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NXP Semiconductors Microprocessors 396

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
MCIMX6QP4AVT8AA by NXP Semiconductors

MCIMX6QP4AVT8AA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

852 rpm

1.5 V

1.225 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6QP6AVT1AA by NXP Semiconductors

MCIMX6QP6AVT1AA

NXP Semiconductors

MCIMX6QP6AVT1AA by NXP Semiconductors is a 32-bit microprocessor with integrated cache and a max supply voltage of 1.5V. It is commonly used in automotive applications due to its temperature grade, low power mode, and boundary scan capability.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

26

32

YES

64

FLOATING POINT

YES

S-PBGA-B624

e1

21 mm

YES

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

260

2.16 mm

1000 rpm

1.5 V

1.35 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX7D7DVK10SC by NXP Semiconductors

MCIMX7D7DVK10SC

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE; Bit Size: 32;

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1000 rpm

1.155 V

1.045 V

1.1 V

YES

CMOS

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3DVK08SC by NXP Semiconductors

MCIMX7S3DVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3EVK08SC by NXP Semiconductors

MCIMX7S3EVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S5EVM08SC by NXP Semiconductors

MCIMX7S5EVM08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B541

19 mm

YES

3

541

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MPC8535AVJANGA by NXP Semiconductors

MPC8535AVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

90 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8535BVJANGA by NXP Semiconductors

MPC8535BVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

T4081NSE7PQB by NXP Semiconductors

T4081NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSE7QTB by NXP Semiconductors

T4081NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSE7TTB by NXP Semiconductors

T4081NSE7TTB

NXP Semiconductors

The NXP Semiconductors T4081NSE7TTB microprocessor features a 64-bit external data bus width, 16-bit address bus width, and a max clock frequency of 133.3 MHz. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSN7PQB by NXP Semiconductors

T4081NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Length: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSN7QTB by NXP Semiconductors

T4081NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NSN7TTB by NXP Semiconductors

T4081NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Speed: 1800 rpm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXE7PQB by NXP Semiconductors

T4081NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXE7QTB by NXP Semiconductors

T4081NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; External Data Bus Width: 64;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXE7TTB by NXP Semiconductors

T4081NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXN7PQB by NXP Semiconductors

T4081NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Integrated Cache: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXN7QTB by NXP Semiconductors

T4081NXN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B1932;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4081NXN7TTB by NXP Semiconductors

T4081NXN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4160NSE7TTB by NXP Semiconductors

T4160NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4160NSN7TTB by NXP Semiconductors

T4160NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7PQB by NXP Semiconductors

T4161NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7QTB by NXP Semiconductors

T4161NSE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSE7TTB by NXP Semiconductors

T4161NSE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7PQB by NXP Semiconductors

T4161NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7QTB by NXP Semiconductors

T4161NSN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NSN7TTB by NXP Semiconductors

T4161NSN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 250;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7PQB by NXP Semiconductors

T4161NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Format: FIXED POINT;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7QTB by NXP Semiconductors

T4161NXE7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXE7TTB by NXP Semiconductors

T4161NXE7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Width: 45 mm;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXN7PQB by NXP Semiconductors

T4161NXN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Boundary Scan: YES;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1500 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXN7QTB by NXP Semiconductors

T4161NXN7QTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Technology: CMOS;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1667 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

T4161NXN7TTB by NXP Semiconductors

T4161NXN7TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1932; Package Code: HBGA; Package Shape: SQUARE; Address Bus Width: 16;

16

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B1932

e1

45 mm

YES

3

1932

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

3.33 mm

1800 rpm

YES

CMOS

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

45 mm

MICROPROCESSOR, RISC

LS1046ASE8Q1A by NXP Semiconductors

LS1046ASE8Q1A

NXP Semiconductors

LS1046ASE8Q1A by NXP Semiconductors is a microprocessor with a package shape of square and 780 terminals. It has a max seated height of 2.07 mm and operates at a speed of 64 rpm. This processor is commonly used in various applications requiring high-performance computing.

S-PBGA-B780

e1

23 mm

3

780

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

250

2.07 mm

64 rpm

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

MCIMX6S1AVM10AC by NXP Semiconductors

MCIMX6S1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S4AVM10AC by NXP Semiconductors

MCIMX6S4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6S6AVM10AC by NXP Semiconductors

MCIMX6S6AVM10AC

NXP Semiconductors

MCIMX6S6AVM10AC by NXP Semiconductors is a MICROPROCESSOR with CMOS technology, operating at -40 to 125 °C. It has 624 terminals in a GRID ARRAY package style, suitable for automotive applications due to its low profile design and tin silver copper terminal finish.

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U1AVM10AC by NXP Semiconductors

MCIMX6U1AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U4AVM10AC by NXP Semiconductors

MCIMX6U4AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

MCIMX6U6AVM10AC by NXP Semiconductors

MCIMX6U6AVM10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

S-PBGA-B624

e1

21 mm

3

624

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.6 mm

1.5 V

1.4 V

YES

CMOS

AUTOMOTIVE

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

21 mm

MICROPROCESSOR, RISC

T1042NXE7PQB by NXP Semiconductors

T1042NXE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Bit Size: 32;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7MQB by NXP Semiconductors

T1022NSE7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7PQB by NXP Semiconductors

T1022NSE7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSE7WQB by NXP Semiconductors

T1022NSE7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Speed: 1500 rpm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7MQB by NXP Semiconductors

T1022NSN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7PQB by NXP Semiconductors

T1022NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Length: 23 mm;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1022NSN7WQB by NXP Semiconductors

T1022NSN7WQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE; Address Bus Width: 16;

16

32

YES

133.3 MHz

64

FIXED POINT

YES

S-PBGA-B780

23 mm

YES

3

780

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.07 mm

1500 rpm

1.03 V

.97 V

1 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC