Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SVF521R3K1CMK4 by NXP Semiconductors is a microprocessor with 16-bit address and data bus width, operating at 400 rpm. It features integrated cache, low power mode, and boundary scan for industrial applications. The package is a grid array with 364 terminals, suitable for surface mount assembly.
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This material offers excellent durability and protection for the microprocessor, ensuring a longer lifespan.
Having an integrated cache helps improve the speed and performance of the microprocessor by allowing for faster access to frequently used data.
The high maximum supply voltage allows for flexible power options and can support more demanding applications.
A wider address bus width allows for greater memory access and data processing capabilities.
The high maximum operating temperature ensures reliable performance even in challenging thermal conditions.
The nominal supply voltage provides stable and efficient power for the microprocessor.
CMOS technology offers low power consumption and high speed performance, making the microprocessor energy efficient.
Microprocessors SVF521R3K1CMK4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
SVF521R3K1CMK4 Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Weitron Technology
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
SBAV99LT1G
Onsemi
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT-7
Diodes Incorporated
1N4148WT-7 by Diodes Inc. is a fast recovery rectifier diode with a max reverse recovery time of 0.004 us and a max forward voltage of 1.25 V. It has a package style of small outline, making it suitable for surface mount applications where high-speed switching is required at temperatures ranging from -65 to 150 °C.
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
2N7002,215
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
E8WSDC12-32.768KTR
Abracon
Abracon's E8WSDC12-32.768KTR crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and communication systems.
ABS07-32.768KHZ-T
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
MPC8270VVQLDA
NXP Semiconductors' MPC8270VVQLDA microprocessor features 32-bit address and data bus width, with integrated cache and 64-bit external data bus. It operates at a max clock frequency of 83.33 MHz, suitable for commercial-grade applications requiring high-speed processing in a compact square package.
MCIMX6X1AVK08AB
Freescale Semiconductor
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Technology: CMOS; Terminal Finish: TIN SILVER COPPER;
AM3354BZCED60
Texas Instruments
AM3354BZCED60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 64 DMA channels. It operates at a max clock frequency of 26 MHz and is suitable for industrial applications requiring low power consumption and high-speed processing.
XAM6234ATCGGAALW
XAM6234ATCGGAALW by Texas Instruments is a 64-bit microprocessor with 8-bit on-chip data RAM and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications in various devices due to its CMOS technology and integrated cache feature. The package style is grid array with very thin profile, making it ideal for compact designs requiring high processing speeds.
MPC880ZP66
NXP Semiconductors' MPC880ZP66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for applications requiring a RISC-based microprocessor with a max supply voltage of 1.9V, such as embedded systems and industrial automation.
AM3505AZCNA
AM3505AZCNA by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and is suitable for industrial applications requiring low power mode and floating point format.
SPC5200CVR400B
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
AM1806BZCE4
AM1806BZCE4 by Texas Instruments is a 32-bit microprocessor with integrated cache and 16-bit external data bus. Operating at up to 30 MHz, it features low power mode and boundary scan for efficient performance. Ideal for applications requiring high-speed processing in compact devices.
ATSAMA5D27C-CU
ATSAMA5D27C-CU by Microchip Technology is a 32-bit microprocessor with integrated cache and 16-bit external data bus. It operates at a max clock frequency of 24 MHz, suitable for industrial applications requiring low power mode. The package style is grid array, low profile, fine pitch, making it ideal for compact designs.
MPC8308CVMAGDA
NXP Semiconductors' MPC8308CVMAGDA is a 32-bit microprocessor with integrated cache, operating at speeds up to 400 rpm. It features low power mode and boundary scan support, suitable for industrial applications. With a package style of grid array and fine pitch, it offers 473 terminals in a compact square shape.
MIMXRT1062XVN5B
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;
MCIMX6U5DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
AM3505AZER
AM3505AZER by Texas Instruments is a microprocessor with 16-bit address bus and 8-bit on-chip data RAM. It operates at a max clock frequency of 26 MHz, suitable for applications requiring low power mode and floating point format processing. With integrated cache and 32 DMA channels, it offers high performance in various embedded systems.
FS32V234CKN1VUBR
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER; JESD-609 Code: e2; Moisture Sensitivity Level (MSL): 3;
MPC8321EVRAFDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
STM32MP151DAD1
STMicroelectronics
STM32MP151DAD1 by STMicroelectronics is a 32-bit microprocessor with integrated cache, 48 MHz clock frequency, and 16-bit external data bus width. It is suitable for applications requiring low power mode, such as IoT devices and embedded systems. The processor features a CMOS technology, operates b/w -20 to 105 °C temperatures, and has 257 terminals in a grid array package style.
MPC5200VR400B
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;
IBM25PPC750FX-GB0133T
Ibm Microelectronics
IBM25PPC750FX-GB0133T by Ibm Microelectronics is a 32-bit RISC microprocessor with integrated cache and 64-bit external data bus. Operating at a max clock frequency of 200 MHz, it features low power mode and boundary scan for efficient performance in various applications requiring high-speed processing.
MIMXRT555SFFOCR
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
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SVF532R2K2CMK4
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
SVF511R3N2CMK4R
MICROPROCESSOR, RISC;
SVF522R2N2CMK4
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40;
SVF522R2K2CMK4
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SVF512R3N2CMK4
SVF522R2N2CMK4R
SVF511R3K2CMK4
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN SILVER COPPER;
SVF512R3K1CMK4
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 364; Package Code: LFBGA; Package Shape: SQUARE;
SVF521R3K2CMK4
MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 40;
SVF521R3K2CMK4R
SVF522R2K1CMK4
SVF512R3K2CMK4R
SVF522R2K2CMK4R
SVF511R3N2CMK4
SVF521R3N2CMK4
SVF512R3N2CMK4R
SVF511R3K1CMK4
SVF511R3K2CMK4R
SVF512R3K2CMK4
MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
SVF521R3K1CMK4
Supply Digital Components
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