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TC399XP256F300SBCKXUMA1

Infineon Technologies

TC399XP256F300SBCKXUMA1 by Infineon Technologies

Infineon's TC399XP256F300SBCKXUMA1 is a 32-bit microcontroller with 516 terminals, operating at up to 160 MHz. Designed for automotive applications, it features ISO 26262 screening, ADC and DMA channels, and Flash ROM programmability.

Median Price

$226.137

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 79 parts In-Stock

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$226.137

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Vyrian

USA . 6,284 parts In-Stock

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Digiode

USA . 677 parts In-Stock

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AZTECH Wire

Italy . 240 parts In-Stock

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$10.455

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240

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Ampacity Inc.

Singapore . 179 parts In-Stock

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$15.000

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179

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Modulus Dynamics

Lithuania . 4,026 parts In-Stock

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$67.210

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$64.522

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$61.833

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4,026

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Component Stockers USA

USA . 419 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 4,032 parts In-Stock

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$226.137

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$221.615

4,032

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$221.615

Netroflash

USA . 50 parts In-Stock

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$226.137

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$221.615

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50

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Argo Parts USA

USA . 3,806 parts In-Stock

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Microchip USA

USA . 256 parts In-Stock

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Corphita

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Overview

Unleash the power of cutting-edge technology with the TC399XP256F300SBCKXUMA1 microcontroller by Infineon Technologies. This high-quality product offers unmatched performance and reliability, making it the perfect solution for a wide range of applications in the automotive industry. With its advanced features and innovative design, this microcontroller provides customers with unparalleled value, efficiency, and flexibility. Upgrade your projects today with the TC399XP256F300SBCKXUMA1 and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 3.63 V

Allows for a wide range of input voltages, making it versatile for different applications.

Bit Size: 32

Offers high performance and processing capabilities, suitable for handling complex tasks.

No. of Terminals: 516

Provides ample connectivity options for interfacing with other components and peripherals.

Maximum Clock Frequency: 160 MHz

Enables fast execution of instructions and operations, improving overall efficiency.

Peripheral IC Type: MICROCONTROLLER

Specifically designed for microcontroller applications, ensuring optimized performance and compatibility.

Technical Specifications

Microcontrollers TC399XP256F300SBCKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

160 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B516

Length:

25 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Maximum Seated Height:

1.7 mm

Speed:

300 rpm

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TC399XP256F300SBCKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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