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NXP Semiconductors Microprocessors 396

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan Bus Compatibility CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors
T1040NXN7MQB by NXP Semiconductors

T1040NXN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

-40 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NSN7PQB by NXP Semiconductors

T1040NSN7PQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1400 rpm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T1040NSN7MQB by NXP Semiconductors

T1040NSN7MQB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: HFBGA; Package Shape: SQUARE;

16

64

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

8

12

780

105 Cel

0 Cel

PLASTIC/EPOXY

HFBGA

BGA780,28X28,32

SQUARE

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

250

2.07 mm

1200 rpm

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

P1010NSN5HFB by NXP Semiconductors

P1010NSN5HFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5FFB by NXP Semiconductors

P1010NXE5FFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5FFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at speeds up to 667 rpm with a temperature range of -40 to 105°C.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5KHB by NXP Semiconductors

P1010NXN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5HFB by NXP Semiconductors

P1010NXE5HFB

NXP Semiconductors

The NXP Semiconductors P1010NXE5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. This CMOS technology-based processor is designed for high-speed performance in various embedded systems.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXE5KHB by NXP Semiconductors

P1010NXE5KHB

NXP Semiconductors

The NXP Semiconductors P1010NXE5KHB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V.

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5FFB by NXP Semiconductors

P1010NXN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSE5FFB by NXP Semiconductors

P1010NSE5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5DFB by NXP Semiconductors

P1010NSN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5FFB by NXP Semiconductors

P1010NSN5FFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

667 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NSN5KHB by NXP Semiconductors

P1010NSN5KHB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

1000 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

P1010NXN5DFB by NXP Semiconductors

P1010NXN5DFB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE;

16

YES

32

FIXED POINT

YES

S-PBGA-B425

e2

19 mm

NO

3

4

4

425

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA425,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.9 mm

533 rpm

1.05 V

.95 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MIMXRT1024DAG5A by NXP Semiconductors

MIMXRT1024DAG5A

NXP Semiconductors

NXP's MIMXRT1024DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for low power applications with its integrated cache, it offers 3.6V max supply voltage and operates b/w 0-95°C.

13

32

YES

24 MHz

16

FLOATING POINT

YES

S-PQFP-G144

20 mm

YES

3

32

8

144

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

500 rpm

90 mA

3.6 V

3 V

3.3 V

YES

CMOS

OTHER

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

MIMXRT1024CAG4A by NXP Semiconductors

MIMXRT1024CAG4A

NXP Semiconductors

The NXP Semiconductors MIMXRT1024CAG4A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

0

32

YES

24 MHz

0

FLOATING-POINT

YES

S-PQFP-G144

20 mm

YES

3

32

0

20

144

8

105 Cel

-40 Cel

PLASTIC/EPOXY

LFQFP

QFP144,.87SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.6 mm

396 rpm

90 mA

1.26 V

1.15 V

YES

CMOS

INDUSTRIAL

GULL WING

.5 mm

QUAD

40

20 mm

MICROPROCESSOR, RISC

MIMXRT1171AVM8A by NXP Semiconductors

MIMXRT1171AVM8A

NXP Semiconductors

NXP's MIMXRT1171AVM8A microprocessor features integrated cache, 32 DMA channels, and 48 MHz clock frequency. Ideal for automotive applications due to its low power mode, CMOS technology, and wide temperature range (-40 to 125 °C).

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MIMXRT1172AVM8A by NXP Semiconductors

MIMXRT1172AVM8A

NXP Semiconductors

NXP Semiconductors' MIMXRT1172AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, this CMOS technology-based chip operates at temperatures ranging from -40 to 125 °C and supports low power mode.

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

MIMXRT1175AVM8A by NXP Semiconductors

MIMXRT1175AVM8A

NXP Semiconductors

The NXP MIMXRT1175AVM8A microprocessor features integrated cache, 32 DMA channels, and a max clock frequency of 48 MHz. Ideal for automotive applications, it operates in a temperature range from -40 to 125°C with low power mode support.

