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OTHER Microprocessors 260

Microprocessors
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals On Chip Data RAM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability Screening Level Maximum Seated Height Speed Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width Peripheral IC Type Data EEPROM Size Connectivity
MIMXRT1064DVJ6A by NXP Semiconductors

MIMXRT1064DVJ6A

NXP Semiconductors

The NXP Semiconductors MIMXRT1064DVJ6A microprocessor features a 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for applications requiring low power consumption, it offers integrated cache memory and 32 DMA channels for efficient data processing in various electronic devices.

0

32

YES

24 MHz

0

FLOATING-POINT

YES

S-PBGA-B196

e1

12 mm

YES

3

32

0

10

196

8

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1048576

1.52 mm

600 rpm

110 mA

1.3 V

1.25 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

66AK2H06BAAW24 by Texas Instruments

66AK2H06BAAW24

Texas Instruments

The Texas Instruments 66AK2H06BAAW24 microprocessor features a 64-bit external data bus width, integrated cache, and low power mode. Ideal for applications requiring high-speed processing and low power consumption in various industries such as telecommunications and automotive.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06BAAW2 by Texas Instruments

66AK2H06BAAW2

Texas Instruments

The Texas Instruments 66AK2H06BAAW2 microprocessor features a 64-bit external data bus width, integrated cache, and operates at a speed of 1200 rpm. It is commonly used in applications requiring high processing power and low power consumption, such as embedded systems and networking devices.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1200 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H06BXAAW2 by Texas Instruments

66AK2H06BXAAW2

Texas Instruments

The Texas Instruments 66AK2H06BXAAW2 microprocessor features a 64-bit external data bus width, integrated cache, and RISC technology. With a low power mode and boundary scan capability, it is ideal for high-performance computing applications requiring fast processing speeds and efficient power consumption.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1200 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12BAAW24 by Texas Instruments

66AK2H12BAAW24

Texas Instruments

The Texas Instruments 66AK2H12BAAW24 microprocessor features a 64-bit external data bus width, integrated cache, and operates at speeds up to 1400 rpm. Ideal for applications requiring low power consumption, such as embedded systems and IoT devices.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12BAAW2 by Texas Instruments

66AK2H12BAAW2

Texas Instruments

The Texas Instruments 66AK2H12BAAW2 microprocessor features a 64-bit external data bus width, operates at speeds up to 1200 rpm, and has integrated cache memory. Ideal for applications requiring high processing power in a compact form factor with low power consumption.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1200 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H12BXAAW2 by Texas Instruments

66AK2H12BXAAW2

Texas Instruments

The Texas Instruments 66AK2H12BXAAW2 microprocessor features a 64-bit external data bus width, integrated cache, and operates at speeds up to 1200 rpm. Ideal for applications requiring low power consumption, this CMOS technology-based processor has a max supply voltage of 1.05 V and is designed for use in microprocessor-intensive tasks.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1200 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14BAAW24 by Texas Instruments

66AK2H14BAAW24

Texas Instruments

The Texas Instruments 66AK2H14BAAW24 microprocessor features a 64-bit external data bus width, integrated cache, and low power mode. Ideal for applications requiring high-speed processing in a compact form factor with a max operating temperature of 85°C.

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

66AK2H14BXAAW24 by Texas Instruments

66AK2H14BXAAW24

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: SQUARE;

16

YES

64

FLOATING POINT

YES

S-PBGA-B1517

e1

40 mm

YES

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

245

3.75 mm

1400 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

TMS320DM8127SCYE0 by Texas Instruments

TMS320DM8127SCYE0

Texas Instruments

TMS320DM8127SCYE0 by Texas Instruments is a 32-bit microprocessor with 8-word RAM, 16-bit external data bus, and 30 MHz clock frequency. It is used in applications requiring high-speed processing such as embedded systems and industrial automation due to its low power mode and integrated cache. The package style is grid array with fine pitch terminals for compact design.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

851968

3.06 mm

1000 rpm

1.16 V

1.05 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TMS320DM8127SCYE1 by Texas Instruments

TMS320DM8127SCYE1

Texas Instruments

TMS320DM8127SCYE1 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and max clock frequency of 30 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and telecommunications.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

851968

3.06 mm

1000 rpm

1.26 V

1.14 V

1.2 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TMS320DM8127SCYE2 by Texas Instruments

TMS320DM8127SCYE2

Texas Instruments

TMS320DM8127SCYE2 by Texas Instruments is a 32-bit microprocessor with 8-bit data RAM, 16-bit external data bus width, and max clock frequency of 30 MHz. It is used in applications requiring high-speed processing such as embedded systems, industrial automation, and telecommunications.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

851968

3.06 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

TMS320DM8127SCYE3 by Texas Instruments

TMS320DM8127SCYE3

Texas Instruments

TMS320DM8127SCYE3 by Texas Instruments is a 32-bit microprocessor with 8-bit data RAM width, 16-bit external data bus width, and max clock frequency of 30 MHz. It is used in applications requiring high-speed processing such as embedded systems, industrial automation, and digital signal processing.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

851968

3.06 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

XAM5728AABCXE by Texas Instruments

XAM5728AABCXE

Texas Instruments

XAM5728AABCXE by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 16-bit Address Bus, and 38.4 MHz Max Clock Frequency. Ideal for low power applications in consumer electronics, automotive systems, and industrial automation due to its CMOS technology and floating point format.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

XAM5718ABCXE by Texas Instruments

XAM5718ABCXE

Texas Instruments

XAM5718ABCXE by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.96 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM3351BZCE30 by Texas Instruments

AM3351BZCE30

Texas Instruments

AM3351BZCE30 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply current of 400 mA.

