Loading...

LS1017AXN7PQA

NXP Semiconductors

LS1017AXN7PQA by NXP Semiconductors

MULTIFUNCTION PERIPHERAL; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$74.326

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

DigiKey

USA . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107

-

-

-

-

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$74.326

1k+ parts

-

10k+ parts

-

60

-

$74.326

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,279

-

-

-

-

Anansix

USA . 2,154 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,154

-

-

-

-

Digiode

USA . 334 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

334

-

-

-

-

Flip Electronics

USA . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

107

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 867 parts In-Stock

1+ parts

$29.632

100+ parts

-

1k+ parts

-

10k+ parts

-

867

$29.632

-

-

-

Microchip USA

USA . 9,805 parts In-Stock

1+ parts

$148.741

100+ parts

-

1k+ parts

-

10k+ parts

-

9,805

$148.741

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Corphita

USA . 3,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,689

-

-

-

-

UNI Independent Distributors

Spain . 2,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,575

-

-

-

-

Technical Specifications

Multi-functional Peripherals LS1017AXN7PQA attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

14

Boundary Scan:

YES

Bus Compatibility:

I2C, SAI, SPI, UART

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B448

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

68

No. of Serial I/Os:

8

No. of Terminals:

448

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA448,30X30,30

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

262144

Maximum Seated Height:

2.61 mm

Maximum Supply Voltage:

1.03 V

Minimum Supply Voltage:

.97 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.75 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LS1017AXN7PQA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20