YES

48 MHz

FLOATING-POINT

YES

S-PBGA-B289

14 mm

YES

3

32

1

289

8

125 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA289,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

2097152

1.52 mm

800 rpm

850 mA

1.95 V

1.71 V

1.8 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

14 mm

MICROPROCESSOR, RISC

LS1012ASE7HKA by NXP Semiconductors

LS1012ASE7HKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASN7EKA by NXP Semiconductors

LS1012ASN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXE7HKA by NXP Semiconductors

LS1012AXE7HKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

800 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012AXN7EKA by NXP Semiconductors

LS1012AXN7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

-40 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

INDUSTRIAL

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

LS1012ASE7EKA by NXP Semiconductors

LS1012ASE7EKA

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 211; Package Code: VFLGA; Package Shape: SQUARE;

16

64

YES

25 MHz

16

FIXED POINT

YES

S-XBGA-N211

9.6 mm

YES

3

211

105 Cel

0 Cel

UNSPECIFIED

VFLGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.925 mm

600 rpm

.93 V

.87 V

.9 V

YES

CMOS

OTHER

NO LEAD

.5 mm

BOTTOM

40

9.6 mm

MICROPROCESSOR, RISC

MCIMX537CVP8C2 by NXP Semiconductors

MCIMX537CVP8C2

NXP Semiconductors

MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

32

52

529

8

125 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

800 rpm

800 mA

1.15 V

1.05 V

1.1 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX535DVP2C2 by NXP Semiconductors

MCIMX535DVP2C2

NXP Semiconductors

MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

5

529

8

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

1200 rpm

800 mA

1.4 V

1.3 V

1.35 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MCIMX535DVP1C2 by NXP Semiconductors

MCIMX535DVP1C2

NXP Semiconductors

MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.

26

32

YES

27 MHz

32

FLOATING POINT

YES

S-PBGA-B529

19 mm

YES

3

5

529

8

85 Cel

-20 Cel

PLASTIC/EPOXY

FBGA

BGA529,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

147456

1.85 mm

1000 rpm

800 mA

1.4 V

1.2 V

1.25 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

MIMXRT1021DAF5B by NXP Semiconductors

MIMXRT1021DAF5B

NXP Semiconductors

The NXP Semiconductors MIMXRT1021DAF5B is a 32-bit microprocessor with integrated cache and a max clock frequency of 24 MHz. It is commonly used in applications requiring low power mode, such as IoT devices and wearable technology.

13

32

YES

24 MHz

32

FLOATING POINT

YES

S-PQFP-G100

e3

14 mm

YES

3

32

14

100

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFQFP

QFP100,.63SQ,20

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

260

262144

1.7 mm

500 rpm

90 mA

1.3 V

1.25 V

YES

CMOS

OTHER

TIN

GULL WING

.5 mm

QUAD

40

14 mm

MICROPROCESSOR, RISC

T1023NSN7KQA by NXP Semiconductors

T1023NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7KQA by NXP Semiconductors

T1023NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7MQA by NXP Semiconductors

T1023NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7KQA by NXP Semiconductors

T1023NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXE7MQA by NXP Semiconductors

T1023NXE7MQA

NXP Semiconductors

The NXP Semiconductors T1023NXE7MQA microprocessor features a 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with low power mode support. With a package style of grid array and fine pitch, it offers 525 terminals for versatile connectivity.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7MQA by NXP Semiconductors

T1013NSE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7KQA by NXP Semiconductors

T1013NSN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7MQA by NXP Semiconductors

T1013NSN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NXN7PQA by NXP Semiconductors

T1023NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSE7KQA by NXP Semiconductors

T1013NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NSN7PQA by NXP Semiconductors

T1013NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7KQA by NXP Semiconductors

T1013NXE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7MQA by NXP Semiconductors

T1013NXE7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXE7PQA by NXP Semiconductors

T1013NXE7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSN7PQA by NXP Semiconductors

T1023NSN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7PQA by NXP Semiconductors

T1023NSE7PQA

NXP Semiconductors

The NXP Semiconductors T1023NSE7PQA microprocessor features a 64-bit architecture, 16-bit address bus width, and 32-bit external data bus width. Ideal for applications requiring high-speed processing, it operates b/w 0 to 105°C with low power mode support.

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1023NSE7KQA by NXP Semiconductors

T1023NSE7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7PQA by NXP Semiconductors

T1013NXN7PQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1400 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7MQA by NXP Semiconductors

T1013NXN7MQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1200 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR

T1013NXN7KQA by NXP Semiconductors

T1013NXN7KQA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 525; Package Code: FBGA; Package Shape: SQUARE;

16

64

YES

32

FIXED POINT

YES

S-PBGA-B525

e1

19 mm

YES

3

2

6

5

525

105 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA525,23X23,32

SQUARE

GRID ARRAY, FINE PITCH

260

2.07 mm

1000 rpm

5 mA

1.03 V

.97 V

1 V

YES

CMOS

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

19 mm

MICROPROCESSOR