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LS1024ASE7MLA

NXP Semiconductors

LS1024ASE7MLA by NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$68.305

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3 parts In-Stock

1+ parts

$83.710

100+ parts

-

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3

$83.710

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Rochester

USA . 82,196 parts In-Stock

1+ parts

-

100+ parts

$52.900

1k+ parts

$47.330

10k+ parts

$44.540

82,196

-

$52.900

$47.330

$44.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 706 parts In-Stock

1+ parts

$38.741

100+ parts

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706

$38.741

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Flip Electronics

USA . 28,588 parts In-Stock

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28,588

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Vyrian

USA . 2,776 parts In-Stock

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2,776

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Anansix

USA . 1,574 parts In-Stock

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1,574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,246 parts In-Stock

1+ parts

$36.702

100+ parts

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1,246

$36.702

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Corohmni

South Africa . 3,097 parts In-Stock

1+ parts

$75.720

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3,097

$75.720

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

$84.320

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2,000

$84.320

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Microchip USA

USA . 1,288 parts In-Stock

1+ parts

$179.055

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1,288

$179.055

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UNI Independent Distributors

Spain . 6,441 parts In-Stock

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6,441

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Alle Elektronik GmbH

Germany . 4,468 parts In-Stock

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4,468

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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A-Z Elektronik GmbH

Germany . 10 parts In-Stock

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10

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Technical Specifications

Multi-functional Peripherals LS1024ASE7MLA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

26

Boundary Scan:

YES

Maximum Clock Frequency:

1200 MHz

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B625

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA625,25X25,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.67 mm

Maximum Supply Current:

1500 mA

Maximum Supply Voltage:

1.164 V

Minimum Supply Voltage:

1.096 V

Nominal Supply Voltage:

1.13 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Peripheral IC Type:

Trade Compliance

LS1024ASE7MLA Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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