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SVF512R3K2CMK4

NXP Semiconductors

SVF512R3K2CMK4 by NXP Semiconductors

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

Median Price

$34.263

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,900 parts In-Stock

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$34.263

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9,900

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$34.263

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,350 parts In-Stock

1+ parts

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8,350

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Digiode

USA . 1,166 parts In-Stock

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1,166

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Anansix

USA . 756 parts In-Stock

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756

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Distributors (Availability)

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AZTECH Wire

Italy . 1,137 parts In-Stock

1+ parts

$14.530

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1,137

$14.530

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One Stop Electronics

USA . 1,199 parts In-Stock

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$21.000

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1,199

$21.000

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Microchip USA

USA . 1,792 parts In-Stock

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$75.826

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1,792

$75.826

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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UNI Independent Distributors

Spain . 5,152 parts In-Stock

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Corphita

USA . 2,279 parts In-Stock

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2,279

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Technical Specifications

Microprocessors SVF512R3K2CMK4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

SVF512R3K2CMK4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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