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TC397XA256F300SBDKXUMA1

Infineon Technologies

TC397XA256F300SBDKXUMA1 by Infineon Technologies

Infineon's TC397XA256F300SBDKXUMA1 is a 32-bit microcontroller with 8-bit RAM, ISO 26262 compliant for automotive applications. Features include 3 timers, CAN, HSSL, I2C connectivity, and 12 ADC channels. Operates b/w -40 to 125°C with 3.3V supply voltage.

Median Price

$72.675

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$80.750

1k+ parts

$72.250

10k+ parts

$68.000

2,000

-

$80.750

$72.250

$68.000

Rochester

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$64.600

1k+ parts

$57.800

10k+ parts

$54.400

2,000

-

$64.600

$57.800

$54.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 746 parts In-Stock

1+ parts

$68.352

100+ parts

-

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746

$68.352

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-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$196.229

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150

$196.229

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Vyrian

USA . 4,290 parts In-Stock

1+ parts

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4,290

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Cyclops Electronics Ltd

UK . 4,000 parts In-Stock

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Rutronik

Germany . 2,000 parts In-Stock

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$64.450

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$64.450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 53 parts In-Stock

1+ parts

$8.260

100+ parts

-

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53

$8.260

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$30.455

100+ parts

$27.714

1k+ parts

$24.973

10k+ parts

-

500

$30.455

$27.714

$24.973

-

Corohmni

South Africa . 239 parts In-Stock

1+ parts

$35.615

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239

$35.615

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Aztec Data Supply Inc.

USA . 2,691 parts In-Stock

1+ parts

$57.090

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2,691

$57.090

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Semicontronic

India . 400 parts In-Stock

1+ parts

$61.160

100+ parts

$59.631

1k+ parts

$59.325

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400

$61.160

$59.631

$59.325

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Ampacity Inc.

Singapore . 336 parts In-Stock

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$61.160

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336

$61.160

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Modulus Dynamics

Lithuania . 1,825 parts In-Stock

1+ parts

$62.087

100+ parts

$59.604

1k+ parts

$57.120

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1,825

$62.087

$59.604

$57.120

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Corphita

USA . 28 parts In-Stock

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$64.755

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$64.755

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Continental Prestige Electronics

USA . 6,772 parts In-Stock

1+ parts

$196.229

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$192.305

6,772

$196.229

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$192.305

QUARKTWIN TECHNOLOGY LTD

USA . 12,010 parts In-Stock

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Argo Parts USA

USA . 4,699 parts In-Stock

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4,699

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Microchip USA

USA . 3,542 parts In-Stock

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

1+ parts

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$192.305

1k+ parts

$186.418

10k+ parts

$182.493

100

-

$192.305

$186.418

$182.493

Overview

Unlock the power of cutting-edge technology with the TC397XA256F300SBDKXUMA1 by Infineon Technologies. As a leader in the microcontroller industry, Infineon delivers top-quality products that exceed expectations. Ideal for a wide range of applications, this microcontroller offers unmatched performance and reliability. With features like ISO 26262 screening level, 32-bit architecture, and a plethora of peripherals, customers can trust in the value, benefits, and advantages that the TC397XA256F300SBDKXUMA1 brings to their projects. Elevate your designs with confidence using this exceptional microcontroller from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Ease of installation and space-saving design for compact devices.

On Chip Data RAM Width: 8

Efficient data processing and storage capabilities.

Screening Level: ISO 26262

Higher reliability and safety standards compliance for critical applications.

Bit Size: 32

High processing power and capacity for complex tasks.

No. of Terminals: 292

Sufficient connectivity options for various peripherals and external devices.

Maximum Operating Temperature: 125 °C

Reliable performance in harsh environmental conditions.

CPU Family: TC397

Specifically designed for optimized performance in various applications.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments.

ADC Channels: YES

Analog-to-digital conversion capabilities for sensor interfacing.

DMA Channels: YES

Efficient data transfer and processing with Direct Memory Access support.

Peripheral IC Type: MICROCONTROLLER

Centralized control and management of connected peripherals.

Technology: CMOS

Low power consumption and high integration for energy-efficient designs.

Nominal Supply Voltage: 3.3 V

Standard voltage compatibility for easy integration into existing systems.

PWM Channels: YES

Precise control of pulse-width modulation signals for motor and power management.

Connectivity: CAN(12), HSSL(2), I2C(2), MSC(4), PSI(6), QSPI(4)

Versatile communication options for connecting to various devices and networks.

ROM Programmability: FLASH

Flexible and reprogrammable memory for easy updates and customization.

Speed: 300 rpm

High processing speed for quick response times in real-time applications.

Technical Specifications

Microcontrollers TC397XA256F300SBDKXUMA1 attributes and parameters. Explore more Microcontrollers devices from Infineon Technologies

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATE AT 5V SUPPLY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

NO

CPU Family:

TC397

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PBGA-B292

JESD-609 Code:

e2

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

128

No. of Terminals:

292

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RAM Bytes:

7077888

ROM Words:

16777216

ROM Programmability:

FLASH

Screening Level:

ISO 26262

Speed:

300 rpm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Position:

BOTTOM

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(12), HSSL(2), I2C(2), MSC(4), PSI(6), QSPI(4)

Peripherals:

TIMER(8)

Trade Compliance

TC397XA256F300SBDKXUMA1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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