16

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

300 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

AM3351BZCE60 by Texas Instruments

AM3351BZCE60

Texas Instruments

AM3351BZCE60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications. With 64 DMA channels and boundary scan support, it is ideal for embedded systems requiring high-speed data processing.

16

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

600 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

XAM5728BABCXE by Texas Instruments

XAM5728BABCXE

Texas Instruments

XAM5728BABCXE by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

X66AK2G02ZBB60 by Texas Instruments

X66AK2G02ZBB60

Texas Instruments

X66AK2G02ZBB60 by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. It operates at a max clock frequency of 26 MHz and is suitable for low power mode applications in various industries.

16

YES

26 MHz

32

FLOATING POINT

YES

S-PBGA-B625

21 mm

YES

625

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1.7 mm

600 rpm

.95 V

.85 V

.9 V

YES

CMOS

OTHER

BALL

.8 mm

BOTTOM

21 mm

MICROPROCESSOR, RISC

MCIMX7S3DVK08SC by NXP Semiconductors

MCIMX7S3DVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S3EVK08SC by NXP Semiconductors

MCIMX7S3EVK08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 488; Package Code: TFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B488

12 mm

YES

3

488

105 Cel

-20 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.4 mm

BOTTOM

40

12 mm

MICROPROCESSOR, RISC

MCIMX7S5EVM08SC by NXP Semiconductors

MCIMX7S5EVM08SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;

SEATED-HGT CALCULATED

16

32

YES

32

FLOATING POINT

YES

S-PBGA-B541

19 mm

YES

3

541

105 Cel

-20 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

800 rpm

1.155 V

.95 V

1 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

AM5726BABCX by Texas Instruments

AM5726BABCX

Texas Instruments

AM5726BABCX by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 38.4 MHz. It is used in applications requiring low power mode and features a CMOS technology with RISC architecture for efficient processing.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

AM5728BABCX by Texas Instruments

AM5728BABCX

Texas Instruments

The Texas Instruments AM5728BABCX microprocessor features 32-bit external data bus width, 16-bit address bus width, and a max clock frequency of 38.4 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and automotive electronics.

16

YES

38.4 MHz

32

FLOATING POINT

NO

S-PBGA-B760

e1

23 mm

YES

3

760

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

BGA760,28X28,31

SQUARE

GRID ARRAY, FINE PITCH

250

2.55 mm

1500 rpm

1.2 V

1.11 V

1.15 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

MPC8535AVJANGA by NXP Semiconductors

MPC8535AVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

90 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MPC8535BVJANGA by NXP Semiconductors

MPC8535BVJANGA

NXP Semiconductors

MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 783; Package Code: BGA; Package Shape: SQUARE;

16

32

YES

64

FIXED POINT

YES

S-PBGA-B783

e2

29 mm

YES

3

783

105 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

2.76 mm

800 rpm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER

BALL

1 mm

BOTTOM

40

29 mm

MICROPROCESSOR

MCIMX7D2DVM12SC by NXP Semiconductors

MCIMX7D2DVM12SC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 541; Package Code: LFBGA; Package Shape: SQUARE;

26

32

YES

16

FLOATING POINT

YES

S-PBGA-B541

19 mm

YES

3

541

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.42 mm

1200 rpm

1.25 V

1.2 V

1.225 V

YES

CMOS

OTHER

BALL

.75 mm

BOTTOM

40

19 mm

MICROPROCESSOR, RISC

DM383AAAR21F by Texas Instruments

DM383AAAR21F

Texas Instruments

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 609; Package Code: LFBGA; Package Shape: SQUARE;

27

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B609

e1

16 mm

YES

3

609

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

16 mm

MICROPROCESSOR, RISC

DM383AAAR21 by Texas Instruments

DM383AAAR21

Texas Instruments

The Texas Instruments DM383AAAR21 microprocessor features a 32-bit architecture with 27-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 30 MHz, making it suitable for low-power applications requiring high-speed processing. With integrated cache memory and boundary scan capability, this processor is ideal for compact devices in industrial automation and IoT systems.

27

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B609

e1

16 mm

YES

3

609

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.32 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

16 mm

MICROPROCESSOR, RISC

AM3351BZCE30R by Texas Instruments

AM3351BZCE30R

Texas Instruments

AM3351BZCE30R by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 26 MHz. It is commonly used in applications requiring low power mode, such as embedded systems and IoT devices.

ALSO OPERATES AT MIN 0.912 V

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

300 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

AM3351BZCE60R by Texas Instruments

AM3351BZCE60R

Texas Instruments

AM3351BZCE60R by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for low power mode applications. With a package style of grid array and boundary scan support, it's ideal for embedded systems requiring high-speed processing in compact form factors.

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

64

298

8

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

131072

1.3 mm

600 rpm

400 mA

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

HPSDM8148CCYE2 by Texas Instruments

HPSDM8148CCYE2

Texas Instruments

The Texas Instruments HPSDM8148CCYE2 microprocessor features 32-bit architecture, 1.42V max supply voltage, and 30MHz clock frequency. Ideal for applications requiring high-speed processing in a compact form factor with integrated cache and low power mode support.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

1114112

3.06 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR, RISC

MTDM8148CCYE2 by Texas Instruments

MTDM8148CCYE2

Texas Instruments

The Texas Instruments MTDM8148CCYE2 microprocessor features 32-bit architecture, 1114112 RAM words, and a max clock frequency of 30 MHz. Ideal for applications requiring high-speed processing and low power consumption in industrial settings.

28

32

YES

30 MHz

16

FLOATING POINT

YES

S-PBGA-B684

e1

23 mm

YES

4

72

684

8

90 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

1114112

3.06 mm

1000 rpm

1.42 V

1.28 V

1.35 V

YES

CMOS

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.8 mm

BOTTOM

NOT SPECIFIED

23 mm

MICROPROCESSOR, RISC

MCIMX6L2DVN10AC by NXP Semiconductors

MCIMX6L2DVN10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Maximum Seated Height: 1.1 mm;

S-PBGA-B

e1

13 mm

3

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

MCIMX6L8DVN10AC by NXP Semiconductors

MCIMX6L8DVN10AC

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; Package Code: TFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

S-PBGA-B

e1

13 mm

3

95 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.1 mm

1.5 V

1.375 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

40

13 mm

MICROPROCESSOR, RISC

AM3358BZCE60 by Texas Instruments

AM3358BZCE60

Texas Instruments

AM3358BZCE60 by Texas Instruments is a 32-bit microprocessor with integrated cache, operating at max 26 MHz clock frequency. It features 16-bit external data bus width and low power mode, suitable for applications requiring high-speed processing in compact devices. Ideal for use in RISC-based systems with boundary scan capability.

ALSO HAVING MULTIPLEXED 16 BIT ADDRESS

28

32

YES

26 MHz

16

FIXED POINT

YES

S-PBGA-B298

e1

13 mm

YES

3

298

90 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.3 mm

600 rpm

1.144 V

1.056 V

1.1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

13 mm

MICROPROCESSOR, RISC

66AK2H05DAAW2 by Texas Instruments

66AK2H05DAAW2

Texas Instruments

The Texas Instruments 66AK2H05DAAW2 microprocessor features a max supply voltage of 1.05V, operating temperature range of 0-85°C, and terminal pitch of 1mm. Ideal for applications requiring high-performance computing in compact spaces with its rectangular package style and grid array shape.

R-PBGA-B1517

e1

40 mm

4

1517

85 Cel

0 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

245

3.62 mm

1.05 V

.95 V

1 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

40 mm

MICROPROCESSOR, RISC

T2081NSN8TTB by NXP Semiconductors

T2081NSN8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8MQLB by NXP Semiconductors

T2081NSE8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8P1B by NXP Semiconductors

T2081NSE8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8PTB by NXP Semiconductors

T2081NSE8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8T1B by NXP Semiconductors

T2081NSE8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSE8TTB by NXP Semiconductors

T2081NSE8TTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8MQLB by NXP Semiconductors

T2081NSN8MQLB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1200 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8P1B by NXP Semiconductors

T2081NSN8P1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8PTB by NXP Semiconductors

T2081NSN8PTB

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1533 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

T2081NSN8T1B by NXP Semiconductors

T2081NSN8T1B

NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 780; Package Code: FBGA; Package Shape: SQUARE;

16

YES

64

FIXED POINT

YES

S-PBGA-B780

e1

23 mm

YES

3

780

105 Cel

0 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

250

2.61 mm

1800 rpm

1.055 V

.995 V

1.025 V

YES

CMOS

OTHER

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

23 mm

MICROPROCESSOR, RISC

MIMXRT1051DVL6A by NXP Semiconductors

MIMXRT1051DVL6A

NXP Semiconductors

NXP Semiconductors' MIMXRT1051DVL6A microprocessor features 32-bit architecture, 24 MHz clock frequency, and 524288 RAM words. Ideal for low power applications, it offers integrated cache, 29 serial I/Os, and supports boundary scan technology.

0

32

YES

24 MHz

0

FLOATING-POINT

YES

S-PBGA-B196

10 mm

YES

32

0

29

196

8

95 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

BGA196,14X14,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

524288

1.43 mm

600 rpm

105 mA

1.3 V

1.25 V

YES

CMOS

OTHER

BALL

.65 mm

BOTTOM

10 mm

MICROPROCESSOR, RISC