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516 Microcontrollers 32

Microcontrollers
Part# Info Specs
Part RoHS Manufacturer Description ADC Channels Maximum Access Time Additional Features Address Bus Width Bit Size Boundary Scan CPU Family Maximum Clock Frequency DAC Channels DMA Channels External Data Bus Width Format Integrated Cache JESD-30 Code JESD-609 Code Length Low Power Mode Moisture Sensitivity Level (MSL) No. of DMA Channels No. of External Interrupts No. of I/O Lines No. of Serial I/Os No. of Terminals No. of Timers On Chip Data RAM Width On Chip Program ROM Width Maximum Operating Temperature Minimum Operating Temperature PWM Channels Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification RAM Bytes RAM Words ROM Words ROM Programmability ROM Bits Size Screening Level Maximum Seated Height Speed Maximum Standby Current Sub-Category Maximum Supply Current Maximum Supply Voltage Minimum Supply Voltage Nominal Supply Voltage Surface Mount Technology Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Minimum Time Maximum Time At Peak Reflow Temperature (s) Total Dose (V) Ultraviolet Erasable Width Peripheral IC Type Data EEPROM Size Connectivity Peripherals Analog To Digital Convertors Digital To Analog Convertors
SPC5674FAMVY3R by NXP Semiconductors

SPC5674FAMVY3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;

YES

MS-034AAL-1

0

32

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

FLASH

2.55 mm

270 rpm

5.5 V

4.5 V

5 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CCK3MMO3R by NXP Semiconductors

SPC5777CCK3MMO3R

NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MMO3R is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications due to its temperature grade, it operates at a max clock frequency of 40 MHz.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CCK3MMO3 by NXP Semiconductors

SPC5777CCK3MMO3

NXP Semiconductors

NXP Semiconductors' SPC5777CCK3MMO3 microcontroller features a 32-bit CPU with E200Z7 family, 8KB cache, and 524KB RAM. Ideal for automotive applications, it offers CAN(4), SCI(5), SPI(5) connectivity and operates at up to 40MHz clock frequency. With low power mode and FLASH ROM programmability, this CMOS technology-based chip is suitable for various automotive control systems.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

0

32

YES

E200Z7

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

128

1

5

516

0

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1350 mA

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER

0

CAN(4), SCI(5), SPI(5)

POR

SPC5777CK3MMO3R by NXP Semiconductors

SPC5777CK3MMO3R

NXP Semiconductors

The NXP Semiconductors SPC5777CK3MMO3R microcontroller features a 32-bit architecture, with 8388608 ROM words and 524288 RAM bytes. It offers connectivity options like CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) and peripherals including DMA(128), PWM, and a temperature sensor. Ideal for automotive applications due to its temperature grade of AUTOMOTIVE and max operating temperature of 125°C.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CK3MMO3 by NXP Semiconductors

SPC5777CK3MMO3

NXP Semiconductors

NXP Semiconductors' SPC5777CK3MMO3 microcontroller features a 32-bit CPU with E200Z7 family, 8KB integrated cache, and 524KB RAM. Ideal for automotive applications, it offers connectivity via CAN(4), SCI(5), SPI(5) interfaces and operates at a max clock frequency of 40MHz.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SD ADC AVAILABLE.

0

32

YES

E200Z7

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

128

1

5

516

0

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1350 mA

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER

0

CAN(4), SCI(5), SPI(5)

POR

SPC5777CAK3MMO3R by NXP Semiconductors

SPC5777CAK3MMO3R

NXP Semiconductors

The NXP Semiconductors SPC5777CAK3MMO3R microcontroller features a 32-bit architecture, 22-bit address bus width, and 16-bit external data bus width. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, and multiple serial communication interfaces for connectivity. With a max clock frequency of 40 MHz and on-chip Flash ROM programmability, this microcontroller is suitable for high-performance automotive systems.

YES

ALSO OPERATES @ 1.2V TO 1.38V, 70-CH ADC INPUT LINES AVAILABLE

22

32

40 MHz

NO

YES

16

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

ISO 26262

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), ETHERNET, LFAST, PSI5(2), SCI(5), SENT(12), SIPI, SPI(5)

DMA(128), POR

4-Ch 16-Bit

SPC5777CAK3MMO3 by NXP Semiconductors

SPC5777CAK3MMO3

NXP Semiconductors

NXP Semiconductors' SPC5777CAK3MMO3 microcontroller features 32-bit architecture, 22-bit address bus width, and 16-bit external data bus. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, and SPI connectivity along with 4-Ch 16-Bit ADCs and PWM channels.

YES

ALSO OPERATES @ 1.2V TO 1.38V, 70-CH ADC INPUT LINES AVAILABLE

22

32

40 MHz

NO

YES

16

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

ISO 26262

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), ETHERNET, LFAST, PSI5(2), SCI(5), SENT(12), SIPI, SPI(5)

DMA(128), POR

4-Ch 16-Bit

TC299TX128F300SBBKXUMA1 by Infineon Technologies

TC299TX128F300SBBKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO AVAILABLE SINGLE SUPPLY VOLTAGE 5V, DELTA SIGMA ADC CONVERTER AVAILABLE WITH 10 CHANNELS

0

32

300 MHz

NO

YES

0

R-PBGA-B516

e2

25 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2842624

8388608

FLASH

ISO 26262

300 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

128K

ASCLIN, CAN(6), CIF, ETHERNET, HSCT, I2C, MSC, PSI5, PSI5S, SENT, SPI

DMA(128), RTC, TIMER, WDT

10-Ch 12-Bit

SPC5777CDK3MMO3R by NXP Semiconductors

SPC5777CDK3MMO3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MMO3R by NXP Semiconductors

SPC5777CLK3MMO3R

NXP Semiconductors

NXP SPC5777CLK3MMO3R is a 32-bit microcontroller with 516 terminals, operating at up to 40 MHz. It features ADC and DMA channels, along with peripherals like PWM and temperature sensor. Ideal for automotive applications due to its flash ROM programmability, CAN, DSPI, Ethernet connectivity, and wide temperature range from -40°C to 125°C.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CLK3MMO3 by NXP Semiconductors

SPC5777CLK3MMO3

NXP Semiconductors

NXP Semiconductors' SPC5777CLK3MMO3 is a 32-bit microcontroller with 8388608 ROM words and 524288 RAM bytes. It features CAN(6), DSPI(5), EBI, ETHERNET, SCI(5) connectivity and peripherals like DMA(128) and PWM. Ideal for automotive applications with an operating temperature range of -40 to 125 °C and a max clock frequency of 40 MHz.

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CRK3MMO3 by NXP Semiconductors

SPC5777CRK3MMO3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(4), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MMO3R by NXP Semiconductors

SPC5777CSK3MMO3R

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

27 mm

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

SPC5777CSK3MMO3 by NXP Semiconductors

SPC5777CSK3MMO3

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

ALSO OPERATES @ 1.2V TO 1.38V WHEN LVD/HVD DISABLED, 70-CH QADC AND 16-BIT SDADC AVAILABLE.

0

32

40 MHz

NO

YES

0

S-PBGA-B516

27 mm

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

524288

8388608

FLASH

2.02 mm

264 rpm

1.32 V

1.2 V

YES

CMOS

AUTOMOTIVE

BALL

1 mm

BOTTOM

27 mm

MICROCONTROLLER, RISC

0

CAN(6), DSPI(5), EBI, ETHERNET, SCI(5)

DMA(128), PWM, TEMPERATURE SENSOR

TC299TX128F300SBCKXUMA1 by Infineon Technologies

TC299TX128F300SBCKXUMA1

Infineon Technologies

Infineon's TC299TX128F300SBCKXUMA1 microcontroller features 32-bit architecture, 300 MHz clock speed, and 768K data EEPROM size. Ideal for automotive applications with ISO 26262 screening level, it offers CAN, Ethernet, I2C connectivity and 84-Ch 12-Bit ADC channels.

YES

ALSO AVAILABLE SINGLE SUPPLY VOLTAGE 5V, DELTA SIGMA ADC CONVERTER AVAILABLE WITH 10 CHANNELS

0

32

NO

TC29X

300 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

25 mm

NO

3

128

13

516

3

8

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

LFBGA

BGA516,30X30,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

2842624

8388608

FLASH

ISO 26262

1.7 mm

300 rpm

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

768K

CAN(6), ETHERNET, I2C, LIN, QSPI

DMA(128), RTC, TIMER(3), WDT

84-Ch 12-Bit

TC299TX128F300NBCKXUMA1 by Infineon Technologies

TC299TX128F300NBCKXUMA1

Infineon Technologies

Infineon's TC299TX128F300NBCKXUMA1 microcontroller features 32-bit address bus, 40 MHz clock frequency, and 84-Ch 12-Bit ADC channels. Ideal for automotive applications with connectivity options like CAN, ETHERNET, and QSPI.

