCTION PERIPHERAL

MIMX8UX6AVOFZAC by NXP Semiconductors

MIMX8UX6AVOFZAC

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 417; Package Code: FBGA; Package Shape: SQUARE;

YES

CAN(3), SAI(4), SPI(4), UART(6)

24 MHz

S-PBGA-B417

17 mm

3

75

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

512K

2.73 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8UX6AVLFZAC by NXP Semiconductors

MIMX8UX6AVLFZAC

NXP Semiconductors

NXP Semiconductors' MIMX8UX6AVLFZAC is a multi-functional peripheral IC with 512K RAM, 24 MHz clock frequency, and CAN/SPI/UART compatibility. Ideal for automotive applications due to its CMOS technology, -40 to 125 °C operating temperature range, and 609 terminals in a grid array package.

YES

CAN(3), SAI(4), SPI(4), UART(6)

24 MHz

S-PBGA-B609

e2

21 mm

3

99

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

512K

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

MULTIFUNCTION PERIPHERAL

MIMX8UX5AVOFZAC by NXP Semiconductors

MIMX8UX5AVOFZAC

NXP Semiconductors

The NXP Semiconductors MIMX8UX5AVOFZAC is a CMOS technology IC with 512K RAM, operating at up to 24 MHz clock frequency. It is designed for automotive applications, supporting CAN(3), SAI(4), SPI(4), and UART(6) bus compatibility. With a package style of GRID ARRAY, FINE PITCH and 417 terminals, it offers multifunctional peripherals in a compact form factor.

YES

CAN(3), SAI(4), SPI(4), UART(6)

24 MHz

S-PBGA-B417

17 mm

3

75

417

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA417,29X29,32

SQUARE

GRID ARRAY, FINE PITCH

260

512K

2.73 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

MIMX8UX5AVLFZAC by NXP Semiconductors

MIMX8UX5AVLFZAC

NXP Semiconductors

NXP Semiconductors' MIMX8UX5AVLFZAC is a CMOS technology-based IC with 512K RAM, 24 MHz clock frequency, and CAN(3), SAI(4), SPI(4), UART(6) bus compatibility. Ideal for automotive applications due to its high operating temperature range of -40 to 125 °C and moisture sensitivity level of 3.

YES

CAN(3), SAI(4), SPI(4), UART(6)

24 MHz

S-PBGA-B609

e2

21 mm

3

99

609

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA609,35X35,32

SQUARE

GRID ARRAY, FINE PITCH

260

512K

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

40

21 mm

MULTIFUNCTION PERIPHERAL

MIMX8QM5CVUFFAB by NXP Semiconductors

MIMX8QM5CVUFFAB

NXP Semiconductors

The NXP Semiconductors MIMX8QM5CVUFFAB is a multi-functional peripheral IC with 1313 terminals, 524288 RAM words, and a max clock frequency of 24 MHz. It is designed for automotive applications, featuring bus compatibility with CAN, Ethernet, I2C, I2S, IRDA, PCI, RS-232, RS-485, SPI, UART, and USB interfaces. Operating temperature ranges from -40 to 105°C.

0

YES

CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; RS-485; SPI; UART; USB

24 MHz

0

S-PBGA-B1313

e6

29 mm

3

1

1313

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

524288

2.52 mm

5000 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

TIN SILVER BISMUTH

BALL

.75 mm

BOTTOM

40

29 mm

MULTIFUNCTION PERIPHERAL

TDA3MVRBFABFRQ1 by Texas Instruments

TDA3MVRBFABFRQ1

Texas Instruments

TDA3MVRBFABFRQ1 by Texas Instruments is a CMOS peripheral IC with 32-bit external data bus, 524288 RAM words, and 38.4 MHz clock frequency. Ideal for automotive applications, it supports CAN(2), I2C(2), QSPI, SPI(4), UART(3) interfaces with AEC-Q100 screening level.

