Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MVF50NN152CMK50
NXP Semiconductors
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Maximum Clock Frequency: 24 MHz;
0
32
YES
24 MHz
FLOATING POINT
S-PBGA-B364
e1
17 mm
3
7
364
8
85 Cel
-40 Cel
PLASTIC/EPOXY
LFBGA
BGA364,20X20,32
SQUARE
GRID ARRAY, LOW PROFILE, FINE PITCH
260
1572864
1.5 mm
500 rpm
850 mA
1.1 V
.9 V
1 V
CMOS
TIN SILVER COPPER
BALL
.8 mm
BOTTOM
40
MICROPROCESSOR, RISC
MVF50NS152CMK50R
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Maximum Operating Temperature: 85 Cel;
MVF60NN152CMK40
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH;
400 rpm
MVF60NN152CMK50
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; No. of DMA Channels: 32;
MVF60NS152CMK40
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MVF60NS152CMK50
SVF312R3K2CKU2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HLFQFP; Package Shape: SQUARE;
S-PQFP-G176
e3
24 mm
176
HLFQFP
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
1.6 mm
266 rpm
1.26 V
1.16 V
1.23 V
INDUSTRIAL
TIN
GULL WING
.5 mm
QUAD
SVF322R3K2CKU2
MICROPROCESSOR, RISC; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
SVF331R3K2CKU2R
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;
SVF332R3K2CKU2R
MICROPROCESSOR, RISC; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN;
SVF511R3K2CMK4
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER;
SVF512R3K2CMK4
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SVF521R3K2CMK4
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
SVF522R2K2CMK4
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SVF522R3K2CMK4
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
SVF531R3K2CMK4
SVF532R2K2CMK4R
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260;
SVF532R3K2CMK4
MICROPROCESSOR, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40;
MIMXRT1051DVL6B
The NXP Semiconductors MIMXRT1051DVL6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power consumption and high-speed processing in a compact form factor. Suitable for use in IoT devices, wearables, and industrial automation systems.
FLOATING-POINT
S-PBGA-B196
10 mm
29
196
95 Cel
0 Cel
BGA196,14X14,25
524288
1.43 mm
600 rpm
105 mA
1.3 V
1.25 V
OTHER
.65 mm
MIMXRT1052DVL6A
The NXP Semiconductors MIMXRT1052DVL6A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for applications requiring low power consumption, such as IoT devices and embedded systems. With integrated cache and boundary scan capabilities, it offers efficient processing for various projects.
NOT SPECIFIED
MIMXRT1021DAG5A
NXP Semiconductors' MIMXRT1021DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and 24 MHz clock frequency. Ideal for applications requiring low power mode, it offers 96 I/O lines and integrated ADC and PWM channels for versatile usage in various embedded systems.
13
S-PQFP-G144
20 mm
96
14
144
LFQFP
QFP144,.87SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
262144
90 mA
MIMXRT1062DVJ6A
MICROCONTROLLER, RISC; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;
e2
TIN SILVER
MICROCONTROLLER, RISC
MIMXRT1062DVL6A
MICROCONTROLLER, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MIMXRT1061DVJ6A
NXP Semiconductors' MIMXRT1061DVJ6A microprocessor features integrated cache, 24 MHz clock frequency, and 32 DMA channels. Ideal for low power applications in IoT devices, wearables, and industrial automation systems.
12 mm
BGA196,14X14,32
1048576
1.52 mm
110 mA
MIMXRT1064DVJ6A
The NXP Semiconductors MIMXRT1064DVJ6A microprocessor features a 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for applications requiring low power consumption, it offers integrated cache memory and 32 DMA channels for efficient data processing in various electronic devices.
10
P1024NSN5DFB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER; Technology: CMOS; Peak Reflow Temperature (C): 260;
P1024NSE5DFB
MICROPROCESSOR, RISC; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; Technology: CMOS;
T4160NXE7PQB
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Technology: CMOS;
250
30
P1024NXE5BFB
MICROPROCESSOR, RISC; JESD-609 Code: e2; Terminal Finish: TIN SILVER; Moisture Sensitivity Level (MSL): 3; Technology: CMOS; Maximum Time At Peak Reflow Temperature (s): 40;
P1024NXE5DFB
MICROPROCESSOR, RISC; Technology: CMOS; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: TIN SILVER; Peak Reflow Temperature (C): 260; JESD-609 Code: e2;
T4080NSE7PQB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; JESD-609 Code: e1; Peak Reflow Temperature (C): 250;
T4080NXE7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1;
T4080NSN7PQB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250;
T4160NSN7PQB
MICROPROCESSOR, RISC; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; Technology: CMOS;
P1024NXN5DFB
The NXP Semiconductors P1024NXN5DFB is a RISC microprocessor with CMOS technology. It has a peak reflow temperature of 260°C and can withstand up to 40 seconds at this temperature. This high-performance chip is ideal for applications requiring advanced processing capabilities in various electronic devices.
T4160NSE7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Technology: CMOS; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER;
T4080NSE7QTB
The NXP Semiconductors T4080NSE7QTB is a MICROPROCESSOR with RISC technology, featuring Terminal Finish of TIN SILVER COPPER. It can withstand a Peak Reflow Temperature of 250°C for up to 30s. This high-performance chip is ideal for applications requiring advanced processing capabilities in various industries.
T4160NSE7QTB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
T4080NSN7QTB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e1;
T4160NXN7PQB
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 250; Technology: CMOS; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: TIN SILVER COPPER;
T4080NXN7PQB
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250; JESD-609 Code: e1; Technology: CMOS;
T4160NSN7QTB
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
MCIMX6D6AVT10ADR
MCIMX6D6AVT10ADR by NXP Semiconductors is a 32-bit microprocessor with integrated cache, suitable for automotive applications. It features a grid array package style with 624 terminals and operates b/w -40 to 125°C. The processor utilizes RISC technology, has a terminal pitch of 0.8mm, and supports boundary scan testing.
64-BIT BUS WIDTH AVAILABLE
FIXED POINT
S-PBGA-B624
21 mm
NO
624
125 Cel
FBGA
GRID ARRAY, FINE PITCH
2.16 mm
1000 rpm
AUTOMOTIVE
T2080NXE8TTB
The NXP Semiconductors T2080NXE8TTB microprocessor features a 64-bit architecture, integrated cache, and operates at speeds up to 1800 rpm. Ideal for industrial applications, this CMOS technology-based processor has a temperature range of -40 to 105°C and comes in a square package with 896 terminals for surface mount assembly.
64
S-PBGA-B896
25 mm
896
105 Cel
2.61 mm
1800 rpm
PCIMX6Q6AVT10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: HBGA; Package Shape: SQUARE; Length: 21 mm;
HBGA
GRID ARRAY, HEAT SINK/SLUG
MCIMX6DP4AVT1AA
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;
24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE
26
1.5 V
1.35 V
MCIMX6DP6AVT1AA
MCIMX6QP4AVT1AA
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