YES

ALSO AVAILABLE SINGLE SUPPLY VOLTAGE 5V, DELTA SIGMA ADC CONVERTER AVAILABLE WITH 10 CHANNELS

32

32

40 MHz

NO

YES

32

S-PBGA-B516

e2

25 mm

3

516

8

125 Cel

-40 Cel

NO

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

8388608

FLASH

1.7 mm

300 rpm

1.43 V

1.17 V

1.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

768K

ASCLIN(4), CAN(6), ETHERNET, HSSL, I2C(2), MSC(3), PSI5(5), PSI5-S, QSPI(6), SENT(15)

DMA(128), TIMER(3), WDT

84-Ch 12-Bit

SAC57D53MCVMOR by NXP Semiconductors

SAC57D53MCVMOR

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Width: 27 mm;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

3145728

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SAC57D53MCVMO by NXP Semiconductors

SAC57D53MCVMO

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; ADC Channels: YES;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

3145728

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SAC57D54HCVMOR by NXP Semiconductors

SAC57D54HCVMOR

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; Maximum Operating Temperature: 105 Cel;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

4194304

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SAC57D54HCVMO by NXP Semiconductors

SAC57D54HCVMO

NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;

YES

0

32

YES

CORTEX-A5/M4/M0

40 MHz

NO

YES

0

FLOATING-POINT

YES

S-PBGA-B516

e2

27 mm

YES

3

32

1

0

516

7

8

8

105 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

BGA516,26X26,40

SQUARE

GRID ARRAY

260

2411724

4194304

FLASH

ISO 26262

2.02 mm

320 rpm

1.32 V

1.2 V

1.25 V

YES

CMOS

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

0

CAN(3), ETHERNET, I2C(2), SPI(5)

COMPARATOR(2), RTC, TIMER(48), WDT(3)

24-Ch 12-Bit

SPC5777CDK3MMO4R by NXP Semiconductors

SPC5777CDK3MMO4R

NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MMO4R is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, PWM support, and a RISC architecture. This square-shaped microcontroller with grid array packaging is suitable for applications requiring high-speed processing and precise control in automotive electronics.

YES

0

32

40 MHz

YES

0

e2

27 mm

3

516

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

SPC5777CDK3MMO4 by NXP Semiconductors

SPC5777CDK3MMO4

NXP Semiconductors

NXP Semiconductors' SPC5777CDK3MMO4 is a 32-bit microcontroller with 516 terminals, operating at a max clock frequency of 40 MHz. It features ADC and DMA channels, suitable for applications requiring high-speed processing and PWM control. Ideal for use in automotive electronics due to its robust design and advanced capabilities.

YES

0

32

40 MHz

YES

0

e2

27 mm

3

516

YES

BGA

SQUARE

GRID ARRAY

260

264 rpm

1.32 V

1.2 V

YES

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

TC389QP160F300SADKXUMA1 by Infineon Technologies

TC389QP160F300SADKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: LFBGA; Package Shape: SQUARE;

YES

IT ALSO OPERATES AT 5V NOM SUPPLY

0

32

YES

TC38X

40 MHz

NO

YES

0

FLOATING POINT

YES

S-PBGA-B516

25 mm

YES

3

128

41

516

2

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

BGA516,30X30,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

1605632

10485760

FLASH

AEC-Q100; ISO 26262

1.7 mm

300 rpm

380 mA

1.375 V

1.125 V

1.25 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

655360

CAN(12), ETHERNET, I2C(2), LIN(24), PSI5(4), PSI5S, SENT(25)

DMA(128), POR, TIMER(2)

TC389QP160F300SADLXUMA1 by Infineon Technologies

TC389QP160F300SADLXUMA1

Infineon Technologies

MICROCONTROLLER; Terminal Form: BALL; No. of Terminals: 516; Package Code: FBGA; Package Shape: SQUARE; Width: 25 mm;

YES

ALSO AVAILABLE WITH 5 V NOMINAL

0

32

160 MHz

NO

YES

0

S-PBGA-B516

e2

25 mm

3

516

8

YES

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

FLASH

1.75 mm

300 rpm

3.63 V

2.97 V

3.3 V

YES

CMOS

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

TC399XP256F300SBCKXUMA1 by Infineon Technologies

TC399XP256F300SBCKXUMA1

Infineon Technologies

Infineon's TC399XP256F300SBCKXUMA1 is a 32-bit microcontroller with 516 terminals, operating at up to 160 MHz. Designed for automotive applications, it features ISO 26262 screening, ADC and DMA channels, and Flash ROM programmability.

