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NXP Semiconductors Microprocessors 396

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
T1013NSE7PQA by NXP Semiconductors

T1013NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1013NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. It is designed for applications requiring high-speed processing and low power consumption, with integrated cache memory and support for boundary scan testing.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7MQA by NXP Semiconductors

T1023NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

LS1028AXE7KQA by NXP Semiconductors

LS1028AXE7KQA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 448; Package Code: FBGA; Package Shape: SQUARE;

14

64

YES

32

FIXED-POINT

YES

S-PBGA-B448

17 mm

YES

3

1

33

448

8

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA448,30x30,30

SQUARE

GRID ARRAY, FINE PITCH

260

262144

2.61 mm

1000 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

BALL

.75 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MIMXRT1021DAG5B by NXP Semiconductors

MIMXRT1021DAG5B

NXP Semiconductors

NXP Semiconductors' MIMXRT1021DAG5B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 262144 RAM words. Ideal for low power applications with a max supply voltage of 1.3V, it offers integrated cache and 32 DMA channels for efficient data processing.

13

32

YES

24 MHz

32

FLOATING POINT

YES

S-PQFP-G144

20 mm

YES

3

32

14

144

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

500 rpm

90 mA

1.3 V

1.25 V

YES

CMOS

OTHER

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

MIMXRT1015CAF4B by NXP Semiconductors

MIMXRT1015CAF4B

NXP Semiconductors

The NXP Semiconductors MIMXRT1015CAF4B microprocessor features a 32-bit architecture with integrated cache and 131072 RAM words. It operates at speeds up to 24 MHz, suitable for industrial applications requiring low power consumption. With 32 DMA channels and 6 serial I/Os, it offers versatile connectivity options in a compact square package.

0

32

YES

24 MHz

0

FLOATING POINT

YES

S-PQFP-G100

14 mm

YES

3

32

0

6

100

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

131072

1.7 mm

396 rpm

90 mA

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

40

14 mm

MICROPROCESSOR, RISC

T2080NXN8MQB by NXP Semiconductors

T2080NXN8MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

T2080NXE8P1B by NXP Semiconductors

T2080NXE8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

T2080NXE8MQB by NXP Semiconductors

T2080NXE8MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 896; Package Code: FBGA; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B896

25 mm

NO

3

12

8

896

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA896,30X30,32

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

BALL

.8 mm

BOTTOM

30

25 mm

MICROPROCESSOR, RISC

P2020PSE2MZB by NXP Semiconductors

P2020PSE2MZB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Speed: 1200 rpm;

16

YES

64

FIXED POINT

YES

S-PBGA-B689

31 mm

YES

4

7

689

125 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA689,29X29,40

SQUARE

GRID ARRAY

2.46 mm

1200 rpm

1.1 V

1 V

1.05 V

YES

CMOS

BALL

1 mm

BOTTOM

31 mm

MICROPROCESSOR, RISC

FS32V234CTN1VUB by NXP Semiconductors

FS32V234CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Integrated Cache: YES;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

FS32V232CTN1VUB by NXP Semiconductors

FS32V232CTN1VUB

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 621; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;

0

64

YES

40 MHz

0

FLOATING POINT

YES

S-PBGA-B621

17 mm

YES

3

32

1

0

621

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA621,25X25,25

SQUARE

GRID ARRAY, FINE PITCH

260

4194304

AEC-Q100

2.44 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

BALL

.65 mm

BOTTOM

40

17 mm

MICROPROCESSOR, RISC

MMC2001HCAB33B by NXP Semiconductors

MMC2001HCAB33B

NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE; On Chip Data RAM Width: 8;

22

32

YES

16.38 MHz

16

FIXED POINT

NO

S-PQFP-G144

20 mm

YES

3

8

2

144

8

85 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

32768

1.6 mm

34 rpm

40 mA

3.6 V

1.8 V

YES

CMOS

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC