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66AK2H06BXAAW2

Texas Instruments

66AK2H06BXAAW2 by Texas Instruments

The Texas Instruments 66AK2H06BXAAW2 microprocessor features a 64-bit external data bus width, integrated cache, and RISC technology. With a low power mode and boundary scan capability, it is ideal for high-performance computing applications requiring fast processing speeds and efficient power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,305 parts In-Stock

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Digiode

USA . 4,627 parts In-Stock

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4,627

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

1+ parts

$11.513

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320

$11.513

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One Stop Electronics

USA . 283 parts In-Stock

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$27.000

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$27.000

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Native Components

USA . 244 parts In-Stock

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$30.380

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$29.165

244

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$29.165

Northwest PG Solutions

USA . 1,757 parts In-Stock

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$33.418

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1,757

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Parana Technologies

USA . 234 parts In-Stock

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$35.358

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234

$35.358

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DigiPath Technology Company

USA . 2,255 parts In-Stock

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$38.933

100+ parts

$35.819

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2,255

$38.933

$35.819

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ChromeModa Solutions

Germany . 2,049 parts In-Stock

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$39.728

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$32.577

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$39.728

$32.577

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IDEA Electronic Components Group

UK . 1,522 parts In-Stock

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$39.728

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$37.742

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$35.755

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1,522

$39.728

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$35.755

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Corphita

USA . 4,118 parts In-Stock

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Microchip USA

USA . 1,927 parts In-Stock

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Overview

Unleash the power of innovation with the 66AK2H06BXAAW2 by Texas Instruments, a leading manufacturer in the field of microprocessors. This cutting-edge technology offers integrated cache and boundary scan capabilities, making it ideal for a wide range of applications. With its high performance and low power mode, this product delivers exceptional value and benefits to customers seeking top-notch quality and reliability. Elevate your projects to new heights with the 66AK2H06BXAAW2 and experience the advantages of superior technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring a longer lifespan for the product.

Integrated Cache: YES

Improves the performance of the microprocessor by reducing latency for frequently used data.

No. of Terminals: 1517

Allows for a wide range of connectivity options, making the microprocessor suitable for various applications.

Technology: CMOS

CMOS technology enables low power consumption and high speeds, making it an energy-efficient choice.

Width: 40 mm

Compact size enables easy integration into electronic devices with limited space available.

Technical Specifications

Microprocessors 66AK2H06BXAAW2 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

16

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.75 mm

Speed:

1200 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

66AK2H06BXAAW2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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