YES

0

32

160 MHz

NO

YES

0

S-PBGA-B516

25 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

FLASH

ISO 26262

1.7 mm

300 rpm

3.63 V

2.97 V

3.3 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

TC399XP256F300SBCLXUMA1 by Infineon Technologies

TC399XP256F300SBCLXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: LFBGA; Package Shape: SQUARE;

YES

0

32

160 MHz

NO

YES

0

S-PBGA-B516

e2

25 mm

3

516

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

FLASH

ISO 26262

1.7 mm

300 rpm

3.63 V

2.97 V

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

TC399XX256F300SBCKXUMA1 by Infineon Technologies

TC399XX256F300SBCKXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: LFBGA; Package Shape: SQUARE;

YES

0

32

160 MHz

NO

YES

0

S-PBGA-B516

25 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

FLASH

ISO 26262

1.7 mm

300 rpm

3.63 V

2.97 V

3.3 V

YES

CMOS

AUTOMOTIVE

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

TC399XX256F300SBCLXUMA1 by Infineon Technologies

TC399XX256F300SBCLXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: LFBGA; Package Shape: SQUARE;

YES

0

32

160 MHz

NO

YES

0

S-PBGA-B516

e2

25 mm

3

516

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

FLASH

ISO 26262

1.7 mm

300 rpm

3.63 V

2.97 V

3.3 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

SPC5673FK0MVY2 by NXP Semiconductors

SPC5673FK0MVY2

NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;

YES

0

32

40 MHz

NO

YES

0

S-PBGA-B516

e2

27 mm

3

516

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

FLASH

2.55 mm

200 rpm

1.32 V

1.14 V

1.2 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

1 mm

BOTTOM

40

27 mm

MICROCONTROLLER, RISC

TC399XX256F300SBDKXUMA1 by Infineon Technologies

TC399XX256F300SBDKXUMA1

Infineon Technologies

Infineon's TC399XX256F300SBDKXUMA1 microcontroller features 32-bit architecture, 24-bit address bus, and 8-bit data RAM. Ideal for automotive applications with CAN connectivity, it operates at up to 40 MHz clock frequency and offers low power mode. With integrated cache and extensive peripherals like DMA(128) and TIMER(9), this CMOS technology-based chip is suitable for demanding automotive systems.

YES

ASCLIN(12), FLEXRAY(2), HSSLL(2), MSC(4), PSI5(4), PSI5S, SENT(25)

24

32

YES

TC39

40 MHz

NO

YES

32

FLOATING-POINT

YES

S-PBGA-B516

e2

25 mm

YES

3

128

12

516

9

8

8

125 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

BGA516,30X30,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

7077888

16777216

FLASH

AEC-Q100

1.7 mm

300 rpm

300 mA

1.375 V

1.125 V

1.25 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

1179648

CAN(12), ETHERNET, I2C(2), I2S, MMC, SD QSPI(6)

DMA(128), POR, TIMER(9), WDT

TC399XX256F300SBDLXUMA1 by Infineon Technologies

TC399XX256F300SBDLXUMA1

Infineon Technologies

MICROCONTROLLER; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 516; Package Code: LFBGA; Package Shape: SQUARE;

YES

24

32

YES

TC39

40 MHz

NO

YES

32

FLOATING-POINT

YES

S-PBGA-B516

e2

25 mm

YES

3

128

0

275

12

516

9

8

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

BGA516,30X30,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

917504

16777216

FLASH

AEC-Q100

1.7 mm

300 rpm

835 mA

1.375 V

1.125 V

1.25 V

YES

CMOS

AUTOMOTIVE

TIN SILVER

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

1179648

CAN(12), ETHERNET, I2C(2), SDMMC, QSPI(6)

DMA(128), POR, TIMER(9), WDT

SAL-TC299TP-128F300NBC by Infineon Technologies

SAL-TC299TP-128F300NBC

Infineon Technologies

MICROCONTROLLER; Terminal Form: BALL; No. of Terminals: 516; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage: 1.3 V;

YES

32

YES

TC29X

40 MHz

NO

YES

FLOATING-POINT

YES

S-PBGA-B516

e4

25 mm

YES

3

128

516

3

8

8

150 Cel

-40 Cel

YES

PLASTIC/EPOXY

LFBGA

BGA516,30X30,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

745472

8388608

FLASH

ISO 26262

1.7 mm

300 rpm

290 mA

1.43 V

1.235 V

1.3 V

YES

CMOS

NICKEL GOLD

BALL

.8 mm

BOTTOM

25 mm

MICROCONTROLLER

131072

ASCLIN(4), CAN(6), I2C(2), I2S, LIN(6), PSI5(5), PSI5S, SPI,(4), QSPI(5)

DMA(128), POR, RTC, TIMER(3), WDT

94-Ch 12-Bit