16

YES

CAN(2), I2C(2), QSPI, SPI(4), UART(3)

38.4 MHz

32

S-PBGA-B367

e1

15 mm

3

126

13

367

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA367,22X22,25

SQUARE

GRID ARRAY, FINE PITCH

250

524288

AEC-Q100

2.82 mm

1.11 V

1.02 V

1.06 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

15 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7HNA by NXP Semiconductors

LS1027ASE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXE7KQA by NXP Semiconductors

LS1027AXE7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXN7NQA by NXP Semiconductors

LS1027AXN7NQA

NXP Semiconductors

LS1027AXN7NQA by NXP Semiconductors is a multi-functional peripheral IC with 32-bit external data bus width, 262144 RAM words, and 448 terminals in a grid array package. It operates b/w -40 to 105°C and supports I2C, SAI, SPI, UART bus compatibility for industrial applications requiring high-performance peripherals.

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXN7PQA by NXP Semiconductors

LS1027AXN7PQA

NXP Semiconductors

LS1027AXN7PQA by NXP Semiconductors is a multi-functional peripheral IC with 32-bit external data bus width, 262144 RAM words, and 448 terminals. It operates in industrial temperature grade range from -40 to 105 °C and supports I2C, SAI, SPI, UART bus compatibility. Ideal for applications requiring high-performance peripherals in compact designs.

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7HNA by NXP Semiconductors

LS1017ASE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7NQA by NXP Semiconductors

LS1017ASN7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7PQA by NXP Semiconductors

LS1017ASN7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXE7PQA by NXP Semiconductors

LS1017AXE7PQA

NXP Semiconductors

LS1017AXE7PQA by NXP Semiconductors is a Multi-functional Peripheral IC with 32-bit External Data Bus, 262144 RAM Words, and 448 Terminals. It operates in Industrial Temperature Grade range (-40 to 105 °C) and supports I2C, SAI, SPI, UART bus compatibility. Ideal for applications requiring high-performance peripherals in compact form factors.

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXN7HNA by NXP Semiconductors

LS1017AXN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXN7PQA by NXP Semiconductors

LS1017AXN7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7KQA by NXP Semiconductors

LS1017ASE7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7NQA by NXP Semiconductors

LS1017ASE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXE7KQA by NXP Semiconductors

LS1017AXE7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXE7NQA by NXP Semiconductors

LS1017AXE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXN7NQA by NXP Semiconductors

LS1017AXN7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7KQA by NXP Semiconductors

LS1027ASE7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7PQA by NXP Semiconductors

LS1027ASN7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXE7PQA by NXP Semiconductors

LS1027AXE7PQA

NXP Semiconductors

LS1027AXE7PQA by NXP Semiconductors is a Multi-functional Peripheral IC with 32-bit External Data Bus, 262144 RAM Words, and 448 Terminals. It operates in Industrial Temperature Grade range (-40 to 105 °C) and supports I2C, SAI, SPI, UART bus compatibility. Ideal for applications requiring high-performance peripherals in compact designs.

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXN7HNA by NXP Semiconductors

LS1027AXN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXN7KQA by NXP Semiconductors

LS1027AXN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7NQA by NXP Semiconductors

LS1027ASE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASE7PQA by NXP Semiconductors

LS1027ASE7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7NQA by NXP Semiconductors

LS1027ASN7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXE7HNA by NXP Semiconductors

LS1027AXE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASE7PQA by NXP Semiconductors

LS1017ASE7PQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXE7HNA by NXP Semiconductors

LS1017AXE7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017AXN7KQA by NXP Semiconductors

LS1017AXN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7HNA by NXP Semiconductors

LS1027ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027ASN7KQA by NXP Semiconductors

LS1027ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1027AXE7NQA by NXP Semiconductors

LS1027AXE7NQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7HNA by NXP Semiconductors

LS1017ASN7HNA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL

LS1017ASN7KQA by NXP Semiconductors

LS1017ASN7KQA

NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

YES

I2C, SAI, SPI, UART

32

S-PBGA-B448

17 mm

3

68

8

448

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA448,30X30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

17 mm

MULTIFUNCTION PERIPHERAL