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SVF331R3K2CKU2R

NXP Semiconductors

SVF331R3K2CKU2R by NXP Semiconductors

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 6,280 parts In-Stock

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Distributors (In-Stock)

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Vyrian

USA . 7,721 parts In-Stock

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7,721

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Flip Electronics

USA . 6,280 parts In-Stock

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6,280

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Digiode

USA . 3,228 parts In-Stock

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Anansix

USA . 1,865 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 1,063 parts In-Stock

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$12.930

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1,063

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$60.433

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$54.994

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$49.555

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1,000

$60.433

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$49.555

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Component Stockers USA

USA . 402 parts In-Stock

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$351.750

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402

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UNI Independent Distributors

Spain . 4,506 parts In-Stock

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Corphita

USA . 3,138 parts In-Stock

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Microchip USA

USA . 2,560 parts In-Stock

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Technical Specifications

Microprocessors SVF331R3K2CKU2R attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SVF331R3K2CKU2R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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